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STM8AF5286UAX

STMicroelectronics

STM8AF5286UAX by STMicroelectronics

STM8AF5286UAX microcontroller from STMicroelectronics features a 24 MHz CPU, operates b/w -40 °C to 85 °C, and supports up to 25 I/O lines. With AEC-Q100 screening, it's ideal for industrial applications requiring reliability. Its low power mode enhances efficiency in embedded systems.

Median Price

$2.430

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 12,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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12,000

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Distributors (In-Stock)

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TME

Poland . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.430

12,000

-

-

-

$2.430

Vyrian

USA . 8,302 parts In-Stock

1+ parts

-

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-

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8,302

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-

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Anansix

USA . 2,136 parts In-Stock

1+ parts

-

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2,136

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Digiode

USA . 2,019 parts In-Stock

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2,019

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 4,746 parts In-Stock

1+ parts

$16.595

100+ parts

-

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-

10k+ parts

-

4,746

$16.595

-

-

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AZTECH Wire

Italy . 336 parts In-Stock

1+ parts

$19.630

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-

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-

10k+ parts

-

336

$19.630

-

-

-

IDEA Electronic Components Group

UK . 1,269 parts In-Stock

1+ parts

$46.611

100+ parts

-

1k+ parts

$41.950

10k+ parts

-

1,269

$46.611

-

$41.950

-

MKK Technologies

India . 400 parts In-Stock

1+ parts

$87.649

100+ parts

-

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-

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-

400

$87.649

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DigiPath Technology Company

USA . 400 parts In-Stock

1+ parts

$87.649

100+ parts

-

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10k+ parts

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400

$87.649

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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7,000

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Corphita

USA . 1,504 parts In-Stock

1+ parts

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1,504

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Parana Technologies

USA . 1,313 parts In-Stock

1+ parts

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100+ parts

$55.730

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1,313

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$55.730

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Overview

Unlock your next innovation with the STM8AF5286UAX microcontroller from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. Designed for demanding industrial applications, this versatile and compact chip offers exceptional performance, reliability, and low power consumption, ensuring seamless operation in harsh environments. Experience enhanced control and efficiency in your designs while benefiting from ST’s commitment to quality and support—empowering your projects to thrive!

Feature Benefit Bullets

Surface Mount: YES

This surface mount design allows for more compact PCB layouts, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility in a variety of circuit designs and ensures compatibility with different power sources.

On Chip Data RAM Width: 8

With an 8-bit data RAM width, this microcontroller supports efficient data processing suitable for a wide range of applications.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures reliability and performance in automotive and industrial environments.

Package Shape: SQUARE

The square package shape facilitates layout design and may help improve thermal performance.

Bit Size: 8

An 8-bit architecture is well-suited for simpler control tasks, making it cost-effective for many utility and consumer applications.

No. of Terminals: 32

With 32 terminals, there are ample opportunities for I/O connections, maximizing interfacing capabilities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink compatibility make it efficient for high-density applications where thermal management is crucial.

Minimum Supply Voltage: 3 V

This low supply voltage allows operation in battery-powered devices, enhancing power efficiency.

Maximum Operating Temperature: 85 °C

The operating temperature range allows application in diverse environments, making it suitable for industrial and automotive uses.

CPU Family: STM8

STM8 CPUs are known for their cost-effectiveness and performance, ensuring value in embedded system design.

Minimum Operating Temperature: -40 °C

This extended low temperature range ensures reliable operation in harsh environments, increasing the controller's versatility.

ADC Channels: YES

Integrated ADC channels provide capabilities for sensing applications, making it suitable for a variety of measurement tasks.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB routing and assembly, enhancing manufacturability.

ROM Words: 65536

The ROM capacity allows for ample program storage, enabling complex applications without compromising performance.

Maximum Seated Height: 1 mm

A low seated height facilitates use in slim designs, which is advantageous in portable devices.

RAM Words: 3072

Sufficient RAM allows for effective data manipulation and real-time processing capabilities in applications.

Width: 5 mm

The compact width aids in PCB layout efficiency, allowing for denser circuit configurations.

Maximum Clock Frequency: 24 MHz

A 24 MHz clock frequency delivers the processing speed necessary for most embedded applications.

Length: 5 mm

With a length of 5 mm, this microcontroller fits well into tight spaces, optimizing design options.

Temperature Grade: INDUSTRIAL

The industrial grade ensures reliability and robustness in demanding applications, enhancing product lifespan.

Peripheral IC Type: MICROCONTROLLER

This microcontroller design is tailored for interfacing and control tasks, making it a good choice for various embedded systems.

RAM Bytes: 6144

A total of 6144 bytes of RAM provides sufficient workspace for applications that require moderate data storage and manipulation.

Technology: CMOS

CMOS technology is known for its low power consumption, making it suitable for battery-operated devices.

Terminal Form: NO LEAD

The no lead configuration enhances thermal performance and compatibility with modern PCB manufacturing processes.

Maximum Supply Current: 16.8 mA

A maximum supply current of 16.8 mA ensures low power operation, which is crucial for energy-efficient designs.

Nominal Supply Voltage: 5 V

The standard 5 V supply voltage is commonly used, simplifying design and integration with existing systems.

PWM Channels: YES

PWM channels enable precise control of motors and other actuators, making it useful for various control systems.

ROM Programmability: FLASH

The use of flash memory for ROM allows for easy updates to firmware, enabling rapid development cycles.

Terminal Pitch: 0.5 mm

The narrow terminal pitch allows for higher density designs, supporting more complex circuitry in smaller footprints.

Format: FIXED POINT

Fixed point format provides predictable behavior and performance for embedded applications where floating-point performance is unnecessary.

Speed: 24 rpm

A speed of 24 rpm suggests capabilities for specific motion control applications, such as in robotics.

Low Power Mode: YES

Low power mode capability extends battery life in portable applications, enhancing usability in field devices.

On Chip Program ROM Width: 8

The 8-bit program ROM width aligns well with the 8-bit architecture, optimizing processing efficiency.

No. of I/O Lines: 25

With 25 I/O lines, there’s ample connectivity for peripherals, making this microcontroller versatile for various projects.

Technical Specifications

Microcontrollers STM8AF5286UAX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of I/O Lines:

25

No. of Terminals:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Current:

16.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM8AF5286UAX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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