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STM8AL3LE88TCX

STMicroelectronics

STM8AL3LE88TCX by STMicroelectronics

STM8AL3LE88TCX from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 16 MHz. It features ADC, DMA, and PWM channels, making it ideal for embedded applications in consumer electronics. Its compact FLATPACK design ensures efficient space utilization.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,302 parts In-Stock

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4,302

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Vyrian

USA . 4,104 parts In-Stock

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4,104

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Anansix

USA . 1,096 parts In-Stock

1+ parts

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1,096

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,724 parts In-Stock

1+ parts

$2.100

100+ parts

-

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-

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1,724

$2.100

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Microchip USA

USA . 4,953 parts In-Stock

1+ parts

$18.551

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4,953

$18.551

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AZTECH Wire

Italy . 675 parts In-Stock

1+ parts

$20.420

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675

$20.420

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IDEA Electronic Components Group

UK . 1,663 parts In-Stock

1+ parts

$39.211

100+ parts

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$35.290

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1,663

$39.211

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$35.290

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MKK Technologies

India . 1,946 parts In-Stock

1+ parts

$73.734

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1,946

$73.734

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DigiPath Technology Company

USA . 1,946 parts In-Stock

1+ parts

$73.734

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1,946

$73.734

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Component Stockers USA

USA . 304 parts In-Stock

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$99.990

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304

$99.990

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Corphita

USA . 3,760 parts In-Stock

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3,760

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Parana Technologies

USA . 1,570 parts In-Stock

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100+ parts

$46.883

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1,570

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$46.883

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Overview

Unlock exceptional performance with the STM8AL3LE88TCX microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatility and efficiency, this low-power device excels in diverse applications, from consumer electronics to industrial automation. Its robust features ensure reliability while enabling faster development cycles, allowing you to bring captivating projects to life effortlessly. Elevate your designs with ST's quality assurance and support!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easy integration onto PCBs, helping to minimize space usage and enhance assembly efficiency.

Maximum Supply Voltage: 3.6 V

Operating up to 3.6 V makes this microcontroller suitable for a wide range of applications, ensuring compatibility with various power systems.

Package Shape: SQUARE

The square package shape simplifies PCB layout and enhances thermal performance, making it ideal for compact designs.

Bit Size: 8

An 8-bit architecture is efficient for simpler tasks and allows for reduced power consumption, making it good for low-power applications.

No. of Terminals: 48

With 48 terminals, it provides ample I/O options, enhancing versatility in connecting to sensors, actuators, and other peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This packaging style is ideal for modern compact electronics, providing a low profile that fits well in slim designs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage supports battery-operated devices, extending battery life in portable applications.

ADC Channels: YES

Built-in ADC channels allow for easy interfacing with analog sensors, making it suitable for sensor-monitoring applications.

DMA Channels: YES

DMA capabilities enhance data handling efficiency, freeing up CPU resources for other tasks and improving overall system performance.

Terminal Position: QUAD

The quad terminal position facilitates better contact with the PCB, improving reliability in electrical connections.

Width: 7 mm

A compact width supports space-constrained applications, enabling designers to fit more functionality in smaller areas.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, the microcontroller can handle a variety of tasks, ensuring responsive performance in real-time applications.

Length: 7 mm

A small length complements its width, making it ideal for compact projects where PCB real estate is limited.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, this device is optimized for embedded applications, providing robust performance for control tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-powered and sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form is popular for ease of soldering and makes it suitable for automated assembly lines.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V balances performance and power efficiency, ideal for modern electronic designs.

PWM Channels: YES

PWM channels enable control over motor speed and brightness in applications like robotics and LED lighting, enhancing functionality.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for denser layouts, maximizing available space on the PCB for reduced overall size.

Speed: 16 rpm

The 16 rpm speed rating indicates suitability for low-to-moderate motion control applications, such as in robotics or automation.

No. of I/O Lines: 41

With 41 I/O lines, this microcontroller supports extensive connectivity options, catering to complex interfacing requirements.

Technical Specifications

Microcontrollers STM8AL3LE88TCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

41

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AL3LE88TCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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