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STM8AF5266TCX

STMicroelectronics

STM8AF5266TCX by STMicroelectronics

STM8AF5266TCX by STMicroelectronics is an 8-bit microcontroller with 24 MHz clock frequency, 25 I/O lines, and ADC & PWM channels. It operates b/w 3-5.5 V, in a square package style measuring 7x7 mm. Ideal for applications requiring high-speed processing and precise analog-to-digital conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,968 parts In-Stock

1+ parts

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4,968

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Digiode

USA . 3,523 parts In-Stock

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3,523

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Anansix

USA . 2,640 parts In-Stock

1+ parts

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2,640

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,664 parts In-Stock

1+ parts

$69.496

100+ parts

-

1k+ parts

$62.546

10k+ parts

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1,664

$69.496

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$62.546

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MKK Technologies

India . 1,364 parts In-Stock

1+ parts

$130.682

100+ parts

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1,364

$130.682

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DigiPath Technology Company

USA . 1,364 parts In-Stock

1+ parts

$130.682

100+ parts

-

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10k+ parts

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1,364

$130.682

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Corphita

USA . 4,797 parts In-Stock

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4,797

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Parana Technologies

USA . 1,578 parts In-Stock

1+ parts

-

100+ parts

$83.093

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-

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1,578

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$83.093

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Overview

Unlock the power of innovation with the STM8AF5266TCX microcontroller by STMicroelectronics. This cutting-edge device boasts top-tier quality and reliability from a trusted manufacturer, making it perfect for a wide range of applications. With its fast clock frequency, multitude of I/O lines, and versatile ADC and PWM channels, this microcontroller offers unparalleled value and flexibility to customers looking to bring their projects to life. Say goodbye to limitations and hello to endless possibilities with the STM8AF5266TCX.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, making this microcontroller convenient for manufacturers.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5V allows for versatility in different power supply setups.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the PCB, making it suitable for compact designs.

Bit Size: 8

The 8-bit architecture provides a good balance between performance and cost, making it suitable for various applications.

ADC Channels: YES

Having ADC channels allows for analog inputs to be easily interfaced with the microcontroller, increasing versatility in sensor applications.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3V ensures compatibility with a wide range of power sources.

Maximum Clock Frequency: 24 MHz

A high maximum clock frequency of 24MHz enables faster processing of instructions, suitable for applications requiring real-time operation.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals on a single chip, reducing external component count and design complexity.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V aligns with standard voltage levels in many electronic systems, ensuring compatibility.

PWM Channels: YES

Support for PWM channels allows for precise control of output signals, ideal for applications such as motor control and LED dimming.

Technical Specifications

Microcontrollers STM8AF5266TCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

24 MHz

DMA Channels:

NO

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

25

No. of Terminals:

32

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AF5266TCX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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