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STM8L101K3T6TR

STMicroelectronics

STM8L101K3T6TR by STMicroelectronics

STM8L101K3T6TR from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates in -40 °C to 85°C. It features 32 terminals, 5 timers, and supports I2C/SPI/USART connectivity. Ideal for industrial applications requiring low power consumption and compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,645 parts In-Stock

1+ parts

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11,645

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Digiode

USA . 4,204 parts In-Stock

1+ parts

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1k+ parts

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4,204

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Anansix

USA . 2,715 parts In-Stock

1+ parts

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2,715

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,584 parts In-Stock

1+ parts

$0.840

100+ parts

-

1k+ parts

-

10k+ parts

-

2,584

$0.840

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Microchip USA

USA . 4,737 parts In-Stock

1+ parts

$7.029

100+ parts

-

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4,737

$7.029

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AZTECH Wire

Italy . 1,067 parts In-Stock

1+ parts

$17.290

100+ parts

-

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1,067

$17.290

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Ampacity Inc.

Singapore . 358 parts In-Stock

1+ parts

$28.000

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358

$28.000

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IDEA Electronic Components Group

UK . 700 parts In-Stock

1+ parts

$61.161

100+ parts

-

1k+ parts

$55.045

10k+ parts

-

700

$61.161

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$55.045

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MKK Technologies

India . 994 parts In-Stock

1+ parts

$115.009

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994

$115.009

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DigiPath Technology Company

USA . 994 parts In-Stock

1+ parts

$115.009

100+ parts

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994

$115.009

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Parana Technologies

USA . 1,768 parts In-Stock

1+ parts

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100+ parts

$73.127

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1,768

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$73.127

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Corphita

USA . 1,326 parts In-Stock

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1,326

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Overview

Elevate your designs with the STM8L101K3T6TR microcontroller from STMicroelectronics, a leader renowned for quality and innovation. This low-power, compact solution is perfect for industrial applications, enabling seamless connectivity and efficient performance in diverse environments. With robust features, reliability, and impressive temperature resilience, it empowers you to create smarter, energy-efficient devices that stand out in today's competitive market. Experience unmatched value and benefits with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material enhances reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount design allows for easier integration into compact circuits, saving space on PCBs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can operate in low-voltage systems, improving energy efficiency.

Package Shape: SQUARE

The square package shape allows for flexible layout options on PCB designs.

Bit Size: 8

An 8-bit architecture is often sufficient for simple control applications, reducing complexity and cost.

Power Supplies (V): 1.8/3.3

Dual voltage compatibility allows for compatibility with a variety of power systems.

No. of Terminals: 32

A 32-terminal configuration provides ample connectivity options for interfacing with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design is ideal for space-constrained applications and high-density mounting.

Minimum Supply Voltage: 1.65 V

Operating at a low minimum supply voltage increases design flexibility for battery-operated devices.

Maximum Operating Temperature: 85 °C

A high operating temperature rating ensures reliability in demanding environments.

CPU Family: STM8

The STM8 family is well-regarded for its performance and rich feature set, ensuring robust processing capabilities.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme temperatures makes it suitable for industrial and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and increases overall reliability of the connections.

Terminal Position: QUAD

Quad terminal positioning enhances the ease of routing on PCBs and reduces layout space.

ROM Words: 8192

A generous ROM capacity allows for the storage of larger programs, enabling complexity in applications.

Maximum Seated Height: 1.6 mm

Compact seated height allows for a slimmer profile in device designs.

Width: 7 mm

A standard width aids in compatibility with various existing PCB designs and layouts.

Peripherals: COMPARATOR(2), POR, TIMER(5)

A rich set of integrated peripherals enables comprehensive functionality without the need for additional components.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz provides adequate performance for a wide array of control applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time supports efficient manufacturing processes during assembly.

Peak Reflow Temperature °C: 235

A high peak reflow temperature is compatible with current soldering technologies, ensuring quality assembly.

Length: 7 mm

A compact length facilitates use in space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees performance and reliability in demanding settings.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for efficient processing, making it ideal for various embedded systems.

No. of Timers: 5

Multiple timers provide flexibility for scheduling tasks, PWM generation, and time-sensitive operations.

RAM Bytes: 1536

With 1536 bytes of RAM, it accommodates more complex algorithms and data handling capabilities.

Technology: CMOS

CMOS technology enhances power efficiency, vital for battery-powered and low-energy applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve reliability on PCBs.

Maximum Supply Current: 3.5 mA

Low maximum supply current increases battery life in portable applications.

Nominal Supply Voltage: 3 V

Standard 3V power supply is widely available and supports easy integration into existing designs.

PWM Channels: YES

The inclusion of PWM channels allows for smooth control of motors and other devices requiring variable speed or voltage.

Connectivity: I2C, SPI, USART

Multiple communication interfaces ensure compatibility with a broad range of sensors and devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and changes to firmware, enhancing flexibility and adaptability.

Terminal Pitch: 0.8 mm

A 0.8 mm pitch facilitates high-density applications while maintaining serviceability.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates that proper handling and storage are necessary, ensuring component integrity.

Speed: 16 rpm

A speed of 16 rpm indicates adequate capability for various control applications, contributing to the product's versatility.

On Chip Program ROM Width: 8

An 8-width ROM facilitates the execution of simpler commands efficiently.

No. of I/O Lines: 30

30 I/O lines offer flexibility for connecting various peripherals and managing complex control tasks.

Technical Specifications

Microcontrollers STM8L101K3T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

32

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USART

Peripherals:

COMPARATOR(2), POR, TIMER(5)

Trade Compliance

STM8L101K3T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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