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STM8AF6266TDY

STMicroelectronics

STM8AF6266TDY by STMicroelectronics

STM8AF6266TDY by STMicroelectronics is an 8-bit microcontroller with 32 terminals, operating at a max clock frequency of 16 MHz. Ideal for automotive applications, it features 2048 bytes of RAM, 32768 ROM words, and supports PWM channels.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,622

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-

-

-

Chip Stock

USA . 3,670 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,670

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-

-

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Digiode

USA . 2,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,622

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-

-

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Anansix

USA . 1,543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,543

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,188 parts In-Stock

1+ parts

$1.830

100+ parts

-

1k+ parts

-

10k+ parts

-

2,188

$1.830

-

-

-

Ampacity Inc.

Singapore . 1,002 parts In-Stock

1+ parts

$16.000

100+ parts

-

1k+ parts

-

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-

1,002

$16.000

-

-

-

IDEA Electronic Components Group

UK . 2,151 parts In-Stock

1+ parts

$16.675

100+ parts

-

1k+ parts

$15.008

10k+ parts

-

2,151

$16.675

-

$15.008

-

Microchip USA

USA . 2,937 parts In-Stock

1+ parts

$17.024

100+ parts

-

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-

10k+ parts

-

2,937

$17.024

-

-

-

AZTECH Wire

Italy . 627 parts In-Stock

1+ parts

$18.870

100+ parts

-

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-

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627

$18.870

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-

-

MKK Technologies

India . 1,646 parts In-Stock

1+ parts

$31.356

100+ parts

-

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-

10k+ parts

-

1,646

$31.356

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DigiPath Technology Company

USA . 1,646 parts In-Stock

1+ parts

$31.356

100+ parts

-

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-

10k+ parts

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1,646

$31.356

-

-

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Component Stockers USA

USA . 2,553 parts In-Stock

1+ parts

$37.720

100+ parts

-

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2,553

$37.720

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Perfect Parts

USA . 133,280 parts In-Stock

1+ parts

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133,280

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Parana Technologies

USA . 1,757 parts In-Stock

1+ parts

-

100+ parts

$19.938

1k+ parts

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1,757

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$19.938

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Corphita

USA . 1,180 parts In-Stock

1+ parts

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1,180

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Overview

Unlock the full potential of your automotive applications with the STM8AF6266TDY Microcontroller from STMicroelectronics. Designed with cutting-edge technology and high-quality materials, this microcontroller offers unmatched performance and reliability. With a wide range of features including ADC channels, PWM channels, and 2048 RAM bytes, this compact yet powerful device is perfect for a variety of automotive projects. Trust in STMicroelectronics to deliver top-notch solutions for your microcontroller needs. Experience the difference with the STM8AF6266TDY today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller.

Surface Mount: YES

Makes it easier to integrate the microcontroller onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of operating voltages, increasing compatibility with different power sources.

Screening Level: AEC-Q100

Ensures that the microcontroller meets automotive industry standards for quality and reliability.

Package Shape: SQUARE

Provides a compact form factor for easier integration into electronic designs.

Bit Size: 8

Suitable for handling a variety of data processing tasks with precision and efficiency.

Power Supplies (V): 3.3/5

Allows flexibility in power input options, catering to different system requirements.

No. of Terminals: 32

Provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

Enables a slim and space-saving design for applications where size constraints are a concern.

Minimum Supply Voltage: 3 V

Ensures reliable operation even with lower voltage power sources.

Maximum Operating Temperature: 150 °C

Ideal for automotive and industrial applications where high temperatures may be encountered.

CPU Family: STM8

Belongs to a reputable and well-established microcontroller family known for high performance and reliability.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments, suitable for a wide range of applications.

Terminal Finish: TIN

Provides corrosion resistance and good electrical conductivity for reliable connections.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with sensors, actuators, and other analog components.

Terminal Position: QUAD

Offers multiple connection points for flexible PCB layout and design.

ROM Words: 32768

Sufficient memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design facilitates compact and slim product form factors.

Width: 7 mm

Compact size for easy integration into various electronic devices.

Maximum Clock Frequency: 16 MHz

Provides high-speed processing capabilities for demanding applications.

Length: 7 mm

Compact footprint for space-constrained electronic designs.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliability and performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Features a Reduced Instruction Set Computing (RISC) architecture for efficient data processing.

RAM Bytes: 2048

Adequate random-access memory for storing temporary data and variables during program execution.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering and PCB assembly processes.

Maximum Supply Current: 14 mA

Efficient power consumption for improved energy efficiency and battery life.

Nominal Supply Voltage: 5 V

Standard voltage level for compatibility with a wide range of electronic components.

PWM Channels: YES

Supports Pulse-Width Modulation for precise control of analog devices and motors.

ROM Programmability: FLASH

Offers reprogrammable Flash memory for easy updates and modifications to the program code.

Terminal Pitch: 0.8 mm

Provides a compact and fine-pitch layout for high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

Suitable for applications with moderate exposure to moisture and humidity.

Speed: 16 rpm

High clock speed for rapid data processing and response times.

No. of I/O Lines: 25

Offers a sufficient number of Input/Output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers STM8AF6266TDY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

25

No. of Terminals:

32

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

14 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AF6266TDY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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