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STM8AL3138TCX

STMicroelectronics

STM8AL3138TCX by STMicroelectronics

STM8AL3138TCX microcontroller from STMicroelectronics features a 16 MHz CPU, 2048 bytes of RAM, and supports I2C/SPI/USART connectivity. With an operating temp range of -40 °C to 125 °C, it's ideal for automotive applications. Its low power mode enhances efficiency in embedded systems.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,529 parts In-Stock

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4,529

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Digiode

USA . 1,826 parts In-Stock

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Anansix

USA . 1,335 parts In-Stock

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1,335

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Distributors (Availability)

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Vigor

Singapore . 1,056 parts In-Stock

1+ parts

$1.450

100+ parts

-

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1,056

$1.450

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AZTECH Wire

Italy . 622 parts In-Stock

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$13.010

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622

$13.010

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Microchip USA

USA . 4,209 parts In-Stock

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$14.356

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4,209

$14.356

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Component Stockers USA

USA . 1,683 parts In-Stock

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$33.170

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1,683

$33.170

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IDEA Electronic Components Group

UK . 363 parts In-Stock

1+ parts

$63.072

100+ parts

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$56.764

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363

$63.072

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$56.764

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MKK Technologies

India . 777 parts In-Stock

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$118.602

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777

$118.602

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DigiPath Technology Company

USA . 777 parts In-Stock

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$118.602

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777

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Corphita

USA . 3,988 parts In-Stock

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3,988

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Parana Technologies

USA . 1,519 parts In-Stock

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$75.412

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1,519

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$75.412

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Overview

Unlock the power of innovation with the STM8AL3138TCX microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Engineered for reliability and performance, this microcontroller excels in automotive and industrial applications, delivering low power consumption without compromising on speed. With robust features like built-in DAC and ADC channels, it empowers your designs to achieve precision and efficiency, transforming your ideas into reality seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic and epoxy materials ensure long-term reliability and protection in various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient circuit layouts.

Maximum Supply Voltage: 3.6 V

Compatible with a wide range of low-power applications, ensuring flexibility in power management.

On Chip Data RAM Width: 8

8-bit RAM width allows for efficient data processing in applications that require fast responses.

Screening Level: AEC-Q100

AEC-Q100 qualification ensures high reliability and performance for automotive applications.

Package Shape: SQUARE

The square package shape provides an efficient use of PCB space, making it easier to integrate into designs.

Bit Size: 8

An 8-bit architecture simplifies programming and data manipulation, ideal for many embedded applications.

DAC Channels: YES

On-chip DAC capabilities allow for precise analog output, essential for signal processing applications.

No. of Terminals: 48

A higher terminal count facilitates more connections and greater functionality in circuit designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low-profile design is excellent for space-constrained applications, making it suitable for thin devices.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage enhances compatibility with battery-operated and energy-efficient designs.

Maximum Operating Temperature: 125 °C

High temperature tolerance allows for use in demanding environments, ensuring robustness in various applications.

CPU Family: STM8

STM8 family offers a balance of performance and ease of use, with extensive community support and resources.

No. of External Interrupts: 8

Multiple external interrupts enhance responsiveness, enabling quick reactions to real-time events.

Minimum Operating Temperature: -40 °C

Ability to function in extreme cold makes it suitable for harsh environments and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finish improves conductivity and reliability, ensuring long-term performance.

ADC Channels: YES

Integrated ADC channels enable real-time data acquisition, broadening application possibilities.

DMA Channels: YES

Direct Memory Access capabilities improve data transfer efficiency, reducing CPU workload for better performance.

Terminal Position: QUAD

Quad terminal positioning enhances board layout options, promoting design flexibility and ease of assembly.

ROM Words: 8192

Sufficient ROM capacity supports complex applications and extensive firmware, enhancing functionality.

Maximum Seated Height: 1.6 mm

Low seated height allows for compact designs, making it ideal for portable devices.

Digital To Analog Convertors: 1-Ch 12-Bit

12-bit resolution in DAC provides high fidelity in signal generation, suitable for audio and control applications.

Width: 7 mm

Compact width is advantageous in space-constrained applications, enabling efficient PCB designs.

Data EEPROM Size: 1K

Adequate EEPROM capacity supports data retention needs for applications requiring non-volatile memory.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

Rich peripheral set increases functionality, allowing for diverse application scenarios.

Maximum Clock Frequency: 16 MHz

16 MHz clock speed ensures responsive performance for time-sensitive applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature capabilities are compatible with modern surface mount technology.

Length: 7 mm

Compact length contributes to smaller overall device size, ideal for miniaturized electronics.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, this IC is versatile and suited for a broad range of control applications.

No. of Timers: 5

Multiple timers enable efficient task scheduling and control in embedded systems.

RAM Bytes: 2048

Ample RAM allows for effective handling of data in complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high density, making it ideal for portable devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and soldering, improving manufacturability.

Analog To Digital Convertors: 25-Ch 12-Bit

25-channel ADC with 12-bit resolution provides extensive data input options for precision applications.

Maximum Supply Current: 4.9 mA

Low maximum supply current enhances energy efficiency, ideal for battery-operated devices.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V is compatible with modern low-voltage circuits, optimizing power usage.

No. of DMA Channels: 4

Multiple DMA channels support efficient data management and improved data handling capabilities.

PWM Channels: YES

Integrated PWM channels are essential for applications requiring motor control and signal modulation.

Connectivity: I2C, SPI, USART

Multiple connectivity options facilitate seamless integration with various peripherals and systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of the firmware, enhancing longevity.

Terminal Pitch: 0.5 mm

Fine terminal pitch design supports high-density layouts, optimizing PCB space utilization.

Format: FIXED POINT

Fixed point format simplifies mathematical operations, enhancing processing speed in specific applications.

Moisture Sensitivity Level (MSL): 3

A moderate moisture sensitivity level indicates that proper handling is required during assembly, preventing damage.

Speed: 16 rpm

Operational speed is suitable for various control tasks in interactive applications.

Low Power Mode: YES

Low power mode capabilities significantly extend battery life in portable applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides efficient coding for embedded applications.

No. of I/O Lines: 41

41 I/O lines allow significant interfacing flexibility with sensors, displays, and other peripherals.

Technical Specifications

Microcontrollers STM8AL3138TCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

8

No. of I/O Lines:

41

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

4.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

Analog To Digital Convertors:

25-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8AL3138TCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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