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STM8AF62A6UDY

STMicroelectronics

STM8AF62A6UDY by STMicroelectronics

STM8AF62A6UDY microcontroller from STMicroelectronics features a 24 MHz CPU, operates in extreme temps (-40 °C to 150 °C), and supports I2C, SPI, and UART connectivity. With 32 terminals and AEC-Q100 screening, it's ideal for automotive applications. Its low power mode enhances efficiency in demanding environments.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,970 parts In-Stock

1+ parts

-

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4,970

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-

-

-

Anansix

USA . 2,191 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,191

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Digiode

USA . 495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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495

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,468 parts In-Stock

1+ parts

$2.430

100+ parts

-

1k+ parts

-

10k+ parts

-

2,468

$2.430

-

-

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AZTECH Wire

Italy . 322 parts In-Stock

1+ parts

$10.770

100+ parts

-

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-

10k+ parts

-

322

$10.770

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Microchip USA

USA . 4,321 parts In-Stock

1+ parts

$23.419

100+ parts

-

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4,321

$23.419

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IDEA Electronic Components Group

UK . 915 parts In-Stock

1+ parts

$31.136

100+ parts

-

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$28.023

10k+ parts

-

915

$31.136

-

$28.023

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MKK Technologies

India . 714 parts In-Stock

1+ parts

$58.550

100+ parts

-

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-

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-

714

$58.550

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-

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DigiPath Technology Company

USA . 714 parts In-Stock

1+ parts

$58.550

100+ parts

-

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10k+ parts

-

714

$58.550

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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7,000

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Corphita

USA . 2,741 parts In-Stock

1+ parts

-

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2,741

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Parana Technologies

USA . 2,258 parts In-Stock

1+ parts

-

100+ parts

$37.228

1k+ parts

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2,258

-

$37.228

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Overview

Elevate your automotive innovations with the STM8AF62A6UDY microcontroller from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. Designed for demanding applications, this reliable chip thrives in extreme conditions, delivering superior performance and energy efficiency. With robust features and versatile connectivity options, it empowers developers to create smarter, safer vehicles. Experience unmatched value and reliability that only STMicroelectronics can provide—your partner in cutting-edge technology.

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for compact and efficient PCB designs, making it ideal for modern electronics.

Maximum Supply Voltage: 5.5 V

This higher supply voltage capability enhances compatibility with a wider range of power supplies.

On Chip Data RAM Width: 8

An 8-bit RAM width is suitable for various applications that require moderate data processing capabilities.

Screening Level: AEC-Q100

Certified for automotive applications, ensuring high reliability and performance in harsh environments.

Package Shape: SQUARE

The square package form factor is versatile, allowing for easier placement and efficient space usage on PCBs.

Bit Size: 8

An 8-bit microcontroller is ideal for simple control applications and low-power scenarios.

No. of Terminals: 32

With 32 terminals, this microcontroller provides ample connectivity options for various peripherals and components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Enhanced thermal management and a slim profile make it suitable for dense circuit designs.

Minimum Supply Voltage: 3 V

Operating at lower voltages allows for energy-efficient designs and extends battery life in portable applications.

Maximum Operating Temperature: 150 °C

High-temperature resilience makes this microcontroller perfect for automotive and industrial applications.

CPU Family: STM8

Belonging to the STM8 family, it is recognized for robust performance in a wide range of applications.

Minimum Operating Temperature: -40 °C

Operating in extreme conditions ensures reliability in challenging environments.

ADC Channels: YES

Integrated ADC channels enable easy interfacing with analog sensors, enhancing the versatility of the device.

Terminal Position: QUAD

The quad terminal configuration allows for efficient routing and reduced PCB space.

ROM Words: 131072

Significant ROM capacity allows for complex applications and firmware storage.

Maximum Seated Height: 1 mm

A low profile is advantageous for space-constrained designs.

RAM Words: 3072

Sufficient RAM enables smooth execution of applications requiring state retention and variable storage.

Width: 5 mm

Compact dimensions make this microcontroller suitable for space-sensitive applications.

Data EEPROM Size: 2K

On-chip EEPROM allows for non-volatile data storage, essential for maintaining configuration settings.

Peripherals: BOD, POR, TIMER(9)

Robust peripheral support adds functionality and helps in building sophisticated applications.

Maximum Clock Frequency: 24 MHz

A reasonable clock speed ensures good performance for most control applications without excessive power consumption.

Length: 5 mm

The small length helps in high-density PCB layouts, supporting modern design requirements.

Temperature Grade: AUTOMOTIVE

Designed for automotive environments, ensuring reliability in demanding conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it combines processing capabilities with peripheral control, making it versatile.

RAM Bytes: 6144

More RAM provides better performance for applications involving multitasking or complex calculations.

Technology: CMOS

CMOS technology allows for low power consumption, making it ideal for battery-operated devices.

Terminal Form: NO LEAD

No lead design enhances soldering quality and reliability in electronic applications.

Analog To Digital Convertors: 6-Ch 10-Bit

Multiple ADC channels with 10-bit resolution enable efficient conversions from sensor data to digital form.

Maximum Supply Current: 16.8 mA

Low supply current enhances energy efficiency, particularly in battery-powered devices.

Nominal Supply Voltage: 5 V

Standard operating voltage simplifies power supply design in various applications.

PWM Channels: YES

PWM support makes it suitable for motor control and other applications requiring precise signal modulation.

Connectivity: I2C, LIN, SPI, UART

Multiple connectivity options facilitate easy integration with a variety of sensors and other devices.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming, saving time during development and deployment.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for more compact designs and a higher density of components on the PCB.

Format: FIXED POINT

Fixed point format simplifies arithmetic operations in control applications, increasing processing speed.

Speed: 24 rpm

Defined speed ratings help ensure accurate performance in time-critical applications.

Low Power Mode: YES

The low power mode extends battery life and reduces heat dissipation, crucial for portable devices.

On Chip Program ROM Width: 8

An 8-bit wide ROM aligns well with the device architecture, leading to efficient execution of instructions.

No. of I/O Lines: 25

A generous number of I/O lines allows for diverse interfacing options with external components and systems.

Technical Specifications

Microcontrollers STM8AF62A6UDY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of I/O Lines:

25

No. of Terminals:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Current:

16.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C, LIN, SPI, UART

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

STM8AF62A6UDY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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