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STM8AL3166TCY

STMicroelectronics

STM8AL3166TCY by STMicroelectronics

STM8AL3166TCY from STMicroelectronics is an 8-bit microcontroller ideal for automotive applications, featuring a max supply voltage of 3.6V and operating temp range of -40 °C to 125 °C. It includes 32 terminals, ADC/DMA channels, and supports FLASH ROM. With a clock speed of 16 MHz, it ensures efficient performance in compact designs.

Median Price

$3.630

Lifecycle Status

EOL

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,320 parts In-Stock

1+ parts

$3.630

100+ parts

$2.266

1k+ parts

$2.020

10k+ parts

$1.921

1,320

$3.630

$2.266

$2.020

$1.921

Avnet

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,463 parts In-Stock

1+ parts

$3.448

100+ parts

-

1k+ parts

-

10k+ parts

-

4,463

$3.448

-

-

-

Chip Stock

USA . 18,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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18,500

-

-

-

-

Vyrian

USA . 7,025 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,025

-

-

-

-

Anansix

USA . 2,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,600

-

-

-

-

ComSIT Distribution GmbH

Germany . 584 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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584

-

-

-

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ComSIT USA

USA . 584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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584

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 479 parts In-Stock

1+ parts

$3.267

100+ parts

-

1k+ parts

-

10k+ parts

-

479

$3.267

-

-

-

Vigor

Singapore . 4,464 parts In-Stock

1+ parts

$3.360

100+ parts

-

1k+ parts

-

10k+ parts

-

4,464

$3.360

-

-

-

Microchip USA

USA . 3,063 parts In-Stock

1+ parts

$27.170

100+ parts

-

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10k+ parts

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3,063

$27.170

-

-

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IDEA Electronic Components Group

UK . 1,542 parts In-Stock

1+ parts

$43.187

100+ parts

-

1k+ parts

$38.868

10k+ parts

-

1,542

$43.187

-

$38.868

-

MKK Technologies

India . 1,430 parts In-Stock

1+ parts

$81.210

100+ parts

-

1k+ parts

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10k+ parts

-

1,430

$81.210

-

-

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DigiPath Technology Company

USA . 1,430 parts In-Stock

1+ parts

$81.210

100+ parts

-

1k+ parts

-

10k+ parts

-

1,430

$81.210

-

-

-

Perfect Parts

USA . 26,600 parts In-Stock

1+ parts

-

100+ parts

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26,600

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-

-

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,000

-

-

-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

-

-

Parana Technologies

USA . 1,952 parts In-Stock

1+ parts

-

100+ parts

$51.636

1k+ parts

-

10k+ parts

-

1,952

-

$51.636

-

-

Overview

Unlock the potential of your next project with the STM8AL3166TCY microcontroller from STMicroelectronics! Renowned for its exceptional quality and reliability, this automotive-grade MCU delivers efficiency and performance in challenging environments. Ideal for applications ranging from automotive systems to industrial controls, it ensures robust operation from -40 °C to 125 °C. Elevate your designs with a trusted partner that prioritizes innovation and customer satisfaction!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly processes, contributing to reduced manufacturing costs.

Maximum Supply Voltage: 3.6 V

Supports a broader range of power supply designs while ensuring low-power consumption, making it ideal for battery-operated devices.

Screening Level: AEC-Q100

AEC-Q100 qualification ensures high reliability and quality for automotive applications, enhancing trust for automotive designers.

Package Shape: SQUARE

The square shape allows for efficient use of PCB space, making it easier to integrate into various layouts.

Bit Size: 8

An 8-bit architecture is well-suited for simple control applications and education, making it easy to program and manage.

Power Supplies (V): 2/3.3

Dual voltage compatibility allows flexibility in power supply options, enhancing adaptability to different projects.

No. of Terminals: 32

With 32 terminals, this microcontroller provides plenty of I/O options for complex applications without compromising design.

Package Style (Meter): FLATPACK

Flatpack design is advantageous for low-profile applications and effective thermal management.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage enables operation in power-sensitive applications, extending battery life in portable devices.

Maximum Operating Temperature: 125 °C

The high working temperature range ensures reliable performance in harsh environmental conditions, particularly for automotive uses.

CPU Family: STM8

Being part of the STM8 family, it provides a well-documented ecosystem and developer community, facilitating easier development.

Minimum Operating Temperature: -40 °C

This temperature tolerance allows the microcontroller to operate in extreme environments without failure, perfect for outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Gold plating provides excellent conductivity and resistance to corrosion, ensuring a reliable connection and longer lifespan.

ADC Channels: YES

Incorporating ADC channels offers enhanced capabilities for sensor interfacing, making it suitable for diverse applications like automation.

DMA Channels: YES

DMA support allows for efficient data transfer without CPU intervention, leading to improved performance in data-heavy operations.

Terminal Position: QUAD

Quad terminal configuration enables better connectivity in multi-layer PCBs, enhancing signal integrity and layout flexibility.

ROM Words: 32768

With 32K ROM, it allows for substantial program storage capacity, making it suitable for complex applications.

Width: 7 mm

A compact width makes this microcontroller ideal for space-constrained designs, such as portable devices and retrofits.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures adequate processing speed for a variety of applications, balancing performance with power consumption.

Peak Reflow Temperature °C: 260

A high peak reflow temperature indicates compatibility with modern soldering processes, facilitating easy integration into production.

Length: 7 mm

The compact length contributes to a small footprint on the PCB, supporting design flexibility.

Temperature Grade: AUTOMOTIVE

Automotive grading ensures operational reliability under challenging conditions, perfect for automotive applications.

Peripheral IC Type: MICROCONTROLLER

Being a dedicated microcontroller allows for a modular design where additional functionalities can be integrated seamlessly.

RAM Bytes: 2048

With 2K of RAM, it facilitates efficient data handling and temporary storage, which enhances processing capabilities.

Technology: CMOS

CMOS technology provides lower power consumption and higher integration capabilities, making the microcontroller energy efficient.

Terminal Form: GULL WING

The gull wing form makes soldering simple and reliable, which is significant for assembly processes.

Maximum Supply Current: 80 mA

A maximum supply current of 80 mA allows for sufficient power for various peripherals, supporting integrated systems.

Nominal Supply Voltage: 3 V

The standard nominal supply voltage of 3V aligns with common battery systems, reinforcing its applicability in portable electronics.

PWM Channels: YES

Dual PWM channels enable effective control over motors and other actuation systems, critical for robotics and automation applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in software development, facilitating agile product improvements.

Terminal Pitch: 0.8 mm

A tighter terminal pitch supports compact PCB designs and is ideal for modern electronic applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, making it suitable for most assembly processes without requiring special precautions.

Speed: 16 rpm

A speed of 16 rpm is ideal for slow, controlled applications where precision is key, such as in robotics or automated systems.

No. of I/O Lines: 30

With 30 I/O lines, this microcontroller offers ample connectivity options for interfacing with multiple devices and sensors.

Technical Specifications

Microcontrollers STM8AL3166TCY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AL3166TCY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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