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STM8AF62A8TCX

STMicroelectronics

STM8AF62A8TCX by STMicroelectronics

STM8AF62A8TCX by STMicroelectronics is an 8-bit microcontroller with 3.3/5V power supplies, 24MHz clock frequency, and 6144 bytes of RAM. Ideal for automotive applications, it features ADC channels, PWM support, and connectivity options like I2C, LIN, SPI, UART, and USART.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,932 parts In-Stock

1+ parts

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2,932

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Digiode

USA . 2,242 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,242

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Anansix

USA . 230 parts In-Stock

1+ parts

-

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230

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,960 parts In-Stock

1+ parts

$2.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,960

$2.330

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-

-

AZTECH Wire

Italy . 1,178 parts In-Stock

1+ parts

$14.140

100+ parts

-

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-

10k+ parts

-

1,178

$14.140

-

-

-

IDEA Electronic Components Group

UK . 1,779 parts In-Stock

1+ parts

$21.038

100+ parts

-

1k+ parts

$18.934

10k+ parts

-

1,779

$21.038

-

$18.934

-

Microchip USA

USA . 3,454 parts In-Stock

1+ parts

$22.387

100+ parts

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3,454

$22.387

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MKK Technologies

India . 1,538 parts In-Stock

1+ parts

$39.560

100+ parts

-

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1,538

$39.560

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DigiPath Technology Company

USA . 1,538 parts In-Stock

1+ parts

$39.560

100+ parts

-

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1,538

$39.560

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Component Stockers USA

USA . 2,903 parts In-Stock

1+ parts

$46.250

100+ parts

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2,903

$46.250

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Eastek

USA . 7,200 parts In-Stock

1+ parts

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$4.430

10k+ parts

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7,200

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$4.430

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Parana Technologies

USA . 2,247 parts In-Stock

1+ parts

-

100+ parts

$25.154

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2,247

-

$25.154

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Corphita

USA . 563 parts In-Stock

1+ parts

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563

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Overview

Unlock unparalleled performance and reliability with the STM8AF62A8TCX microcontroller from STMicroelectronics. Built on cutting-edge technology, this automotive-grade device offers a wide range of applications including industrial control systems, consumer electronics, and automotive applications. With a maximum clock frequency of 24 MHz and a flash programmable ROM, this microcontroller delivers exceptional speed and versatility. Trust in STMicroelectronics' reputation for quality and innovation and experience the value and benefits that the STM8AF62A8TCX brings to your projects. Elevate your designs with this powerful and efficient microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, providing flexibility in design and compatibility with various power sources.

Screening Level: AEC-Q100

AEC-Q100 certification ensures reliability and quality for automotive applications, meeting industry standards for performance and durability.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy alignment during assembly.

Bit Size: 8

8-bit architecture provides cost-effective processing capability for a wide range of applications.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages allows for compatibility with different systems and energy efficiency.

No. of Terminals: 48

A large number of terminals provide ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack style with low profile and fine pitch design enhances thermal performance and enables compact system integration.

Minimum Supply Voltage: 3 V

Support for low supply voltage operation enables energy-efficient design and extends battery life in portable devices.

Maximum Operating Temperature: 125 °C

High operating temperature range enables reliable performance in harsh environments and automotive applications.

CPU Family: STM8

STM8 CPU family offers proven performance and compatibility with a wide range of development tools and software libraries.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme cold conditions, ideal for automotive and industrial use.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent corrosion resistance and reliable electrical connections for long-term use.

ADC Channels: YES

Integrated ADC channels enable analog sensor interfacing and data acquisition, expanding the range of applications supported.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and PCB layout, simplifying assembly and reducing manufacturing complexity.

ROM Words: 32768

Large ROM capacity allows for storing firmware and program data, supporting complex algorithms and applications.

Maximum Seated Height: 1.6 mm

Low profile package design minimizes board stack height and enhances system integration in space-constrained applications.

Width: 7 mm

Compact width dimension saves board space and enables sleek product designs in size-critical applications.

Data EEPROM Size: 2K

2K EEPROM size provides non-volatile data storage for critical information and parameter settings, ensuring data integrity across power cycles.

Peripherals: BOD, POR, TIMER(9)

Built-in peripherals such as Brown-Out Detection, Power-On Reset, and multiple timers enhance system reliability and functionality.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast data processing and real-time operation, meeting performance requirements for demanding applications.

Length: 7 mm

Compact length dimension saves board space and enables sleek product designs in size-critical applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable performance in extreme heat and cold conditions, meeting industry standards for automotive electronics.

Peripheral IC Type: MICROCONTROLLER

Microcontroller IC type integrates CPU, memory, and I/O peripherals in a single chip, simplifying system design and reducing component count.

RAM Bytes: 6144

Large RAM capacity enables efficient data processing and multitasking, supporting complex algorithms and real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated and noise-sensitive applications.

Terminal Form: GULL WING

Gull Wing terminal form provides reliable solder connections and thermal performance, enhancing durability in harsh operating conditions.

Analog To Digital Convertors: 10-Ch 10-Bit

10-channel 10-bit ADCs enable precise analog signal conversion for sensor interfacing and data acquisition, supporting a wide range of applications.

Maximum Supply Current: 16.8 mA

Low supply current consumption ensures energy-efficient operation and extends battery life in portable and battery-powered devices.

Nominal Supply Voltage: 5 V

5V nominal supply voltage provides compatibility with standard power sources and eliminates the need for external voltage regulation.

PWM Channels: YES

Integrated PWM channels enable precise control of digital signals for motor control, lighting, and power management applications.

Connectivity: I2C, LIN, SPI, UART, USART

Support for multiple communication interfaces enables seamless connectivity with sensors, displays, and external devices, enhancing system flexibility and versatility.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization, reducing time to market and improving product longevity.

Terminal Pitch: 0.5 mm

Narrow terminal pitch simplifies PCB layout and reduces signal crosstalk, enhancing signal integrity and system reliability.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture exposure, ensuring reliable performance in typical manufacturing and operating environments.

Speed: 24 rpm

High processing speed of 24 MIPS allows for fast data processing and real-time control in time-critical applications.

On Chip Program ROM Width: 32

32-bit on-chip program ROM width supports advanced data processing and efficient execution of complex algorithms.

No. of I/O Lines: 38

Ample I/O lines provide flexibility for interfacing with external devices, sensors, and peripherals, enabling versatile system integration.

Technical Specifications

Microcontrollers STM8AF62A8TCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

48

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

16.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C, LIN, SPI, UART, USART

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

STM8AF62A8TCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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