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STM8AL3146UCY

STMicroelectronics

STM8AL3146UCY by STMicroelectronics

STM8AL3146UCY microcontroller from STMicroelectronics features a max supply voltage of 3.6V, operates at temperatures up to 125 °C, and includes 22 ADC channels. Ideal for automotive applications, it supports I2C, SPI, and USART connectivity. Its low power mode enhances efficiency in embedded systems.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,303 parts In-Stock

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6,303

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Digiode

USA . 3,522 parts In-Stock

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3,522

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Anansix

USA . 529 parts In-Stock

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529

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ComSIT Distribution GmbH

Germany . 31 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 3,724 parts In-Stock

1+ parts

$1.360

100+ parts

-

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3,724

$1.360

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Andel Nordic

Denmark . 1,856 parts In-Stock

1+ parts

$6.708

100+ parts

-

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$6.440

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$6.440

1,856

$6.708

-

$6.440

$6.440

Microchip USA

USA . 4,701 parts In-Stock

1+ parts

$11.435

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4,701

$11.435

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AZTECH Wire

Italy . 997 parts In-Stock

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$22.000

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997

$22.000

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IDEA Electronic Components Group

UK . 853 parts In-Stock

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$75.903

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$68.312

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853

$75.903

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$68.312

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MKK Technologies

India . 550 parts In-Stock

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$142.730

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550

$142.730

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DigiPath Technology Company

USA . 550 parts In-Stock

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$142.730

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550

$142.730

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Corphita

USA . 2,385 parts In-Stock

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2,385

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Parana Technologies

USA . 1,319 parts In-Stock

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$90.753

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1,319

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$90.753

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Overview

Elevate your projects with the STM8AL3146UCY microcontroller from STMicroelectronics—a trusted leader in innovation. Designed for efficiency and reliability, this advanced chip offers unparalleled performance across diverse applications, from automotive systems to IoT devices. Its compact size and low power consumption enhance flexibility while ensuring robust functionality. Experience superior quality, exceptional support, and a pathway to simplify your design challenges while maximizing value!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for efficient use of PCB space, making it ideal for compact designs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-voltage applications.

On Chip Data RAM Width: 8

With an 8-bit data RAM width, this microcontroller is well-suited for handling simple data processing tasks.

Screening Level: AEC-Q100

Compliance with AEC-Q100 indicates suitability for automotive applications, ensuring reliability in critical environments.

Package Shape: SQUARE

The square package shape promotes efficient thermal management and ease of layout in circuit designs.

Bit Size: 8

The 8-bit architecture allows for easy integration in applications where resource constraints are a factor.

DAC Channels: YES

With integrated DAC channels, this microcontroller can produce analog signals, enhancing its functionality in control applications.

No. of Terminals: 48

Having 48 terminals offers flexibility for a substantial number of I/O connections, enabling complex interfacing capabilities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style supports advanced thermal management, making it suitable for high-performance applications.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage allows for energy-efficient designs, ideal for battery-operated devices.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures the microcontroller can perform reliably in harsh conditions.

CPU Family: STM8

Part of the STM8 family, known for performance and robustness, suitable for various embedded applications.

No. of External Interrupts: 8

Supporting 8 external interrupts allows for timely response to various external events, enhancing real-time applications.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures performance in extreme climates, making it suitable for outdoor and industrial applications.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to perform real-time data sampling from sensors.

DMA Channels: YES

With DMA channels, the microcontroller can efficiently manage data transfers, improving performance in data-intensive applications.

Terminal Position: QUAD

The quad terminal position simplifies board layout and enhances soldering performance.

ROM Words: 16384

With 16K words of ROM, it provides ample memory for firmware and user applications.

Maximum Seated Height: 1 mm

The low seated height allows for thin-profile devices, which is crucial in miniaturized designs.

Digital To Analog Converters: 1-Ch 12-Bit

A 12-bit DAC allows for precise analog signal generation, benefiting applications requiring fine control.

Width: 5 mm

A compact width aids in space-saving designs, which is essential for modern electronic devices.

Data EEPROM Size: 1K

1K of Data EEPROM offers non-volatile storage for essential configurations and calibration data.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

A rich set of peripherals enhances the microcontroller's capabilities, providing extensive functionality for diverse applications.

Maximum Clock Frequency: 16 MHz

A 16 MHz clock frequency ensures efficient execution of programs, making it capable of handling moderately complex tasks.

Length: 5 mm

The compact length helps achieve smaller form factors, perfectly suiting space-constrained applications.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is optimized for control tasks, making it an excellent choice for embedded systems.

No. of Timers: 5

Having 5 timers facilitates multiple timing functionalities, essential for synchronized operations in control systems.

RAM Bytes: 2048

With 2048 bytes of RAM, the microcontroller supports more complex algorithms and applications efficiently.

Technology: CMOS

CMOS technology offers low power consumption while maintaining high speed, making it suitable for battery-powered systems.

Terminal Form: NO LEAD

No-lead terminal form facilitates a compact layout and conforms to modern PCB manufacturing practices.

Analog To Digital Converters: 22-Ch 12-Bit

The presence of 22 channels in 12-bit ADCs allows detailed digital representation of analog signals from multiple sensors.

Maximum Supply Current: 4.9 mA

A maximum supply current of 4.9 mA is energy-efficient, contributing to prolonged battery life in portable devices.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V makes it compatible with low-power applications and helps minimize energy costs.

No. of DMA Channels: 4

Four DMA channels allow for concurrent data operations, enhancing throughput in data-driven applications.

PWM Channels: YES

PWM functionality enables precise control over motors and lights, broadening the microcontroller's application landscape.

Connectivity: I2C, SPI, USART

Versatile connectivity options facilitate communication with a range of peripherals, enhancing system integration.

ROM Programmability: FLASH

Flash programmability allows easy updates and modifications to firmware without hardware changes.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm aids in high-density PCB designs, allowing placement flexibility.

Format: FIXED POINT

Fixed point format is ideal for applications where performance is critical, such as real-time processing.

Speed: 16 rpm

The speed specification implies it can efficiently handle applications requiring precise timing and control.

Low Power Mode: YES

The availability of low power mode extends the operational life of battery-powered devices, making it cost-effective.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for simpler coding practices and makes it easier to manage program instructions.

No. of I/O Lines: 30

With 30 I/O lines available, it provides significant interfacing capability for various external devices and sensors.

Technical Specifications

Microcontrollers STM8AL3146UCY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

8

No. of I/O Lines:

30

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

4.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8AL3146UCY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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