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STM8AL3148TCX

STMicroelectronics

STM8AL3148TCX by STMicroelectronics

STM8AL3148TCX microcontroller from STMicroelectronics features a max supply voltage of 3.6V, 48 terminals, and operates at temperatures up to 125 °C. It supports I2C, SPI, and USART for versatile connectivity. Ideal for automotive applications due to AEC-Q100 screening.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,822 parts In-Stock

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Digiode

USA . 3,013 parts In-Stock

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Anansix

USA . 382 parts In-Stock

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382

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Vigor

Singapore . 1,947 parts In-Stock

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$1.600

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$1.600

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AZTECH Wire

Italy . 272 parts In-Stock

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$16.000

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IDEA Electronic Components Group

UK . 1,442 parts In-Stock

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$16.784

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$15.105

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$16.784

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$15.105

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Component Stockers USA

USA . 2,324 parts In-Stock

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$23.450

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2,324

$23.450

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MKK Technologies

India . 331 parts In-Stock

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$31.560

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$31.560

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DigiPath Technology Company

USA . 331 parts In-Stock

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$31.560

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QUARKTWIN TECHNOLOGY LTD

USA . 10,710 parts In-Stock

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Microchip USA

USA . 7,111 parts In-Stock

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Corphita

USA . 2,100 parts In-Stock

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Parana Technologies

USA . 464 parts In-Stock

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$20.067

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$20.067

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Overview

Unlock the potential of your projects with the STM8AL3148TCX microcontroller from STMicroelectronics. Renowned for its quality and reliability, this compact powerhouse excels in automotive and industrial applications, delivering superior performance even in extreme conditions. Enjoy seamless connectivity, low power consumption, and advanced features that simplify design while enhancing efficiency. Choose the STM8AL3148TCX for a reliable partner in innovation and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and makes the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V contributes to low power consumption, making it ideal for energy-sensitive applications.

On Chip Data RAM Width: 8

This RAM width indicates that the microcontroller can handle 8-bit data efficiently, which is suitable for embedded applications.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures automotive-grade reliability and performance for critical applications.

Package Shape: SQUARE

A square shape design provides uniform thermal properties and simplifies PCB layout.

Bit Size: 8

An 8-bit architecture is ideal for simple control applications, ensuring compatibility with a wide range of existing software.

DAC Channels: YES

The presence of DAC (Digital-to-Analog Converter) channels allows for analog signal generation, enhancing control capabilities.

No. of Terminals: 48

Having 48 terminals offers significant connectivity options for various peripheral devices and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style minimizes footprint on the PCB, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage enhances the microcontroller's compatibility with battery-operated devices.

Maximum Operating Temperature: 125 °C

High operating temperature capability ensures reliable performance in harsh operating environments.

CPU Family: STM8

The STM8 CPU family is well-known for its robustness and strong performance in diverse applications.

No. of External Interrupts: 8

Multiple external interrupts improve responsiveness and allow for efficient event handling in complex systems.

Minimum Operating Temperature: -40 °C

Expanded temperature range suitability enables use in extreme conditions, particularly in outdoor or industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent solderability and long-term reliability.

ADC Channels: YES

The inclusion of ADC (Analog-to-Digital Converter) channels allows for precise sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels facilitate high-speed data transfer without CPU intervention, optimizing performance.

Terminal Position: QUAD

Quad terminal positions enhance layout flexibility on PCBs, supporting various design configurations.

ROM Words: 16384

A substantial ROM capacity allows for complex application programming while accommodating large codebases.

Maximum Seated Height: 1.6 mm

A low seated height contributes to compact designs, optimizing space usage in electronic devices.

Digital To Analog Convertors: 1-Ch 12-Bit

The 12-bit resolution DAC provides high-quality analog signal generation for various applications.

Width: 7 mm

The compact width allows for efficient use in tight spaces within electronic assemblies.

Data EEPROM Size: 1K

An onboard EEPROM of 1K allows for data retention even when the power is removed, facilitating non-volatile data storage.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

The extensive range of peripherals enhances functionality and flexibility for various application needs.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows the microcontroller to handle computations efficiently, suitable for many real-time applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with modern soldering processes, enhancing production yield.

Length: 7 mm

A compact length supports space-constrained designs, making it ideal for portable applications.

Peripheral IC Type: MICROCONTROLLER

Being a dedicated microcontroller IC allows for specialized applications in embedded systems.

No. of Timers: 5

Multiple timers provide critical time measurement functionalities required for effective control processes.

RAM Bytes: 2048

With 2048 bytes of RAM, the microcontroller supports complex processing and multiple tasks simultaneously.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance overall PCB assembly efficiency.

Analog To Digital Convertors: 25-Ch 12-Bit

With a large number of ADC channels and 12-bit resolution, it supports extensive analog signal input options for diverse applications.

Maximum Supply Current: 4.9 mA

Low supply current allows for greater battery life in portable applications.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V is conducive for low power designs, extending the range of applications.

No. of DMA Channels: 4

Four DMA channels allow for efficient data handling, reducing CPU load and improving system performance.

PWM Channels: YES

PWM channels enhance control for applications like motor control and signal modulation, increasing design versatility.

Connectivity: I2C, SPI, USART

Support for multiple connectivity protocols ensures interoperability with a wide range of peripheral devices.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming and updates, offering flexibility in development.

Terminal Pitch: 0.5 mm

A smaller terminal pitch facilitates compact designs, making it suitable for high-density applications.

Format: FIXED POINT

Fixed point format offers efficient processing for applications requiring high precision calculations.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates reasonable handling requirements, promoting reliability during assembly.

Speed: 16 rpm

Operational speed of 16 rpm indicates suitability for control applications that don't require rapid response.

Low Power Mode: YES

Low power mode availability supports battery conservation for extended operation in portable devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width caters effectively to smaller applications while simplifying design architecture.

No. of I/O Lines: 41

An ample number of I/O lines allows for versatile interfacing with peripheral devices, enhancing functionality.

Technical Specifications

Microcontrollers STM8AL3148TCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

8

No. of I/O Lines:

41

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

4.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

Analog To Digital Convertors:

25-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8AL3148TCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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