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STM8AL3138TCY

STMicroelectronics

STM8AL3138TCY by STMicroelectronics

STM8AL3138TCY from STMicroelectronics is an 8-bit automotive microcontroller with a max supply voltage of 3.6V and operates b/w -40 °C to 125 °C. It features 48 terminals, ADC/DMA channels, and FLASH ROM for versatile applications in automotive systems. Its compact design ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,686 parts In-Stock

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8,686

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Digiode

USA . 3,117 parts In-Stock

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3,117

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Anansix

USA . 2,606 parts In-Stock

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2,606

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Distributors (Availability)

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Vigor

Singapore . 1,157 parts In-Stock

1+ parts

$1.450

100+ parts

-

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1,157

$1.450

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AZTECH Wire

Italy . 260 parts In-Stock

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$9.600

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260

$9.600

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Microchip USA

USA . 3,924 parts In-Stock

1+ parts

$15.427

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3,924

$15.427

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IDEA Electronic Components Group

UK . 1,081 parts In-Stock

1+ parts

$17.019

100+ parts

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$15.317

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1,081

$17.019

-

$15.317

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MKK Technologies

India . 802 parts In-Stock

1+ parts

$32.003

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802

$32.003

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DigiPath Technology Company

USA . 802 parts In-Stock

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$32.003

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802

$32.003

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Corphita

USA . 3,250 parts In-Stock

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3,250

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Parana Technologies

USA . 1,638 parts In-Stock

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$20.349

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1,638

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$20.349

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Overview

Unlock the potential of your projects with the STM8AL3138TCY microcontroller from STMicroelectronics! Renowned for its exceptional quality and reliability, this robust automotive-grade MCU is designed for excellence in performance across various applications—from automotive systems to consumer electronics. With its versatile features, low power consumption, and superior support, you'll enjoy seamless integration and long-lasting durability, empowering your innovations like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy material ensures robust protection against environmental factors, making it suitable for automotive applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs and enables automated assembly, increasing manufacturing productivity.

Maximum Supply Voltage: 3.6 V

The moderate maximum supply voltage allows for compatibility with a wide range of power supplies and enhances design flexibility.

Screening Level: AEC-Q100

Compliance with AEC-Q100 indicates that the microcontroller is designed for automotive applications, ensuring reliability under harsh conditions.

Package Shape: SQUARE

The square package shape offers symmetrical layout benefits for circuit design, optimizing space in your electronic devices.

Bit Size: 8

An 8-bit architecture is often sufficient for many control and monitoring applications, offering a balance of performance and simplicity.

Power Supplies (V): 2/3.3

Dual supply voltage options allow for flexibility in design and integration into existing systems with varying power requirements.

No. of Terminals: 48

With 48 terminals, the microcontroller can support multiple input/output lines, enabling complex interfacing and control options.

Package Style (Meter): FLATPACK

The flatpack style enables low-profile mounting, which is advantageous in space-constrained applications.

Minimum Supply Voltage: 1.65 V

The ability to operate at a low minimum supply voltage helps in powering devices efficiently and extends battery life.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this microcontroller can perform reliably in extreme thermal environments typical in automotive applications.

CPU Family: STM8

The STM8 family is known for its versatility and extensive development tools, making it easier for engineers to design and deploy applications.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature ensures reliability and performance even in cold operating environments, crucial for automotive use.

ADC Channels: YES

With ADC channels, the microcontroller can perform analog-to-digital conversions, enabling it to interact with a variety of sensors.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning aids in secure mounting and effective thermal management during operation.

ROM Words: 8196

A substantial ROM capacity enables the storage of complex programs and algorithms for various applications.

Width: 7 mm

A compact width facilitates space-saving designs in tight electronic assemblies.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, the microcontroller provides adequate processing power for executing tasks efficiently.

Length: 7 mm

Similar to its width, the length ensures a small footprint, allowing for integration into compact devices.

Temperature Grade: AUTOMOTIVE

The automotive grade ensures it can withstand environmental stressors, making it reliable for vehicle applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it combines processing power with integrated peripherals, reducing the need for additional components.

RAM Bytes: 2048

With 2048 bytes of RAM, sufficient memory is available for data processing and temporary storage in applications.

Technology: CMOS

The use of CMOS technology enhances power efficiency and reduces heat generation, extending the longevity of the device.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and a secure connection to the PCB, improving reliability.

Maximum Supply Current: 80 mA

A maximum supply current of 80 mA is manageable for many applications, contributing to lower overall power consumption.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V is optimal for many low-power applications, facilitating efficient energy use.

PWM Channels: YES

The inclusion of PWM channels allows for precise control of motors and LEDs, enabling various applications like dimming and speed control.

ROM Programmability: FLASH

Flash programmability offers the flexibility to update the microcontroller's software in the field, reducing downtime and maintenance costs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for higher density of connections on the PCB, enabling more features in a smaller design.

Speed: 16 rpm

This speed specification helps in applications requiring precise timing and control over processes.

No. of I/O Lines: 41

Having 41 I/O lines gives the microcontroller versatility in interfacing with other devices and components within a system.

Technical Specifications

Microcontrollers STM8AL3138TCY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

41

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8196

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AL3138TCY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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