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STM8AF5286UDX

STMicroelectronics

STM8AF5286UDX by STMicroelectronics

STM8AF5286UDX from STMicroelectronics is an 8-bit microcontroller designed for automotive applications, featuring a max supply voltage of 5.5V and operating temp range of -40 °C to 150 °C. It includes 32 terminals, 25 I/O lines, and supports ADC/PWM channels. Ideal for low-power designs with a flash ROM capacity of 64KB.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,677 parts In-Stock

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2,677

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Anansix

USA . 2,061 parts In-Stock

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2,061

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Digiode

USA . 1,969 parts In-Stock

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1,969

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Distributors (Availability)

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Vigor

Singapore . 1,233 parts In-Stock

1+ parts

$2.220

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-

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1,233

$2.220

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AZTECH Wire

Italy . 1,112 parts In-Stock

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$11.330

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1,112

$11.330

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Microchip USA

USA . 4,718 parts In-Stock

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$18.703

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4,718

$18.703

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IDEA Electronic Components Group

UK . 2,252 parts In-Stock

1+ parts

$37.796

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$34.017

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2,252

$37.796

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$34.017

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Component Stockers USA

USA . 2,360 parts In-Stock

1+ parts

$52.690

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2,360

$52.690

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MKK Technologies

India . 308 parts In-Stock

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$71.074

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308

$71.074

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DigiPath Technology Company

USA . 308 parts In-Stock

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$71.074

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308

$71.074

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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7,000

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Corphita

USA . 4,803 parts In-Stock

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4,803

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Parana Technologies

USA . 412 parts In-Stock

1+ parts

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$45.191

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412

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$45.191

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Overview

Unlock exceptional performance with the STM8AF5286UDX from STMicroelectronics, a leading name in microcontroller innovation. Designed for automotive applications, this reliable chip ensures high-quality operation even in extreme conditions, supporting your projects with low power consumption and impressive processing capabilities. Trust in ST's commitment to excellence and elevate your designs with a microcontroller that seamlessly combines durability, efficiency, and advanced functionality.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient use of space on PCBs, making it suitable for compact applications.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage provides flexibility and compatibility with a variety of power sources.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows more efficient data handling for applications requiring moderate processing.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures reliability and durability in automotive applications, enhancing safety.

Package Shape: SQUARE

The square package shape is ideal for dense layouts and efficient thermal management.

Bit Size: 8

An 8-bit architecture is suitable for simple embedded applications needing efficient computation.

No. of Terminals: 32

With 32 terminals, this microcontroller supports a multitude of external connections, enhancing its versatility.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style facilitates enhanced cooling and is ideal for applications with limited vertical space.

Minimum Supply Voltage: 3 V

The minimum supply voltage allows for operation in low-power conditions, extending battery life in portable devices.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature makes this microcontroller suitable for harsh environments, particularly in automotive applications.

CPU Family: STM8

Being part of the STM8 family, this microcontroller offers proven performance and support, enhancing developer confidence.

Minimum Operating Temperature: -40 °C

Ability to operate at -40 °C ensures reliability in extreme cold conditions, essential for outdoor and automotive applications.

ADC Channels: YES

Integrated ADC channels allow for direct digital conversion of analog signals, simplifying design and reducing components.

Terminal Position: QUAD

The quad terminal position allows for easier routing and space savings on circuit boards.

ROM Words: 65536

With 65536 ROM words available, ample memory is provided for program storage, supporting complex applications.

Maximum Seated Height: 1 mm

A low seated height reduces device profile, allowing for more compact designs.

RAM Words: 3072

With 3072 RAM words, this microcontroller supports moderate data processing needs, allowing for efficient application performance.

Width: 5 mm

The compact width is ideal for space-constrained designs, especially in portable electronics.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz provides good performance for processing without overly consuming power.

Length: 5 mm

Similar to the width, the compact length ensures that this microcontroller can fit into tight spaces.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, this microcontroller meets the high reliability and performance standards needed in vehicles.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing, memory, and peripherals, allowing for a comprehensive control solution.

RAM Bytes: 6144

The total of 6144 RAM bytes supports more data storage for temporary use, enhancing application capabilities.

Technology: CMOS

Using CMOS technology ensures low power consumption, making this microcontroller ideal for battery-operated devices.

Terminal Form: NO LEAD

No lead terminal form reduces the footprint, facilitating more compact designs and easier soldering.

Maximum Supply Current: 16.8 mA

A maximum supply current of 16.8 mA ensures that it can run efficiently under moderate load conditions.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is commonly used in various applications, making it easy to integrate.

PWM Channels: YES

Incorporation of PWM channels enables versatile control of motors and other actuators, expanding application use cases.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, improving long-term usability.

Terminal Pitch: 0.5 mm

A tight terminal pitch of 0.5 mm allows for more compact layouts while ensuring reliable connections.

Format: FIXED POINT

The fixed-point format is suitable for applications requiring predictable performance and minimal processing overhead.

Speed: 24 rpm

This speed indicates effective performance in control applications, including motor driving and sensor interactions.

Low Power Mode: YES

A low power mode feature extends battery life in portable applications, making it ideal for energy-sensitive products.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for simple instructions, facilitating easier programming for developers.

No. of I/O Lines: 25

With 25 I/O lines available, this microcontroller offers extensive connectivity options for various peripherals.

Technical Specifications

Microcontrollers STM8AF5286UDX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of I/O Lines:

25

No. of Terminals:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Current:

16.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM8AF5286UDX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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