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STM8AL3138TAY

STMicroelectronics

STM8AL3138TAY by STMicroelectronics

STM8AL3138TAY microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 1.65V and 3.6V, and supports up to 41 I/O lines. With AEC-Q100 screening, it's ideal for industrial applications requiring reliability in harsh environments. Its compact FLATPACK design ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,845 parts In-Stock

1+ parts

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6,845

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Digiode

USA . 4,378 parts In-Stock

1+ parts

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4,378

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Anansix

USA . 1,138 parts In-Stock

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1,138

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,231 parts In-Stock

1+ parts

$1.350

100+ parts

-

1k+ parts

-

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-

1,231

$1.350

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Microchip USA

USA . 3,342 parts In-Stock

1+ parts

$14.422

100+ parts

-

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-

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3,342

$14.422

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-

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AZTECH Wire

Italy . 689 parts In-Stock

1+ parts

$20.970

100+ parts

-

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689

$20.970

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-

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IDEA Electronic Components Group

UK . 77 parts In-Stock

1+ parts

$60.257

100+ parts

-

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$54.232

10k+ parts

-

77

$60.257

-

$54.232

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MKK Technologies

India . 1,364 parts In-Stock

1+ parts

$113.310

100+ parts

-

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1,364

$113.310

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DigiPath Technology Company

USA . 1,364 parts In-Stock

1+ parts

$113.310

100+ parts

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1,364

$113.310

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Parana Technologies

USA . 1,772 parts In-Stock

1+ parts

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$72.047

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1,772

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$72.047

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Corphita

USA . 371 parts In-Stock

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371

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Overview

Elevate your project with the STM8AL3138TAY microcontroller from STMicroelectronics—a trusted leader in cutting-edge technology. Designed for versatile applications, this 8-bit powerhouse ensures reliability in automotive and industrial environments, operating seamlessly even in extreme temperatures. Benefit from efficient power management, advanced ADC capabilities, and robust processing performance, delivering superior value and innovation to enhance your design endeavors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures longevity and reliable performance in various environments.

Surface Mount: YES

The surface mount design allows for compact placement on printed circuit boards, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Supports a wide range of operating voltages, enhancing compatibility with various power supplies.

Screening Level: AEC-Q100

Compliant with automotive standards, ensuring the microcontroller's reliability and performance in automotive applications.

Package Shape: SQUARE

The square shape facilitates an efficient layout on PCBs, optimizing space and routing.

Bit Size: 8

The 8-bit architecture is suitable for simple control tasks and efficient power management.

Power Supplies (V): 2/3.3

Versatile power supply options enhance flexibility in different application environments.

No. of Terminals: 48

A higher number of terminals allows for extensive connectivity and interfacing with other components.

Package Style (Meter): FLATPACK

Flatpack design promotes better heat dissipation and is ideal for automatic assembly processes.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage enables operation in energy-constrained applications.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance is suitable for industrial environments.

CPU Family: STM8

Part of the STM8 family, known for its balance of performance and power efficiency.

Minimum Operating Temperature: -40 °C

Extreme temperature range support ensures reliability in harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium finish enhances solderability and increases the lifespan of connections.

ADC Channels: YES

Integration of ADC channels enables easy interfacing with sensors and analog signals.

DMA Channels: YES

DMA capabilities improve data processing efficiency by offloading tasks from the CPU.

Terminal Position: QUAD

The quad terminal arrangement promotes improved signal integrity and reduces noise.

ROM Words: 8196

Adequate ROM capacity allows for substantial code storage and functionality.

Width: 7 mm

Compact width enhances design flexibility and integration into tight spaces.

Maximum Clock Frequency: 16 MHz

Sufficient clock frequency ensures responsive performance for applications requiring processing power.

Peak Reflow Temperature: 260

The high reflow temperature capability ensures compatibility with modern soldering techniques.

Length: 7 mm

A short length allows for a compact design footprint in electronic assemblies.

Temperature Grade: INDUSTRIAL

Robust industrial-grade specification ensures reliability in demanding applications.

Peripheral IC Type: MICROCONTROLLER

Microcontroller designation indicates suitability for a wide range of embedded applications.

RAM Bytes: 2048

Ample RAM size supports complex applications and data handling.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull-wing terminals facilitate efficient assembly and reliable connections in modern PCB designs.

Maximum Supply Current: 80 mA

Allows for adequate power consumption while maintaining performance; suitable for battery-powered devices.

Nominal Supply Voltage: 3 V

Standard nominal voltage makes it convenient to use in various electronic projects and products.

PWM Channels: YES

PWM channels enable efficient control of motors and other devices that require variable power.

ROM Programmability: FLASH

Flash ROM programmability allows easy updates and flexibility for firmware modifications.

Terminal Pitch: 0.5 mm

Fine pitch terminals promote a compact layout, enhancing design miniaturization.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating signifies that appropriate handling and storage conditions are required to maintain device performance.

Speed: 16 rpm

Adequate speed specification for applications requiring moderate processing capabilities.

No. of I/O Lines: 41

A high number of I/O lines supports versatile interfacing options for various peripherals and sensors.

Technical Specifications

Microcontrollers STM8AL3138TAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8196

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AL3138TAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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