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STM8L101K3T3TR

STMicroelectronics

STM8L101K3T3TR by STMicroelectronics

STM8L101K3T3TR microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 3.6V, and supports I2C/SPI/USART connectivity. With a temp range of -40 °C to 125°C, it's ideal for automotive applications. It includes 5 timers and 8192 ROM words for versatile programming.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,014 parts In-Stock

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4,014

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Digiode

USA . 3,693 parts In-Stock

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3,693

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Anansix

USA . 406 parts In-Stock

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406

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Distributors (Availability)

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Vigor

Singapore . 3,000 parts In-Stock

1+ parts

$0.960

100+ parts

-

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3,000

$0.960

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Microchip USA

USA . 5,320 parts In-Stock

1+ parts

$8.084

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5,320

$8.084

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AZTECH Wire

Italy . 885 parts In-Stock

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$17.550

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885

$17.550

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Component Stockers USA

USA . 7,613 parts In-Stock

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$18.870

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7,613

$18.870

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IDEA Electronic Components Group

UK . 379 parts In-Stock

1+ parts

$56.718

100+ parts

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$51.046

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379

$56.718

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$51.046

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MKK Technologies

India . 1,122 parts In-Stock

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$106.654

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1,122

$106.654

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DigiPath Technology Company

USA . 1,122 parts In-Stock

1+ parts

$106.654

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1,122

$106.654

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GreenTree Electronics

Israel . 16,800 parts In-Stock

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16,800

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Eastek

USA . 12,000 parts In-Stock

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$1.600

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12,000

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$1.600

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Corphita

USA . 1,904 parts In-Stock

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1,904

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Parana Technologies

USA . 8 parts In-Stock

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$67.815

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8

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$67.815

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Overview

Unlock the full potential of your projects with the STM8L101K3T3TR microcontroller from STMicroelectronics! Renowned for its quality and reliability, this compact powerhouse operates efficiently in a range of applications, from automotive systems to smart home devices. With low power consumption and robust performance, it seamlessly integrates into your designs, offering unmatched versatility and scalability. Elevate your innovation—choose excellence with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures longevity and reliability in various operating environments.

Surface Mount: YES

Surface mount technology allows for smaller designs and efficient manufacturing processes.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6 V, making it suitable for low-power applications.

Package Shape: SQUARE

Square package shape facilitates efficient PCB layout and assembly.

Bit Size: 8

8-bit architecture ensures simplicity and effectiveness for many embedded applications.

Power Supplies (V): 1.8/3.3

Flexible power supply options allow compatibility with a variety of power sources.

No. of Terminals: 32

32 terminals provide ample I/O capability for diverse applications.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile design helps save space in compact electronic systems.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage increases the range of applications, especially in battery-operated devices.

Maximum Operating Temperature: 125 °C

Wide temperature range makes this microcontroller suitable for automotive and other harsh environments.

CPU Family: STM8

Familiar STM8 architecture provides robust performance and a wide ecosystem of support.

Minimum Operating Temperature: -40 °C

Supports extreme conditions, ensuring operation in demanding environments.

Terminal Finish: TIN

Tin terminal finish enhances solderability and corrosion resistance.

Terminal Position: QUAD

QUAD terminal position optimizes PCB space and contributes to better routing.

ROM Words: 8192

8KB of ROM allows significant program storage, supporting complex applications.

Maximum Seated Height: 1.6 mm

Low seated height contributes to slim designs in modern electronics.

Width: 7 mm

Compact width enables dense layouts within electronic devices.

Peripherals: COMPARATOR(2), POR, TIMER(5)

Built-in peripherals allow for versatile function execution and efficient task management.

Maximum Clock Frequency: 16 MHz

16 MHz clock frequency provides a balance of speed and power efficiency for general applications.

Length: 7 mm

Compact length further enhances the space-saving features of this microcontroller.

Temperature Grade: AUTOMOTIVE

Automotive-grade certification signifies reliability in vehicles and other critical systems.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing, ideal for embedded systems.

No. of Timers: 5

Five timers offer extensive timing and control functions for precise operations.

RAM Bytes: 1536

1536 bytes of RAM support data handling and temporary storage for applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining performance.

Terminal Form: GULL WING

Gull wing terminals provide effective connection to PCBs and are popular for surface mount devices.

Maximum Supply Current: 3.5 mA

Low supply current maximizes battery life in portable applications.

Nominal Supply Voltage: 3 V

Nominal 3V operation is ideal for a variety of applications, particularly in low-power designs.

PWM Channels: YES

PWM channels enable control of motors and other devices requiring precision output.

Connectivity: I2C, SPI, USART

Multiple connectivity options ensure compatibility with various sensors, displays, and other components.

ROM Programmability: FLASH

Flash ROM allows for easy updates and programmability of application software.

Terminal Pitch: 0.8 mm

0.8 mm terminal pitch is standard for compact designs and ensures ease of soldering.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, allowing for proper handling and storage.

Speed: 16 rpm

Efficient speed parameters make it suitable for applications requiring moderate processing capability.

On Chip Program ROM Width: 8

An 8-bit program ROM width aligns with the microcontroller's architecture, enhancing compatibility.

No. of I/O Lines: 30

30 I/O lines provide significant interfaces for sensors and actuators in embedded systems.

Technical Specifications

Microcontrollers STM8L101K3T3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

32

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USART

Peripherals:

COMPARATOR(2), POR, TIMER(5)

Trade Compliance

STM8L101K3T3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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