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STM8AL3166UCX

STMicroelectronics

STM8AL3166UCX by STMicroelectronics

STM8AL3166UCX microcontroller from STMicroelectronics features a 16 MHz CPU, 22 ADC channels, and operates b/w -40 °C to 125 °C. With a compact design (5x5 mm) and AEC-Q100 screening, it's ideal for automotive applications requiring reliability. Its low power mode enhances efficiency in various embedded systems.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,009 parts In-Stock

1+ parts

-

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6,009

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-

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Digiode

USA . 3,448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,448

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Anansix

USA . 1,654 parts In-Stock

1+ parts

-

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-

1k+ parts

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10k+ parts

-

1,654

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,461 parts In-Stock

1+ parts

$1.510

100+ parts

-

1k+ parts

-

10k+ parts

-

1,461

$1.510

-

-

-

AZTECH Wire

Italy . 65 parts In-Stock

1+ parts

$8.080

100+ parts

-

1k+ parts

-

10k+ parts

-

65

$8.080

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-

-

Microchip USA

USA . 4,335 parts In-Stock

1+ parts

$12.706

100+ parts

-

1k+ parts

-

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4,335

$12.706

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IDEA Electronic Components Group

UK . 1,673 parts In-Stock

1+ parts

$78.361

100+ parts

-

1k+ parts

$70.525

10k+ parts

-

1,673

$78.361

-

$70.525

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MKK Technologies

India . 1,720 parts In-Stock

1+ parts

$147.353

100+ parts

-

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-

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-

1,720

$147.353

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DigiPath Technology Company

USA . 1,720 parts In-Stock

1+ parts

$147.353

100+ parts

-

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-

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1,720

$147.353

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-

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Parana Technologies

USA . 1,934 parts In-Stock

1+ parts

-

100+ parts

$93.692

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1,934

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$93.692

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Corphita

USA . 1,501 parts In-Stock

1+ parts

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1,501

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Overview

Unlock your design potential with the STM8AL3166UCX microcontroller from STMicroelectronics. Engineered for excellence, this versatile chip delivers superior performance and reliability tailored for automotive applications. Its compact, low-power design ensures optimal efficiency, while robust features like integrated DAC and ADC channels empower your projects with exceptional functionality. Choose a trusted manufacturer and elevate your innovations effortlessly with the STM8AL3166UCX!

Feature Benefit Bullets

Surface Mount: YES

This feature allows for compact design and easy integration into various electronic circuits.

Maximum Supply Voltage: 3.6 V

This low voltage operation is suitable for battery-operated devices, extending battery life.

On Chip Data RAM Width: 8

An 8-bit RAM width enables efficient data processing for many applications, especially in low-power scenarios.

Screening Level: AEC-Q100

This quality standard ensures the microcontroller can withstand automotive applications and conditions.

Package Shape: SQUARE

The square package shape contributes to a smaller footprint on PCB, facilitating high-density layouts.

Bit Size: 8

Being an 8-bit microcontroller, it is suitable for simple and low-cost applications while maintaining performance.

DAC Channels: YES

Integrated DAC channels allow for analog output functionality, useful in various control applications.

No. of Terminals: 48

The 48 terminals provide ample connectivity options for diverse interfacing needs in various designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style is ideal for thermal management and space-saving applications.

Minimum Supply Voltage: 1.65 V

Allows for operation in low power environments, which is a key requirement for portable electronics.

Maximum Operating Temperature: 125 °C

High operating temperature makes it suitable for harsh environments like automotive and industrial applications.

CPU Family: STM8

Part of a well-established family, ensuring support and availability of resources and community.

No. of External Interrupts: 8

Multiple external interrupts facilitate responsive and interactive system designs.

Minimum Operating Temperature: -40 °C

Resistance to extreme cold ensures reliability in various environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, enhancing product durability.

ADC Channels: YES

With integrated ADC channels, it can process analog signals, making it versatile for multiple applications.

DMA Channels: YES

DMA capability allows efficient data transfer operations, enhancing system performance and responsiveness.

Terminal Position: QUAD

Quad terminal positioning allows for easier routing and connectivity options in PCB designs.

ROM Words: 32768

Sufficient flash memory provides ample space for complex applications and firmware.

Maximum Seated Height: 1 mm

Ultra-thin profile allows for compact designs, suitable for portable and space-constrained applications.

Digital To Analog Convertors: 1-Ch 12-Bit

A 12-bit resolution DAC offers high-precision analog output for applications like audio and control systems.

Width: 5 mm

Compact width enhances the versatility of PCB layout options.

Data EEPROM Size: 1K

1K EEPROM is sufficient for storing parameters or configurations, useful for applications requiring data retention.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

This rich set of peripherals provides extensive functionality, accommodating a wide range of applications.

Maximum Clock Frequency: 16 MHz

16 MHz clock speed supports responsive and effective operation for many control tasks.

Peak Reflow Temperature °C: 260

This high reflow temperature ensures compatibility with modern soldering processes, enhancing manufacturability.

Length: 5 mm

The small length offers a space-efficient design, crucial for compact devices.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, it optimally integrates needed functions for embedded systems.

No. of Timers: 5

Multiple timers allow for managing various timing functions simultaneously, improving system functionality.

RAM Bytes: 2048

2048 bytes of RAM provide sufficient memory for high-performance processing tasks in various applications.

Technology: CMOS

CMOS technology ensures low power consumption, making it ideal for battery-powered applications.

Terminal Form: NO LEAD

A no-lead design reduces complexity in assembly and enhances thermal performance.

Analog To Digital Convertors: 22-Ch 12-Bit

With 22 ADC channels, it can handle multiple analog inputs, making it versatile for sensor applications.

Maximum Supply Current: 4.9 mA

A low maximum supply current ensures energy efficiency, extending battery life in portable applications.

Nominal Supply Voltage: 1.8 V

Maintaining a nominal voltage of 1.8 V is perfect for low-power applications and battery designs.

No. of DMA Channels: 4

Four DMA channels enhance data processing efficiency, reducing CPU workload during frequent data transfers.

PWM Channels: YES

Supporting PWM channels allows for effective motor control and other applications requiring speed regulation.

Connectivity: I2C, SPI, USART

Multiple connectivity options ensure integration with various sensors and other devices, enhancing flexibility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of firmware, streamlining development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density designs, ideal for modern compact devices.

Format: FIXED POINT

Fixed point format is suitable for certain applications where floating-point calculations are unnecessary, optimizing performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates reasonable moisture sensitivity, ensuring proper handling and storage requirements.

Speed: 16 rpm

Compatible with various low-speed applications, making it an ideal choice for specific control tasks.

Low Power Mode: YES

The low power mode feature enhances energy efficiency, allowing for extended operation in battery-powered devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient instruction execution, crucial for embedded applications.

No. of I/O Lines: 30

30 I/O lines provide versatile interfacing options for different peripherals and sensors, enhancing application flexibility.

Technical Specifications

Microcontrollers STM8AL3166UCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

8

No. of I/O Lines:

30

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

4.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8AL3166UCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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