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STM8AF6266UDX

STMicroelectronics

STM8AF6266UDX by STMicroelectronics

STM8AF6266UDX by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 2048 bytes of RAM, 1K data EEPROM size, and 7-Ch 10-Bit ADC channels. Ideal for automotive applications due to its temperature grade and connectivity options like I2C, LIN, SPI, and UART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,229 parts In-Stock

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4,229

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Anansix

USA . 1,374 parts In-Stock

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1,374

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Digiode

USA . 532 parts In-Stock

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532

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Distributors (Availability)

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Vigor

Singapore . 4,115 parts In-Stock

1+ parts

$1.660

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4,115

$1.660

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Microchip USA

USA . 5,071 parts In-Stock

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$15.911

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5,071

$15.911

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AZTECH Wire

Italy . 605 parts In-Stock

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$16.300

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605

$16.300

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IDEA Electronic Components Group

UK . 585 parts In-Stock

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$42.808

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$38.527

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585

$42.808

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$38.527

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MKK Technologies

India . 298 parts In-Stock

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$80.497

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298

$80.497

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DigiPath Technology Company

USA . 298 parts In-Stock

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$80.497

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298

$80.497

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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Corphita

USA . 1,946 parts In-Stock

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1,946

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Parana Technologies

USA . 13 parts In-Stock

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$51.183

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13

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$51.183

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Overview

Unleash the power of innovation with the STM8AF6266UDX microcontroller by STMicroelectronics. Crafted with precision and expertise, this cutting-edge device offers unmatched quality and reliability. Ideal for a wide range of applications, from automotive to industrial automation, this microcontroller boasts advanced features like PWM channels and ADC converters. Experience seamless connectivity with I2C, LIN, SPI, and UART interfaces, while enjoying the benefits of its low power consumption and high-speed performance. Elevate your projects to new heights with the STM8AF6266UDX and stay ahead of the curve in the world of technology.

Feature Benefit Bullets

Surface Mount: YES

Surface Mount package makes it easier to mount the microcontroller onto a PCB, saving space and allowing for automated assembly, making it a convenient choice for mass production.

Maximum Supply Voltage: 5.5 V

Ability to handle a maximum supply voltage of 5.5V provides flexibility in power supply options and compatibility with a wide range of external components.

Bit Size: 8

8-bit architecture is suitable for handling general-purpose computing tasks efficiently, making it a cost-effective choice for many applications.

ADC Channels: YES

Presence of Analog to Digital Converter (ADC) channels allows for interfacing with analog sensors and signals, expanding the range of applications the microcontroller can be used for.

ROM Words: 8192

Large ROM (Read-Only Memory) size of 8192 words provides ample space for storing program code and data, enabling complex firmware and software applications to be implemented.

RAM Bytes: 2048

Generous RAM (Random Access Memory) size of 2048 bytes allows for efficient data storage and manipulation during program execution, enhancing the performance of the microcontroller.

PWM Channels: YES

Presence of Pulse Width Modulation (PWM) channels enables precise control of motor speeds, LED brightness, and other analog functions, making the microcontroller suitable for various control applications.

Connectivity: I2C, LIN, SPI, UART

Support for common communication protocols like I2C, LIN, SPI, and UART facilitates easy integration with other devices and systems, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers STM8AF6266UDX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of I/O Lines:

25

No. of Terminals:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

14 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, LIN, SPI, UART

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

STM8AF6266UDX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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