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STM8AL3L48TCY

STMicroelectronics

STM8AL3L48TCY by STMicroelectronics

STM8AL3L48TCY microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz and operates b/w -40 °C to 125 °C. It supports up to 41 I/O lines, making it ideal for automotive applications. With AEC-Q100 screening, it's reliable for critical systems.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,621 parts In-Stock

1+ parts

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8,621

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Digiode

USA . 3,784 parts In-Stock

1+ parts

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3,784

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Anansix

USA . 2,356 parts In-Stock

1+ parts

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2,356

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$1.600

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$1.600

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-

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Microchip USA

USA . 4,043 parts In-Stock

1+ parts

$13.827

100+ parts

-

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-

10k+ parts

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4,043

$13.827

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-

-

AZTECH Wire

Italy . 447 parts In-Stock

1+ parts

$21.130

100+ parts

-

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447

$21.130

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-

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IDEA Electronic Components Group

UK . 2,368 parts In-Stock

1+ parts

$25.606

100+ parts

-

1k+ parts

$23.046

10k+ parts

-

2,368

$25.606

-

$23.046

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MKK Technologies

India . 1,867 parts In-Stock

1+ parts

$48.151

100+ parts

-

1k+ parts

-

10k+ parts

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1,867

$48.151

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DigiPath Technology Company

USA . 1,867 parts In-Stock

1+ parts

$48.151

100+ parts

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1,867

$48.151

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Corphita

USA . 2,403 parts In-Stock

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2,403

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Parana Technologies

USA . 2,131 parts In-Stock

1+ parts

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100+ parts

$30.616

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2,131

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$30.616

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Overview

Unlock the potential of your next project with the STM8AL3L48TCY microcontroller from STMicroelectronics! Renowned for its reliability and cutting-edge technology, this automotive-grade MCU delivers exceptional performance in demanding environments. With a compact design and versatile applications ranging from automotive systems to industrial automation, it offers unmatched quality and efficiency. Trust in STMicroelectronics for innovative solutions that drive success and elevate your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides reliability and protection for the microcontroller in various environments.

Surface Mount: YES

Allows for compact circuit designs, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, accommodating various power supply configurations.

Screening Level: AEC-Q100

Complies with automotive standards, ensuring high reliability in automotive applications.

Package Shape: SQUARE

Optimal shape for efficient use of PCB space and improved thermal management.

Bit Size: 8

An 8-bit architecture is suitable for simpler control tasks and lower power consumption.

Power Supplies (V): 2/3.3

Offers flexible power supply options, making it adaptable for different applications.

No. of Terminals: 48

Provides numerous terminals for various input/output functionalities, enhancing versatility.

Package Style (Meter): FLATPACK

The flatpack style allows for good thermal performance and easy placement on PCBs.

Minimum Supply Voltage: 1.65 V

Enables operation in lower voltage environments, contributing to energy efficiency.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments, making it a reliable choice for automotive and industrial applications.

CPU Family: STM8

Part of a well-known family of microcontrollers, offering robust support and resources.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, ensuring reliability in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides superior conductivity and corrosion resistance, enhancing long-term reliability.

ADC Channels: YES

Includes ADC channels for easier interfacing with analog signals, widening application possibilities.

DMA Channels: YES

Supports direct memory access for efficient data transfer, improving performance in complex applications.

Terminal Position: QUAD

Facilitates easy integration into various PCB layouts, simplifying design processes.

ROM Words: 16384

Provides ample program memory for supporting complex algorithms and functionalities.

Width: 7 mm

Compact size allows for space-saving designs in tight layouts.

Maximum Clock Frequency: 16 MHz

Balancing performance and power consumption, suitable for a variety of control tasks.

Peak Reflow Temperature °C: 260

Designed to withstand high-temperature soldering processes, ensuring reliability in assembly.

Length: 7 mm

Small footprint enhances suitability for compact electronic devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring stable performance across varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Versatile for various applications, allowing integration with other peripherals seamlessly.

RAM Bytes: 2048

Provides sufficient RAM for executing more complex tasks and processing data efficiently.

Technology: CMOS

CMOS technology enhances power efficiency and speed, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Allows for reliable solder joints, improving connectivity and overall circuit reliability.

Maximum Supply Current: 80 mA

Moderate current consumption allows for effective power management in various applications.

Nominal Supply Voltage: 3 V

Optimized for energy-efficient designs, suitable for low power applications.

PWM Channels: YES

Enables control of motors and other devices efficiently through Pulse Width Modulation.

ROM Programmability: FLASH

Flash memory allows for easy updates and reprogramming, enhancing flexibility in application development.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB designs, maximizing functionality in small spaces.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity provides a balance between assembly concerns and reliability.

Speed: 16 rpm

Offers moderate processing speed suitable for a wide range of applications without excessive power.'

No. of I/O Lines: 41

Provides extensive I/O lines for comprehensive interfacing capabilities, supporting a variety of sensors and actuators.

Technical Specifications

Microcontrollers STM8AL3L48TCY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AL3L48TCY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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