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STM8AF62AATCX

STMicroelectronics

STM8AF62AATCX by STMicroelectronics

STM8AF62AATCX by STMicroelectronics is an 8-bit microcontroller with 131072 ROM words, 3072 RAM words, and a max clock frequency of 24 MHz. Ideal for automotive applications due to AEC-Q100 screening level, it features low power mode and PWM channels for efficient performance in automotive systems.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,429 parts In-Stock

1+ parts

-

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-

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-

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7,429

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-

-

-

Digiode

USA . 3,419 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

3,419

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-

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Anansix

USA . 1,928 parts In-Stock

1+ parts

-

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-

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1,928

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 275 parts In-Stock

1+ parts

$15.010

100+ parts

-

1k+ parts

-

10k+ parts

-

275

$15.010

-

-

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Microchip USA

USA . 3,017 parts In-Stock

1+ parts

$31.648

100+ parts

-

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-

10k+ parts

-

3,017

$31.648

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-

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IDEA Electronic Components Group

UK . 500 parts In-Stock

1+ parts

$41.893

100+ parts

-

1k+ parts

$37.704

10k+ parts

-

500

$41.893

-

$37.704

-

MKK Technologies

India . 70 parts In-Stock

1+ parts

$78.777

100+ parts

-

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70

$78.777

-

-

-

DigiPath Technology Company

USA . 70 parts In-Stock

1+ parts

$78.777

100+ parts

-

1k+ parts

-

10k+ parts

-

70

$78.777

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-

-

Vigor

Singapore . 2,375 parts In-Stock

1+ parts

-

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2,375

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Corphita

USA . 363 parts In-Stock

1+ parts

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363

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Parana Technologies

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$50.090

1k+ parts

-

10k+ parts

-

1

-

$50.090

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-

Overview

Unleash the power of innovation with the STM8AF62AATCX microcontroller by STMicroelectronics. With a focus on quality and reliability, STMicroelectronics has designed a cutting-edge product that offers unmatched performance for a wide range of applications. From automotive to industrial automation, this microcontroller provides value-added features such as low power mode and PWM channels, ensuring optimal functionality. Elevate your projects with the STM8AF62AATCX and experience the benefits of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and protection for the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space in the design.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even in demanding conditions, suitable for automotive and industrial applications.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility and ease of updating firmware, enabling future enhancements and customization.

ADC Channels: YES

Presence of ADC channels allows for analog to digital conversion, essential for interfacing with sensors and external analog signals.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and features in a single chip, making it a convenient and cost-effective solution for embedded systems.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast processing and response times, making the microcontroller suitable for applications requiring quick data processing or control.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption, making the microcontroller energy-efficient and suitable for battery-powered devices or applications requiring power efficiency.

Technical Specifications

Microcontrollers STM8AF62AATCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

68

No. of Terminals:

80

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

16.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM8AF62AATCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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