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STM8AL3L68TAX

STMicroelectronics

STM8AL3L68TAX by STMicroelectronics

STM8AL3L68TAX microcontroller from STMicroelectronics features a 16 MHz CPU, 2048 bytes of RAM, and supports I2C/SPI/USART connectivity. With a supply voltage range of 1.65-3.6 V and operating temps from -40 °C to 85 °C, it's ideal for low-power applications. Its versatile peripherals include ADC/DAC channels and multiple timers for efficient control tasks.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,429 parts In-Stock

1+ parts

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4,429

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Anansix

USA . 1,969 parts In-Stock

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1,969

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Digiode

USA . 1,766 parts In-Stock

1+ parts

-

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1,766

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,881 parts In-Stock

1+ parts

$1.640

100+ parts

-

1k+ parts

-

10k+ parts

-

3,881

$1.640

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-

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Microchip USA

USA . 4,056 parts In-Stock

1+ parts

$14.034

100+ parts

-

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-

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-

4,056

$14.034

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-

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AZTECH Wire

Italy . 1,175 parts In-Stock

1+ parts

$18.270

100+ parts

-

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1,175

$18.270

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IDEA Electronic Components Group

UK . 1,966 parts In-Stock

1+ parts

$39.450

100+ parts

-

1k+ parts

$35.505

10k+ parts

-

1,966

$39.450

-

$35.505

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MKK Technologies

India . 1,037 parts In-Stock

1+ parts

$74.182

100+ parts

-

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1,037

$74.182

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DigiPath Technology Company

USA . 1,037 parts In-Stock

1+ parts

$74.182

100+ parts

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1,037

$74.182

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Corphita

USA . 3,440 parts In-Stock

1+ parts

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3,440

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Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

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$47.168

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-

10k+ parts

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1,380

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$47.168

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Overview

Unlock the power of innovation with the STM8AL3L68TAX microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, this advanced microcontroller excels in diverse applications—from automotive to industrial control. With low power consumption and robust performance, it empowers your designs with unmatched efficiency. Benefit from ST's industry-leading support and expertise, ensuring your projects thrive in every environment. Elevate your solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the microcontroller lightweight and resistant to environmental factors, enhancing durability.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs, saving space in compact applications.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage ensures compatibility with a range of power sources, optimizing flexibility in design.

On Chip Data RAM Width: 8

An 8-bit data RAM width is suitable for handling a variety of control and data processing tasks in embedded systems.

Package Shape: SQUARE

A square package shape aids in uniform thermal dissipation and stable mounting on the PCB.

Bit Size: 8

An 8-bit architecture is ideal for simple applications, making it effective for entry-level microcontroller tasks.

DAC Channels: YES

The inclusion of DAC channels allows for analog signal generation, which is crucial for audio and sensor applications.

No. of Terminals: 48

With 48 terminals, this microcontroller provides ample I/O options for interfacing with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design is suitable for modern, compact electronic devices while facilitating efficient soldering.

Minimum Supply Voltage: 1.65 V

The ability to operate at a low minimum supply voltage enhances energy efficiency and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in various industrial environments.

CPU Family: STM8

The STM8 family is well-documented and widely supported, ensuring accessibility for developers and extensive community resources.

No. of External Interrupts: 8

With 8 external interrupts, this microcontroller can effectively manage multiple events, enhancing responsiveness.

Minimum Operating Temperature: -40 °C

A wide operating temperature range allows this microcontroller to function effectively in harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances solderability and protects against corrosion, ensuring long-term reliability.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors, which is essential for data acquisition.

DMA Channels: YES

DMA channels allow for efficient data transfers, freeing up CPU resources for other processing tasks.

Terminal Position: QUAD

Quad terminal positioning provides flexibility in PCB layout, allowing for better space utilization.

ROM Words: 32768

A ROM size of 32KB allows for complex programs and firmware, making it suitable for a wide range of applications.

Maximum Seated Height: 1.6 mm

A low seated height reduces overall device profile, enabling more compact designs.

Digital To Analog Converters: 1-Ch 12-Bit

A 12-bit DAC provides high-resolution analog output, essential for accurate signal generation in various applications.

Width: 7 mm

The compact width contributes to minimizing the footprint in a design, supporting space-constrained applications.

Data EEPROM Size: 1K

1KB of EEPROM allows for storage of configuration data and other non-volatile information, enhancing functionality.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

The diverse range of peripherals enhances the microcontroller's capabilities, making it suitable for complex real-world applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for efficient processing of tasks, suitable for many embedded applications.

Peak Reflow Temperature °C: 260

A high peak reflow temperature ensures compatibility with modern solder processes and enhances assembly reliability.

Length: 7 mm

A compact length supports miniaturization in electronic devices, making integration easier.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for control applications, this microcontroller integrates processing and interface capabilities seamlessly.

No. of Timers: 5

Multiple timers enable precise timing operations and event scheduling, making it ideal for time-sensitive applications.

RAM Bytes: 2048

2KB of RAM provides sufficient memory for intermediate data processing, supporting more elaborate control algorithms.

Technology: CMOS

CMOS technology ensures low power consumption, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals provide easy soldering access and enhance PCB assembly efficiency.

Analog To Digital Converters: 25-Ch 12-Bit

A high number of ADC channels allows for simultaneous sampling of multiple analog inputs, improving data acquisition capabilities.

Maximum Supply Current: 4.9 mA

Low supply current aids energy conservation, making it suitable for embedded battery-powered applications.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V aligns with low-power designs, enhancing the suitability for energy-sensitive applications.

No. of DMA Channels: 4

Multiple DMA channels enhance the microcontroller’s ability to handle data efficiently, reducing CPU load.

PWM Channels: YES

The presence of PWM channels facilitates motor control and other applications requiring speed and brightness modulation.

Connectivity: I2C, SPI, USART

Multiple communication interfaces enhance versatility and interoperability with various devices.

ROM Programmability: FLASH

Flash programming allows for easy updates and changes to the firmware, providing flexibility in development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for higher component density, making it suitable for compact designs.

Format: FIXED POINT

The fixed-point format is suitable for applications where precision is necessary without floating-point overhead.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate level of moisture sensitivity, which is manageable in a controlled environment.

Speed: 16 rpm

Speed specifications indicate suitability for specific control applications like motors, enhancing the versatility of the microcontroller.

Low Power Mode: YES

The low power mode feature is valuable for battery-driven applications, ensuring minimal energy consumption when inactive.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports compact applications while providing sufficient capabilities for standard operations.

No. of I/O Lines: 41

41 I/O lines provide extensive interfacing options for peripherals, making this microcontroller fit for various applications.

Technical Specifications

Microcontrollers STM8AL3L68TAX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

8

No. of I/O Lines:

41

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

4.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

Analog To Digital Convertors:

25-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8AL3L68TAX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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