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STM8L151K3U3

STMicroelectronics

STM8L151K3U3 by STMicroelectronics

STM8L151K3U3 by STMicroelectronics is an 8-bit microcontroller with 32 terminals, operating at a max frequency of 16 MHz. It features 1024 bytes of RAM, 256 bytes of data EEPROM, and 23-channel 12-bit ADC for automotive applications. With connectivity options like I2C, SPI, and USART, it offers versatile peripheral support including BOD, DMA(5), RTC, and timers(6).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,282 parts In-Stock

1+ parts

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8,282

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Digiode

USA . 1,319 parts In-Stock

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1,319

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Anansix

USA . 674 parts In-Stock

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674

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Distributors (Availability)

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Vigor

Singapore . 4,520 parts In-Stock

1+ parts

$1.070

100+ parts

-

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4,520

$1.070

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Microchip USA

USA . 4,913 parts In-Stock

1+ parts

$9.320

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4,913

$9.320

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AZTECH Wire

Italy . 822 parts In-Stock

1+ parts

$10.100

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822

$10.100

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IDEA Electronic Components Group

UK . 1,914 parts In-Stock

1+ parts

$69.045

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-

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$62.141

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1,914

$69.045

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$62.141

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MKK Technologies

India . 2,245 parts In-Stock

1+ parts

$129.835

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2,245

$129.835

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DigiPath Technology Company

USA . 2,245 parts In-Stock

1+ parts

$129.835

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2,245

$129.835

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Corphita

USA . 1,709 parts In-Stock

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1,709

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Parana Technologies

USA . 117 parts In-Stock

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$82.554

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117

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$82.554

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Overview

Unlock the power of innovation with the STM8L151K3U3 microcontroller by STMicroelectronics. Designed with precision and expertise, this device is set to revolutionize the industry with its cutting-edge technology. Ideal for automotive applications, this microcontroller boasts a wide range of features including ADC channels, DMA capabilities, and PWM channels. With a maximum clock frequency of 16 MHz and a low supply current of 4.88 mA, it offers unparalleled performance and efficiency. Experience seamless connectivity with I2C, SPI, and USART interfaces, making it the perfect choice for your next project. Elevate your designs with the STM8L151K3U3 microcontroller - where quality meets innovation.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package allows for easy and efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power requirements and compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape enables compact and space-saving designs in electronic applications.

Bit Size: 8

8-bit architecture provides cost-effective and efficient processing for a variety of applications.

Power Supplies (V): 2/3.3

Supports multiple power supply options for versatility in different applications.

No. of Terminals: 32

Sufficient number of terminals for connectivity and interfacing with external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles offer flexibility in mounting options and heat dissipation capabilities.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for energy-efficient operation and extends battery life.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environmental conditions.

CPU Family: STM8

STM8 architecture provides fast and efficient processing for embedded applications.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature supports use in extreme temperature conditions.

ADC Channels: YES

Integrated ADC channels enable analog signal processing for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels improve data transfer speed and efficiency for high-performance applications.

Terminal Position: QUAD

Quad terminal position facilitates easy board layout and component placement.

ROM Words: 8192

Ample ROM size for storing program code and data in embedded systems.

Maximum Seated Height: 0.6 mm

Low seated height profile enables slim and compact device designs.

Width: 5 mm

Narrow width allows for space-efficient PCB layout in compact electronic devices.

Data EEPROM Size: 256

Sufficient EEPROM size for non-volatile data storage in embedded applications.

Peripherals: BOD, COMPARATOR(2), DMA(5), POR, RTC, TIMER(6)

Rich set of peripherals for enhanced functionality and connectivity in embedded designs.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing and real-time operation in time-critical applications.

Length: 5 mm

Compact length for space-saving PCB layout and efficient device integration.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature specification ensures reliable operation in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller design for efficient processing and resource management.

RAM Bytes: 1024

Adequate RAM size for data storage and manipulation in real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: NO LEAD

No-lead terminal form for easy surface mount assembly and reliable electrical connections.

Analog To Digital Convertors: 23-Ch 12-Bit

Multiple ADC channels with high resolution for accurate analog signal conversion in sensor applications.

Maximum Supply Current: 4.88 mA

Low supply current for energy-efficient operation and extended battery life.

Nominal Supply Voltage: 3 V

Standard nominal supply voltage for compatibility with common power sources.

PWM Channels: YES

PWM channels for generating precise pulse-width modulation signals for motor control and power management.

Connectivity: I2C, SPI, USART

Multiple connectivity options for interfacing with external devices and communication protocols.

ROM Programmability: FLASH

Flash ROM programmability for easy and flexible firmware updates in embedded systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density board layout and compact designs.

Speed: 16 rpm

High processing speed for responsive operation in real-time applications.

On Chip Program ROM Width: 8

On-chip ROM width of 8 bits for efficient program storage and retrieval.

No. of I/O Lines: 26

Adequate number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM8L151K3U3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of I/O Lines:

26

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.88 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C, SPI, USART

Peripherals:

BOD, COMPARATOR(2), DMA(5), POR, RTC, TIMER(6)

Analog To Digital Convertors:

23-Ch 12-Bit

Trade Compliance

STM8L151K3U3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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