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STM8AL31E88TCX

STMicroelectronics

STM8AL31E88TCX by STMicroelectronics

STM8AL31E88TCX from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 16 MHz. It features ADC and DMA channels, making it ideal for embedded applications requiring efficient data processing. Its compact 48-terminal flatpack design ensures versatility in various electronic projects.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,395 parts In-Stock

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1,395

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Digiode

USA . 734 parts In-Stock

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734

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Vyrian

USA . 262 parts In-Stock

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262

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Distributors (Availability)

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$2.100

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-

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2,500

$2.100

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Ampacity Inc.

Singapore . 1,198 parts In-Stock

1+ parts

$15.000

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1,198

$15.000

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AZTECH Wire

Italy . 1,016 parts In-Stock

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$16.110

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1,016

$16.110

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Microchip USA

USA . 5,203 parts In-Stock

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$17.790

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5,203

$17.790

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IDEA Electronic Components Group

UK . 1,394 parts In-Stock

1+ parts

$79.230

100+ parts

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$71.307

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1,394

$79.230

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$71.307

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MKK Technologies

India . 1,312 parts In-Stock

1+ parts

$148.988

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1,312

$148.988

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DigiPath Technology Company

USA . 1,312 parts In-Stock

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$148.988

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1,312

$148.988

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Parana Technologies

USA . 1,703 parts In-Stock

1+ parts

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$94.732

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1,703

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$94.732

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Corphita

USA . 97 parts In-Stock

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97

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Overview

Unlock innovation with the STM8AL31E88TCX microcontroller from STMicroelectronics, a trusted leader in cutting-edge technology. Designed for versatility and efficiency, this compact powerhouse excels in embedded applications, delivering seamless performance with low power consumption. With features like multiple ADC and PWM channels, it empowers developers to create smart solutions across industries—from consumer electronics to automotive systems. Experience reliability and superior quality that elevate your projects to the next level!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern circuit boards, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The 3.6 V maximum supply voltage ensures that the microcontroller can operate reliably across a range of power supply scenarios.

Package Shape: SQUARE

The square package shape allows for more efficient use of PCB space, facilitating better layout design.

Bit Size: 8

An 8-bit microcontroller is ideal for simpler applications that do not require complex computational power, providing a cost-effective solution.

No. of Terminals: 48

With 48 terminals, this microcontroller can accommodate a wide variety of peripherals and interfaces, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design is beneficial for applications with restricted height requirements, making it easy to include within tight enclosures.

Minimum Supply Voltage: 1.8 V

Supporting a minimum supply voltage of 1.8 V provides flexibility in power supply options, allowing operation in low-power applications.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog sensors, making signal processing simpler and more efficient.

DMA Channels: YES

Availability of DMA channels reduces CPU load during data transfers, enhancing performance in data-intensive applications.

Terminal Position: QUAD

Quad terminal positioning facilitates effective mounting on PCBs, allowing for easier soldering and ensuring stability.

Width: 7 mm

A 7 mm width supports compact designs, providing flexibility in the arrangement of other components on the PCB.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides adequate processing speed for standard control tasks while maintaining low power consumption.

Length: 7 mm

The 7 mm length also aids in achieving a space-efficient layout, making it suitable for portable applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it combines processing power with input/output capabilities, making it perfect for embedded system applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, contributing to the reliability of designs.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and assembly while ensuring good mechanical stability on the PCB.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V aligns well with common battery voltages, allowing for seamless integration into battery-powered devices.

PWM Channels: YES

PWM channel availability enables precise control of motor speeds or light intensity, making it ideal for various applications like robotics or lighting.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for a higher density of connections on the microcontroller, maximizing functionality in limited spaces.

Speed: 16 rpm

While the speed of 16 rpm may refer to connected devices, the low-speed operation is favorable for applications that require precision over speed.

No. of I/O Lines: 41

Having 41 I/O lines offers extensive interaction with other devices, allowing for complex interaction and control in various systems.

Technical Specifications

Microcontrollers STM8AL31E88TCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

41

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AL31E88TCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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