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STM8L151C4T3

STMicroelectronics

STM8L151C4T3 by STMicroelectronics

STM8L151C4T3 from STMicroelectronics is an 8-bit microcontroller ideal for automotive applications, featuring a max supply voltage of 3.6V and operating temp range of -40 °C to 125°C. It includes 25 ADC channels and supports I2C/SPI connectivity. With low power consumption and a compact design, it's perfect for efficient embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,827 parts In-Stock

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7,827

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Anansix

USA . 1,877 parts In-Stock

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1,877

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Digiode

USA . 1,722 parts In-Stock

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1,722

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Distributors (Availability)

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Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$1.360

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2,000

$1.360

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Microchip USA

USA . 4,028 parts In-Stock

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$11.776

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4,028

$11.776

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AZTECH Wire

Italy . 385 parts In-Stock

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$12.930

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385

$12.930

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IDEA Electronic Components Group

UK . 2,095 parts In-Stock

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$26.865

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$24.178

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2,095

$26.865

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$24.178

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Component Stockers USA

USA . 1,227 parts In-Stock

1+ parts

$29.380

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1,227

$29.380

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MKK Technologies

India . 809 parts In-Stock

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$50.518

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809

$50.518

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DigiPath Technology Company

USA . 809 parts In-Stock

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$50.518

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809

$50.518

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Corphita

USA . 2,591 parts In-Stock

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2,591

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Parana Technologies

USA . 510 parts In-Stock

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$32.121

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510

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$32.121

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Overview

Unlock the potential of your projects with the STM8L151C4T3 microcontroller from STMicroelectronics, a leader in innovation and quality. Engineered for versatility, this low-power solution excels in automotive applications and consumer electronics, offering robust performance with advanced peripherals. Enjoy reduced power consumption without sacrificing capabilities, making it ideal for energy-efficient designs. Elevate your product's reliability and sophistication—experience the STMicroelectronics advantage!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V enables compatibility with a wide range of low-voltage systems.

Package Shape: SQUARE

The square package shape is optimal for efficient PCB layout and space savings.

Bit Size: 8

An 8-bit architecture is suited for simple control applications, offering a balance of performance and design complexity.

DAC Channels: YES

Having DAC channels enhances the microcontroller's ability to output analog signals, making it suitable for audio and signal processing applications.

Power Supplies (V): 1.8/3.3

Dual supply voltage options provide versatility in power management and compatibility with various circuits.

No. of Terminals: 48

A higher number of terminals allows for greater connectivity options, supporting more complex projects.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style ensures a low profile which is ideal for space-constrained applications.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage enhances energy efficiency, making it suitable for battery-operated devices.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliable operation in demanding environments, including automotive applications.

CPU Family: ST8

The ST8 CPU family provides efficient performance for embedded control tasks.

Minimum Operating Temperature: -40 °C

Withstanding extreme temperatures expands the microcontroller's usability in harsh conditions.

ADC Channels: YES

The presence of ADC channels enhances the ability to process and convert analog inputs, making it versatile for various sensors.

DMA Channels: YES

DMA channels allow for efficient data handling, improving performance by enabling peripherals to communicate without CPU intervention.

Terminal Position: QUAD

Quad terminal positioning facilitates easy mounting and soldering, enhancing board design flexibility.

ROM Words: 16384

A substantial amount of ROM allows for complex programs or multiple applications to reside on the microcontroller.

Maximum Seated Height: 1.6 mm

The low height optimizes the design for compact electronic systems.

Digital To Analog Convertors: 1-Ch 12-Bit

A 12-bit DAC ensures high-resolution analog output for precise applications.

Width: 7 mm

The compact width is advantageous for space-limited placements on PCBs.

Data EEPROM Size: 1K

The 1K EEPROM provides enough storage for configuration data and user settings.

Peripherals: BOD, COMPARATOR(2), DMA(4), POR, RTC, TIMER(7)

A rich set of peripherals enhances functionality, enabling complex applications like real-time monitoring and control.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz offers a good speed for performing tasks efficiently in various applications.

Length: 7 mm

The equally compact length complements the width, providing an overall small form factor.

Temperature Grade: AUTOMOTIVE

Automotive grade components guarantee reliability in vehicles, meeting stringent safety and quality standards.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture promotes energy-efficient operation and faster instruction execution.

RAM Bytes: 2048

Sufficient RAM size allows for better program execution and data handling.

Technology: CMOS

CMOS technology supports low power consumption, making it ideal for battery-operated or energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and ensure strong mechanical connections on PCBs.

Analog To Digital Convertors: 25-Ch 12-Bit

Having 25 analog input channels makes it suitable for applications that require multiple sensor inputs.

Maximum Supply Current: 80 mA

An 80 mA maximum supply current is manageable for most low-power applications.

Nominal Supply Voltage: 3 V

A nominal 3 V supply voltage helps maintain efficiency and compatibility with a wide range of components.

PWM Channels: YES

PWM channels enable motor control and dimming applications, adding versatility to this microcontroller.

Connectivity: I2C, IRDA, SPI, USART

Diverse connectivity options allow the microcontroller to communicate with a wide variety of devices and protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware.

Terminal Pitch: 0.5 mm

The fine terminal pitch is conducive for high-density PCB layouts, maximizing the use of available space.

Moisture Sensitivity Level (MSL): 3

MSL 3 ensures that proper handling precautions can be taken, providing peace of mind for manufacturers.

Speed: 16 rpm

A speed specification of 16 rpm indicates suitability for various low-speed applications such as motor control.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient processing for simpler embedded applications.

No. of I/O Lines: 41

41 I/O lines provide extensive interfacing options for sensors, actuators, and other peripherals, enhancing application flexibility.

Technical Specifications

Microcontrollers STM8L151C4T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, IRDA, SPI, USART

Peripherals:

BOD, COMPARATOR(2), DMA(4), POR, RTC, TIMER(7)

Analog To Digital Convertors:

25-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8L151C4T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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