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STM8AL3168TCX

STMicroelectronics

STM8AL3168TCX by STMicroelectronics

STM8AL3168TCX from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates up to 125 °C. It features 48 terminals, including ADC/DAC channels, making it ideal for automotive applications. Its low power mode enhances efficiency in embedded systems.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,752 parts In-Stock

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2,752

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Anansix

USA . 2,289 parts In-Stock

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2,289

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Digiode

USA . 1,436 parts In-Stock

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1,436

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Distributors (Availability)

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Vigor

Singapore . 1,134 parts In-Stock

1+ parts

$1.750

100+ parts

-

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1,134

$1.750

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$14.567

100+ parts

$13.256

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$11.945

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-

600

$14.567

$13.256

$11.945

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Microchip USA

USA . 4,828 parts In-Stock

1+ parts

$14.745

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4,828

$14.745

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AZTECH Wire

Italy . 204 parts In-Stock

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$20.010

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204

$20.010

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IDEA Electronic Components Group

UK . 46 parts In-Stock

1+ parts

$21.077

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$18.969

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46

$21.077

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$18.969

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MKK Technologies

India . 1,290 parts In-Stock

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$39.634

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$39.634

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DigiPath Technology Company

USA . 1,290 parts In-Stock

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$39.634

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1,290

$39.634

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Parana Technologies

USA . 1,661 parts In-Stock

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$25.201

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1,661

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$25.201

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Corphita

USA . 1,499 parts In-Stock

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1,499

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Overview

Experience the excellence of the STM8AL3168TCX microcontroller from STMicroelectronics, a trusted leader in innovation. Designed for automotive applications, this high-performance device operates efficiently within extreme conditions, delivering outstanding reliability and power-saving features. Its advanced peripherals and flexible connectivity options empower you to create robust solutions, enhancing your product's value while reducing time-to-market. Elevate your designs with STM8AL3168TCX!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint and efficient assembly in compact electronic designs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources and reduces the risk of over-voltage damage.

On Chip Data RAM Width: 8

The 8-bit data RAM width is optimal for handling simple data processing tasks, making it ideal for low-power applications.

Screening Level: AEC-Q100

AEC-Q100 screening provides assurance of high reliability and performance in automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and is compatible with standard board layouts.

Bit Size: 8

8-bit architecture is beneficial for applications that do not require extensive processing power, balancing capability and efficiency.

DAC Channels: YES

Includes DAC channels which enable analog signal generation, useful for controlling analog devices in embedded systems.

No. of Terminals: 48

With 48 terminals, the microcontroller provides flexibility in interfacing with various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style supports high-density mounting, ideal for modern compact devices requiring minimal space.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage enhances power efficiency and allows operation in battery-powered applications.

Maximum Operating Temperature: 125 °C

Withstand high temperatures, making it suitable for high-performance applications that generate heat.

CPU Family: STM8

The STM8 family offers a versatile architecture with numerous support tools, facilitating easy development.

No. of External Interrupts: 8

Multiple external interrupts enhance responsiveness to events, improving real-time performance in embedded systems.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme temperatures makes it suitable for harsh environments, such as automotive and industrial applications.

ADC Channels: YES

Built-in ADC channels allow for accurate conversion of analog signals to digital, facilitating data acquisition from sensors.

DMA Channels: YES

The presence of DMA channels enables efficient data transfer with minimal CPU intervention, optimizing overall system performance.

Terminal Position: QUAD

Quad terminal positioning aids in effective connectivity options while allowing for more compact design layouts.

ROM Words: 32768

A large ROM size provides ample program storage, supporting complex applications without the need for external memory.

Maximum Seated Height: 1.6 mm

The low seated height facilitates low-profile designs, which is critical in compact electronic applications.

Digital To Analog Converters: 1-Ch 12-Bit

A 1-channel 12-bit DAC ensures high-resolution analog output, ideal for audio or control applications.

Width: 7 mm

A compact width enhances design flexibility for space-constrained applications.

Data EEPROM Size: 1K

With 1K of EEPROM, the microcontroller can store configuration data and parameters, enabling persistent storage.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

An extensive set of peripherals enhances functionality and allows integration with various sensors and devices.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz supports responsive and efficient processing for embedded applications.

Length: 7 mm

The compact length assists in creating smaller form factor devices without sacrificing performance.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing, memory, and peripherals into a single chip for efficient design.

No. of Timers: 5

Five timers allow for versatile timing functions, which are essential in applications requiring scheduled events.

RAM Bytes: 2048

2048 bytes of RAM provide sufficient memory for executing applications and storing temporary data efficiently.

Technology: CMOS

CMOS technology offers lower power consumption and higher speed, making it suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering and connection, enhancing assembly quality.

Analog To Digital Converters: 25-Ch 12-Bit

25-channel 12-bit ADCs enable high-precision data capturing from multiple signals simultaneously.

Maximum Supply Current: 4.9 mA

The low maximum supply current contributes to better energy efficiency, prolonging battery life in portable devices.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V promotes low power consumption, ideal for energy-sensitive applications.

No. of DMA Channels: 4

Four DMA channels allow for efficient memory access and data transfers, boosting processing efficiency.

PWM Channels: YES

PWM channels can control motor drives and other analog circuits, making it versatile for automation projects.

Connectivity: I2C, SPI, USART

Versatile connectivity options support communication with multiple devices, ensuring flexibility in design.

ROM Programmability: FLASH

Flash programmability allows for easy updates to firmware, enhancing adaptability and longevity of the device.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suitable for modern circuit board designs, allowing for higher density layouts.

Format: FIXED POINT

Fixed point format simplifies numeric calculations and reduces processing time in specific applications.

Speed: 16 rpm

A speed of 16 rpm indicates potential for low-speed control applications, making it suitable for various mechanical systems.

Low Power Mode: YES

Low power mode capabilities are vital for battery-powered projects, extending operational life significantly.

On Chip Program ROM Width: 8

The 8-bit program ROM width is effective for executing simpler algorithms, optimizing performance for specific tasks.

No. of I/O Lines: 41

41 I/O lines provide extensive interfacing capabilities, allowing for complex control systems and multiple sensors.

Technical Specifications

Microcontrollers STM8AL3168TCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

8

No. of I/O Lines:

41

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

4.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

Analog To Digital Convertors:

25-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8AL3168TCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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