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STM8L101G3U6TR

STMicroelectronics

STM8L101G3U6TR by STMicroelectronics

STM8L101G3U6TR microcontroller from STMicroelectronics features an 8-bit architecture, operates at a max voltage of 3.6V, and includes 5 timers. With a wide temp range (-40 °C to 85°C) and low power consumption (max 3.5mA), it's ideal for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,960 parts In-Stock

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3,960

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Digiode

USA . 3,179 parts In-Stock

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3,179

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Anansix

USA . 2,392 parts In-Stock

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2,392

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Distributors (Availability)

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Vigor

Singapore . 3,305 parts In-Stock

1+ parts

$0.670

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-

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3,305

$0.670

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Microchip USA

USA . 5,492 parts In-Stock

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$6.404

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5,492

$6.404

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AZTECH Wire

Italy . 1,050 parts In-Stock

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$8.460

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1,050

$8.460

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IDEA Electronic Components Group

UK . 926 parts In-Stock

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$54.458

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$49.013

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926

$54.458

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$49.013

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MKK Technologies

India . 801 parts In-Stock

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$102.406

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801

$102.406

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DigiPath Technology Company

USA . 801 parts In-Stock

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$102.406

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801

$102.406

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QUARKTWIN TECHNOLOGY LTD

USA . 28,208 parts In-Stock

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Corphita

USA . 3,351 parts In-Stock

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3,351

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Parana Technologies

USA . 691 parts In-Stock

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$65.113

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691

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$65.113

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Overview

Unlock limitless possibilities with the STM8L101G3U6TR microcontroller from STMicroelectronics, a trusted leader in innovation. This compact powerhouse combines efficient performance with low power consumption, making it perfect for diverse applications—from smart home devices to industrial automation. Enhance your designs with its robust features while benefiting from ST's commitment to quality and support, ensuring your projects not only meet but exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration into various applications, making it ideal for space-constrained projects.

Maximum Supply Voltage: 3.6 V

This voltage range ensures compatibility with a variety of power sources while maintaining efficient power management.

Package Shape: SQUARE

The square package shape facilitates easy routing in PCB designs, enhancing layout flexibility.

Bit Size: 8

An 8-bit architecture is suited for simple applications, providing adequate processing power with lower energy consumption.

Power Supplies (V): 1.8/3.3

Dual voltage supply options enhance adaptability in different system environments.

No. of Terminals: 28

A sufficient number of terminals allow for versatile connectivity and functionality in various applications.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile of the chip carrier package makes it a good choice for compact and efficient designs.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage enhances flexibility in battery-operated devices and low-power applications.

Maximum Operating Temperature: 85 °C

High temperature tolerance ensures reliability in industrial environments and other harsher conditions.

CPU Family: STM8

Being part of the STM8 family ensures a well-supported ecosystem with a wide range of development tools.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures makes this microcontroller suitable for outdoor and extreme environment applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and resistance to corrosion, ensuring reliable connections.

Terminal Position: QUAD

The quad terminal position allows for effective routing and efficient use of PCB space.

ROM Words: 8192

With 8192 ROM words, ample memory is available to store program codes for a variety of applications.

Maximum Seated Height: 0.6 mm

The low seated height contributes to space-saving designs, ideal for modern, compact electronic devices.

Width: 4 mm

The 4 mm width allows for efficient placement in tight circuit layouts.

Peripherals: COMPARATOR(2), POR, TIMER(5)

Diverse peripheral support enhances functionality, allowing for a wide range of application-specific implementations.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz ensures sufficient processing speed for various tasks without excessive power consumption.

Maximum Time At Peak Reflow Temperature (s): 40

This spec indicates good thermal capabilities during soldering processes, contributing to manufacturing reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperatures allow for compatibility with lead-free soldering processes, enhancing environmental compliance.

Length: 4 mm

The compact length in combination with its width makes it ideal for miniaturized circuit designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability in harsh environments, making it suitable for demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and efficiency, making it suitable for a range of applications.

No. of Timers: 5

Multiple timers allow for precise timing functions, improving the capability for real-time processing.

RAM Bytes: 1536

Adequate RAM allows for efficient data handling and storage during operation.

Technology: CMOS

CMOS technology ensures lower power consumption and higher efficiency, extending battery life in portable applications.

Terminal Form: NO LEAD

No lead terminal form enhances compatibility with various mounting techniques and contributes to environmental compliance.

Maximum Supply Current: 3.5 mA

Low supply current consumption ensures energy-efficient operation, extending battery life in portable devices.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V aligns with standard battery voltages, making it ideal for battery-powered applications.

PWM Channels: YES

Support for PWM channels enables efficient control of motors and various other peripherals.

Connectivity: I2C, SPI, USART

Rich connectivity options provide flexibility for integrating with various sensors and devices in a system.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the program, enhancing project scalability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch facilitates high-density designs, allowing for more connections in a compact layout.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring proper handling to ensure long-term reliability.

Speed: 16 rpm

A speed of 16 rpm makes it suitable for low-speed applications, ensuring precision in time-sensitive tasks.

On Chip Program ROM Width: 8

An 8-bit program ROM width contributes to compatibility with a wide range of software development tools.

No. of I/O Lines: 26

26 I/O lines offer ample interfacing options for various peripherals, enhancing overall functionality.

Technical Specifications

Microcontrollers STM8L101G3U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

28

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USART

Peripherals:

COMPARATOR(2), POR, TIMER(5)

Trade Compliance

STM8L101G3U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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