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STM8L101K3T3

STMicroelectronics

STM8L101K3T3 by STMicroelectronics

STM8L101K3T3 by STMicroelectronics is an 8-bit microcontroller with 8192 ROM words, 1536 RAM bytes, and 5 timers. It operates at a max clock frequency of 16 MHz and has peripherals like comparators, POR, and timers for automotive applications. With I2C, SPI, and USART connectivity options, it's suitable for low-power embedded systems requiring high performance.

Median Price

$4.800

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 4,800 parts In-Stock

1+ parts

$4.800

100+ parts

-

1k+ parts

-

10k+ parts

-

4,800

$4.800

-

-

-

Vyrian

USA . 6,397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,397

-

-

-

-

Chip Stock

USA . 4,012 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,012

-

-

-

-

Anansix

USA . 1,941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,941

-

-

-

-

Digiode

USA . 1,167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,167

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,068 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

2,068

$0.960

-

-

-

Microchip USA

USA . 2,414 parts In-Stock

1+ parts

$8.596

100+ parts

-

1k+ parts

-

10k+ parts

-

2,414

$8.596

-

-

-

AZTECH Wire

Italy . 949 parts In-Stock

1+ parts

$13.000

100+ parts

-

1k+ parts

-

10k+ parts

-

949

$13.000

-

-

-

IDEA Electronic Components Group

UK . 1,778 parts In-Stock

1+ parts

$74.208

100+ parts

-

1k+ parts

$66.787

10k+ parts

-

1,778

$74.208

-

$66.787

-

MKK Technologies

India . 896 parts In-Stock

1+ parts

$139.544

100+ parts

-

1k+ parts

-

10k+ parts

-

896

$139.544

-

-

-

DigiPath Technology Company

USA . 896 parts In-Stock

1+ parts

$139.544

100+ parts

-

1k+ parts

-

10k+ parts

-

896

$139.544

-

-

-

Lixinc

USA . 19,021 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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19,021

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-

-

-

Corphita

USA . 2,275 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,275

-

-

-

-

Parana Technologies

USA . 308 parts In-Stock

1+ parts

-

100+ parts

$88.727

1k+ parts

-

10k+ parts

-

308

-

$88.727

-

-

Overview

Unlock the power of advanced technology with the STM8L101K3T3 microcontroller from STMicroelectronics. Designed with precision and durability, this product offers a wide range of applications in various industries. With its compact package body material and high-performance capabilities, this microcontroller ensures seamless integration and optimal efficiency. Experience the reliability and innovation that only STMicroelectronics can provide, and elevate your projects to new heights with the STM8L101K3T3. Elevate your projects with cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy PCB assembly and space-saving design, making it ideal for compact electronic devices.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power input options, accommodating various power sources.

Package Shape: SQUARE

The square package shape makes it easier to align and mount the microcontroller on the PCB, ensuring proper placement.

Bit Size: 8

An 8-bit microcontroller is well-suited for simpler applications and can provide cost-effective solutions without unnecessary complexity.

Power Supplies (V): 1.8/3.3

The availability of both 1.8V and 3.3V power supplies allows for compatibility with a wide range of electronic components and systems.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack low profile package style helps in reducing overall height of the product, making it suitable for compact designs with space constraints.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage ensures efficient operation at lower power levels, enhancing energy efficiency of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller is suitable for use in a wide range of environmental conditions, including automotive applications.

CPU Family: STM8

Being part of the STM8 CPU family ensures compatibility with existing STM8-based systems and tools, facilitating easier integration and development.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation even in extreme cold environments, making it suitable for automotive and industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides good solderability and conductivity, ensuring a reliable electrical connection during PCB assembly.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and efficient processing capabilities, making it suitable for real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various operating conditions.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering during PCB assembly, ensuring long-term performance and durability.

Temperature Grade: AUTOMOTIVE

With automotive temperature grade certification, this microcontroller is designed to withstand harsh environmental conditions and is suitable for automotive applications.

Connectivity: I2C, SPI, USART

Support for multiple connectivity interfaces, including I2C, SPI, and USART, provides versatility in communication and interfacing with external devices.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization, enhancing the flexibility and adaptability of the microcontroller.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller is suitable for reflow soldering and has moderate sensitivity to moisture, ensuring reliable performance during assembly.

No. of I/O Lines: 30

Having 30 I/O lines provides ample interfacing options for connecting to external devices and peripherals, enabling versatile functionality and customization.

Technical Specifications

Microcontrollers STM8L101K3T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

32

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USART

Peripherals:

COMPARATOR(2), POR, TIMER(5)

Trade Compliance

STM8L101K3T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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