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STM8AF6246ITDY

STMicroelectronics

STM8AF6246ITDY by STMicroelectronics

STM8AF6246ITDY from STMicroelectronics is an 8-bit RISC microcontroller with a max supply voltage of 5.5V and operates at up to 16 MHz. It features 25 I/O lines, ADC channels, and PWM capabilities, making it ideal for automotive applications. Its compact FLATPACK design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,783 parts In-Stock

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Anansix

USA . 2,398 parts In-Stock

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2,398

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Digiode

USA . 315 parts In-Stock

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315

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Distributors (Availability)

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AZTECH Wire

Italy . 966 parts In-Stock

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$10.940

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966

$10.940

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Microchip USA

USA . 3,536 parts In-Stock

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$15.849

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3,536

$15.849

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IDEA Electronic Components Group

UK . 599 parts In-Stock

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$49.693

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$44.724

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599

$49.693

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$44.724

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MKK Technologies

India . 574 parts In-Stock

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$93.444

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574

$93.444

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DigiPath Technology Company

USA . 574 parts In-Stock

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$93.444

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574

$93.444

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Parana Technologies

USA . 1,562 parts In-Stock

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$59.415

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Corphita

USA . 1,533 parts In-Stock

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Overview

Unlock the potential of your next project with the STM8AF6246ITDY microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, this compact powerhouse is perfect for diverse applications, from automotive to industrial control. With low power consumption and robust performance, it helps streamline designs while maximizing efficiency. Choose STMicroelectronics for cutting-edge innovation that elevates your product development and drives success!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact design and easy integration into modern circuit boards.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a variety of standard power supplies, enhancing versatility.

Package Shape: SQUARE

The square package shape aids in effective space utilization on PCBs, making layout easier.

Bit Size: 8

With an 8-bit architecture, this microcontroller is ideal for simple applications requiring basic computing tasks.

No. of Terminals: 32

The 32 terminals provide ample I/O connections, allowing for a wide range of peripherals and connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile package allows for minimal space consumption and is suitable for applications with height restrictions.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V makes this microcontroller suitable for battery-powered applications.

ADC Channels: YES

Having ADC channels allows for analog signal processing, making it versatile for various sensor applications.

Terminal Position: QUAD

The quad terminal position facilitates easier mounting and connections on printed circuit boards.

ROM Words: 16384

With 16384 ROM words, this microcontroller offers sufficient memory for many embedded applications.

Width: 7 mm

A compact width of 7 mm allows for space-saving designs in tight environments.

Maximum Clock Frequency: 16 MHz

The maximum clock frequency of 16 MHz provides adequate processing speed for a variety of embedded tasks.

Length: 7 mm

The length of 7 mm contributes to the compact form factor, making it suitable for miniaturized devices.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it improves efficiency and performance for executing instructions.

Technology: CMOS

CMOS technology enhances power efficiency, ensuring longer battery life for portable devices.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and enables better mechanical stability on PCBs.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard for most electronic applications, ensuring broad applicability.

PWM Channels: YES

Having PWM channels allows for effective control of motors and lighting, enhancing application capabilities.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch enables high-density connections, accommodating more components in tight spaces.

Speed: 16 rpm

A speed rating of 16 rpm indicates potential use in low-speed motor control applications.

No. of I/O Lines: 25

With 25 I/O lines, this microcontroller supports broad interfacing options, suitable for most embedded systems.

Technical Specifications

Microcontrollers STM8AF6246ITDY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

NO

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

25

No. of Terminals:

32

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

16384

Speed:

16 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AF6246ITDY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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