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STM8L101G2U6A

STMicroelectronics

STM8L101G2U6A by STMicroelectronics

STM8L101G2U6A from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates in -40 °C to 85°C. It features 4096 ROM words, 1536 RAM bytes, and supports I2C/SPI/USART connectivity. Ideal for industrial applications requiring low power consumption and compact design.

Median Price

$1.780

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 490 parts In-Stock

1+ parts

$1.780

100+ parts

$1.103

1k+ parts

$0.667

10k+ parts

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490

$1.780

$1.103

$0.667

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Vyrian

USA . 12,329 parts In-Stock

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12,329

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Digiode

USA . 4,521 parts In-Stock

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4,521

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Anansix

USA . 2,612 parts In-Stock

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2,612

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ACDS - Activité Composants Distribution Service

France . 490 parts In-Stock

1+ parts

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490

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Dan-Mar Components

USA . 490 parts In-Stock

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490

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,883 parts In-Stock

1+ parts

$0.610

100+ parts

-

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10k+ parts

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1,883

$0.610

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Microchip USA

USA . 3,940 parts In-Stock

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$5.934

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-

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3,940

$5.934

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Component Stockers USA

USA . 8,661 parts In-Stock

1+ parts

$10.780

100+ parts

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8,661

$10.780

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AZTECH Wire

Italy . 665 parts In-Stock

1+ parts

$12.820

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-

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665

$12.820

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IDEA Electronic Components Group

UK . 2,162 parts In-Stock

1+ parts

$33.691

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$30.322

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2,162

$33.691

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$30.322

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MKK Technologies

India . 484 parts In-Stock

1+ parts

$63.354

100+ parts

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484

$63.354

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DigiPath Technology Company

USA . 484 parts In-Stock

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$63.354

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484

$63.354

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QUARKTWIN TECHNOLOGY LTD

USA . 28,839 parts In-Stock

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28,839

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Corphita

USA . 4,291 parts In-Stock

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4,291

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Parana Technologies

USA . 2,278 parts In-Stock

1+ parts

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$40.283

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2,278

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$40.283

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Perfect Parts

USA . 543 parts In-Stock

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543

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Overview

Unlock the potential of your next project with the STM8L101G2U6A microcontroller from STMicroelectronics. Renowned for their quality and reliability, STMicroelectronics delivers this compact powerhouse designed for low-power applications without compromising performance. Ideal for IoT devices, wearables, and industrial automation, it boasts versatility and efficiency, ensuring seamless connectivity and control. Elevate your designs with a trusted partner committed to innovation and excellence!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for a compact design, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The 3.6 V maximum supply voltage provides flexibility in power supply options, ensuring compatibility with various systems.

Package Shape: SQUARE

The square package shape aids in uniform thermal distribution and easy integration into circuit designs.

Bit Size: 8

An 8-bit architecture is ideal for low-power applications, providing efficient processing for simple control tasks.

Power Supplies (V): 1.8/3.3

Supports a range of power supply voltages, allowing it to adapt to different power management strategies.

No. of Terminals: 28

With 28 terminals, this microcontroller can support a variety of peripherals and I/O configurations, enhancing its versatility.

Package Style: CHIP CARRIER, VERY THIN PROFILE

The very thin profile package enables it to be used in low-profile applications, maintaining a sleek design.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage allows for operation in energy-sensitive applications, improving overall efficiency.

Maximum Operating Temperature: 85 °C

Designed for high operating temperatures, making it suitable for industrial environments where heat dissipation is a concern.

CPU Family: STM8

The STM8 CPU family is well-regarded for its performance and reliability, enhancing system performance in microcontroller applications.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures reliable operation in extreme conditions, suitable for automotive and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Robust terminal finishing helps maintain connection integrity and prevents corrosion, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal positioning allows for efficient layout and connections, reducing routing complexity on PCBs.

ROM Words: 4096

4KB of ROM provides sufficient space for program storage, enabling moderately complex applications.

Maximum Seated Height: 0.6 mm

The low seated height is advantageous for designs requiring a low-profile footprint.

Width: 4 mm

Compact width allows for easy placement in tight spaces, enhancing design flexibility.

Peripherals: COMPARATOR(2), POR, TIMER(5)

Integrated peripherals such as comparators and timers support a variety of control and monitoring applications.

Maximum Clock Frequency: 16 MHz

With a clock speed of 16 MHz, it supports efficient processing for real-time applications.

Maximum Time At Peak Reflow Temperature: 30s

Optimized reflow time is crucial for reliable soldering processes during assembly.

Peak Reflow Temperature: 260 °C

Supports high soldering temperatures, improving compatibility with modern SMT assembly processes.

Length: 4 mm

The compact length allows for a minimal footprint, making it ideal for small form factor devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the device can operate reliably in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and power efficiency, which is ideal for battery-operated devices.

No. of Timers: 5

Multiple timers enhance functionality in applications requiring precise timing and control.

RAM Bytes: 1536

With 1.5KB of RAM, the microcontroller can handle moderate data processing needs effectively.

Technology: CMOS

CMOS technology supports low power consumption, enabling battery-efficient designs.

Terminal Form: NO LEAD

No lead design helps in reducing footprint and simplifies assembly while ensuring reliable connections.

Maximum Supply Current: 3.5 mA

Low supply current ensures extended operation time for battery-powered devices, making it energy-efficient.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V is common in many applications, making it convenient for designers.

PWM Channels: YES

The presence of PWM channels allows for advanced control techniques in motors and LED brightness applications.

Connectivity: I2C, SPI, USART

Versatile connectivity options enable integration with a wide range of devices and peripherals.

ROM Programmability: FLASH

FLASH programmability offers flexibility for update and modification of the application after deployment.

Terminal Pitch: 0.5 mm

The 0.5 mm pitch allows for higher density layouts, making it suitable for modern compact designs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate handling caution, aiding in better manufacturing processes.

Speed: 16 rpm

Moderate speed capability is suitable for various slow-to-moderate speed control applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for simple operation, reducing complexity in the programming model.

No. of I/O Lines: 26

26 I/O lines offer ample interfacing options for various sensors and actuators, enhancing application versatility.

Technical Specifications

Microcontrollers STM8L101G2U6A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

28

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USART

Peripherals:

COMPARATOR(2), POR, TIMER(5)

Trade Compliance

STM8L101G2U6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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