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STM8AL31E89TAY

STMicroelectronics

STM8AL31E89TAY by STMicroelectronics

STM8AL31E89TAY microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w 1.8V and 3.6V, and includes ADC and PWM channels. Its compact 10x10 mm flatpack design makes it ideal for space-constrained applications. This versatile MCU is perfect for embedded systems requiring efficient performance.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,749 parts In-Stock

1+ parts

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6,749

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Digiode

USA . 3,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,802

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Anansix

USA . 763 parts In-Stock

1+ parts

-

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-

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763

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,605 parts In-Stock

1+ parts

$2.090

100+ parts

-

1k+ parts

-

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-

3,605

$2.090

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Microchip USA

USA . 2,054 parts In-Stock

1+ parts

$19.020

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-

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2,054

$19.020

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AZTECH Wire

Italy . 345 parts In-Stock

1+ parts

$19.460

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-

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345

$19.460

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IDEA Electronic Components Group

UK . 1,511 parts In-Stock

1+ parts

$72.559

100+ parts

-

1k+ parts

$65.303

10k+ parts

-

1,511

$72.559

-

$65.303

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MKK Technologies

India . 2,054 parts In-Stock

1+ parts

$136.442

100+ parts

-

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2,054

$136.442

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DigiPath Technology Company

USA . 2,054 parts In-Stock

1+ parts

$136.442

100+ parts

-

1k+ parts

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10k+ parts

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2,054

$136.442

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Corphita

USA . 2,572 parts In-Stock

1+ parts

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2,572

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Parana Technologies

USA . 45 parts In-Stock

1+ parts

-

100+ parts

$86.755

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45

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$86.755

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Overview

Unlock endless possibilities with the STM8AL31E89TAY microcontroller from STMicroelectronics, a leader in innovation and quality. This compact powerhouse is designed for versatility across various applications, from automotive to industrial automation. With its robust performance and energy efficiency, this microcontroller ensures reliable operation while simplifying your design process. Experience superior support and reliability that only STMicroelectronics can provide, enhancing your projects with unmatched performance and value!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact designs and facilitates automated assembly, making it suitable for high-density applications.

Maximum Supply Voltage: 3.6 V

A moderate maximum supply voltage ensures compatibility with a wide range of power sources while preventing potential damage.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCB, which is beneficial for smaller devices.

Bit Size: 8

8-bit architecture is ideal for simpler applications, providing efficiency and adequate performance for many control tasks.

No. of Terminals: 64

A higher number of terminals allows for increased connectivity options, enhancing the microcontroller's versatility in complex systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile and fine pitch design is suited for applications requiring slim profiles while ensuring reliable connections.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage extends the range of applications, allowing it to be powered by batteries or low-voltage circuits.

ADC Channels: YES

Integrated ADC channels enable direct interfacing with analog sensors, enhancing the microcontroller’s capability for data acquisition.

DMA Channels: YES

DMA channels allow for efficient data transfer without CPU intervention, improving the overall performance in data-intensive applications.

Terminal Position: QUAD

Quad terminal positioning facilitates easier routing on PCBs and can improve assembly efficiency.

Width: 10 mm

This compact width contributes to space efficiency on the printed circuit board, ideal for miniaturized designs.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for a balance between power consumption and processing speed, suitable for most applications.

Length: 10 mm

The 10 mm length further enhances the microcontroller’s compactness, making it easier to integrate into tight spaces.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it is designed for embedded systems, providing necessary integration of control and processing functionalities.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it efficient for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability, enhancing reliability in electronic circuit connections.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is standard for many battery-operated devices, simplifying power management.

PWM Channels: YES

The inclusion of PWM channels allows for efficient control of motors and lighting applications, enhancing the versatility of the microcontroller.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is conducive to compact board designs, allowing more components to fit in limited space.

Speed: 16 rpm

This speed specification indicates suitability for low-speed applications, such as sensor interfacing and actuator control.

No. of I/O Lines: 54

Having 54 I/O lines significantly increases the flexibility and capacity for interfacing with various peripherals and devices.

Technical Specifications

Microcontrollers STM8AL31E89TAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of I/O Lines:

54

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM8AL31E89TAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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