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STM8AF6288TAY

STMicroelectronics

STM8AF6288TAY by STMicroelectronics

STM8AF6288TAY by STMicroelectronics is an 8-bit microcontroller with 5.5V max supply voltage, 24MHz clock frequency, and 6144 RAM bytes. Ideal for industrial applications requiring low power mode, it features 38 I/O lines and on-chip FLASH ROM programmability.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,309 parts In-Stock

1+ parts

-

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-

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7,309

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-

-

-

Digiode

USA . 4,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,380

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-

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Anansix

USA . 887 parts In-Stock

1+ parts

-

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-

1k+ parts

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887

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,342 parts In-Stock

1+ parts

$1.830

100+ parts

-

1k+ parts

-

10k+ parts

-

1,342

$1.830

-

-

-

AZTECH Wire

Italy . 486 parts In-Stock

1+ parts

$9.620

100+ parts

-

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-

10k+ parts

-

486

$9.620

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-

-

Microchip USA

USA . 2,502 parts In-Stock

1+ parts

$17.740

100+ parts

-

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2,502

$17.740

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-

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IDEA Electronic Components Group

UK . 1,219 parts In-Stock

1+ parts

$74.683

100+ parts

-

1k+ parts

$67.215

10k+ parts

-

1,219

$74.683

-

$67.215

-

MKK Technologies

India . 526 parts In-Stock

1+ parts

$140.436

100+ parts

-

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10k+ parts

-

526

$140.436

-

-

-

DigiPath Technology Company

USA . 526 parts In-Stock

1+ parts

$140.436

100+ parts

-

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-

10k+ parts

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526

$140.436

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Futuretech Components

Singapore . 4,800 parts In-Stock

1+ parts

-

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4,800

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Parana Technologies

USA . 1,521 parts In-Stock

1+ parts

-

100+ parts

$89.295

1k+ parts

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1,521

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$89.295

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Corphita

USA . 1,193 parts In-Stock

1+ parts

-

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1,193

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Overview

Unlock endless possibilities with the STM8AF6288TAY microcontroller by STMicroelectronics. Crafted with precision and cutting-edge technology, this powerful device offers unrivaled performance in a compact package. Ideal for a wide range of applications, this microcontroller boasts high efficiency, seamless integration, and reliable functionality. Elevate your projects and unleash your creativity with the STM8AF6288TAY - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body ensures long-term reliability and ease of handling.

Surface Mount: YES

Surface mount capability enables easy integration onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Allows for a wider range of power supply options and flexibility in system design.

On Chip Data RAM Width: 8

Provides sufficient memory width for data processing and storage requirements.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Package Shape: SQUARE

Square package shape facilitates easy placement and alignment on the PCB.

Bit Size: 8

8-bit architecture supports basic computing needs and is cost-effective for many applications.

No. of Terminals: 48

Sufficient number of terminals for connectivity and interfacing with external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact and low-profile package style with fine pitch offers space-saving benefits and efficient PCB layout.

Minimum Supply Voltage: 3 V

Supports low power operation and extends battery life in portable devices.

Technical Specifications

Microcontrollers STM8AF6288TAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of I/O Lines:

38

No. of Terminals:

48

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

16.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AF6288TAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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