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STM8AL3L8ATCX

STMicroelectronics

STM8AL3L8ATCX by STMicroelectronics

STM8AL3L8ATCX microcontroller from STMicroelectronics features an 8-bit architecture, operates b/w 1.8V and 3.6V, and supports up to 16 MHz clock frequency. With 80 terminals and integrated ADC/DMA channels, it's ideal for compact applications. Its low-profile design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,141 parts In-Stock

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Digiode

USA . 1,799 parts In-Stock

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Anansix

USA . 1,482 parts In-Stock

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1,482

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Distributors (Availability)

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AZTECH Wire

Italy . 963 parts In-Stock

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$16.880

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963

$16.880

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Component Stockers USA

USA . 1,659 parts In-Stock

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$47.390

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IDEA Electronic Components Group

UK . 399 parts In-Stock

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$50.499

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$45.449

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399

$50.499

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MKK Technologies

India . 384 parts In-Stock

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$94.960

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384

$94.960

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DigiPath Technology Company

USA . 384 parts In-Stock

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$94.960

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384

$94.960

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QUARKTWIN TECHNOLOGY LTD

USA . 19,765 parts In-Stock

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Vigor

Singapore . 5,231 parts In-Stock

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Corphita

USA . 4,592 parts In-Stock

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Microchip USA

USA . 3,612 parts In-Stock

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Parana Technologies

USA . 1,046 parts In-Stock

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$60.379

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$60.379

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Overview

Unlock a world of innovation with the STM8AL3L8ATCX microcontroller from STMicroelectronics! Renowned for exceptional quality and reliability, this versatile device offers stellar performance in compact applications, making it perfect for consumer electronics, automation, and IoT solutions. Experience seamless integration with its low-profile design and rich feature set, empowering you to elevate your projects while minimizing energy consumption. Choose STM8AL3L8ATCX for unparalleled value and performance!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact designs and easier assembly, making it ideal for modern electronic applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is suitable for low-power applications, helping to extend battery life.

Package Shape: SQUARE

The square package shape facilitates easy placement on PCBs, maximizing layout efficiency and space utilization.

Bit Size: 8

An 8-bit architecture supports a wide range of applications, especially in cost-sensitive designs and simpler control systems.

No. of Terminals: 80

Having 80 terminals provides ample connectivity options for various peripherals and sensors, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design simplifies integration into various systems while ensuring minimal space occupation.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8 V allows operation with lower power sources, contributing to energy efficiency.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish offers reliable solderability while providing good corrosion resistance, enhancing durability.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to process analog signals, making it suitable for signal measurement applications.

DMA Channels: YES

DMA channels allow for efficient data handling and transfer, improving overall performance and freeing up CPU resources.

Terminal Position: QUAD

Quad terminal positioning enables efficient soldering and enhances the reliability of connections on the PCB.

Width: 14 mm

The 14 mm width is optimized for compact device designs, facilitating integration into space-constrained applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz enables sufficient processing power for a variety of tasks without consuming excessive power.

Peak Reflow Temperature: 260 C

A peak reflow temperature of 260 °C ensures compatibility with standard soldering processes, enhancing manufacturability.

Length: 14 mm

The 14 mm length, combined with its width, provides a compact form factor ideal for today's miniaturized electronic devices.

Peripheral IC Type: MICROCONTROLLER

Being a dedicated microcontroller, this chip can manage tasks from basic control to complex applications effectively.

Technology: CMOS

CMOS technology delivers low power consumption and high-speed performance, making this microcontroller efficient for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and ease of soldering, contributing to a robust electrical connection.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V optimizes power consumption, balancing performance and efficiency for various applications.

PWM Channels: YES

PWM channels facilitate control in applications like motor driving and LED dimming, adding flexibility to design options.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm strikes a balance between compactness and ease of soldering, suited for many PCB designs.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this microcontroller is moderately sensitive to moisture, requiring standard precautions during handling and storage.

Speed: 16 rpm

A speed rating of 16 rpm indicates suitability for low-speed applications, contributing to energy efficiency in specific use cases.

No. of I/O Lines: 68

68 I/O lines provide significant interfacing capabilities, allowing connection with a variety of external devices and sensors.

Technical Specifications

Microcontrollers STM8AL3L8ATCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

68

No. of Terminals:

80

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM8AL3L8ATCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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