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STM6779VWB6F

STMicroelectronics

STM6779VWB6F by STMicroelectronics

STM6779VWB6F from STMicroelectronics is a compact power management IC with a nominal voltage of 3.3 V, supporting a range of 0.8 to 5.5 V. It operates in extreme temperatures from -40 °C to 85°C and features adjustable thresholds for versatile applications in industrial settings. Its small outline design ensures efficient space utilization on PCBs.

Median Price

$1.178

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 290 parts In-Stock

1+ parts

$3.020

100+ parts

$1.550

1k+ parts

$1.070

10k+ parts

$0.957

290

$3.020

$1.550

$1.070

$0.957

Rochester

USA . 4,476 parts In-Stock

1+ parts

-

100+ parts

$1.530

1k+ parts

$1.270

10k+ parts

$1.130

4,476

-

$1.530

$1.270

$1.130

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.825

3,000

-

-

-

$0.825

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.638

3,000

-

-

-

$0.638

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,237 parts In-Stock

1+ parts

$0.773

100+ parts

-

1k+ parts

-

10k+ parts

-

3,237

$0.773

-

-

-

IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.795

3,000

-

-

-

$0.795

TME

Poland . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.901

3,000

-

-

-

$0.901

Vyrian

USA . 2,877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,877

-

-

-

-

Component Sense

UK . 1,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,280

-

-

-

-

Anansix

USA . 1,057 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,057

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,925 parts In-Stock

1+ parts

$0.733

100+ parts

-

1k+ parts

-

10k+ parts

-

3,925

$0.733

-

-

-

Vigor

Singapore . 5,000 parts In-Stock

1+ parts

$0.950

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

$0.950

-

-

-

Component Stockers USA

USA . 598 parts In-Stock

1+ parts

$1.570

100+ parts

$1.140

1k+ parts

-

10k+ parts

-

598

$1.570

$1.140

-

-

IDEA Electronic Components Group

UK . 2,058 parts In-Stock

1+ parts

$21.496

100+ parts

-

1k+ parts

$19.346

10k+ parts

-

2,058

$21.496

-

$19.346

-

Advanced Electronics

New Zealand . 41 parts In-Stock

1+ parts

$22.736

100+ parts

$20.690

1k+ parts

$18.644

10k+ parts

-

41

$22.736

$20.690

$18.644

-

MKK Technologies

India . 379 parts In-Stock

1+ parts

$40.421

100+ parts

-

1k+ parts

-

10k+ parts

-

379

$40.421

-

-

-

DigiPath Technology Company

USA . 379 parts In-Stock

1+ parts

$40.421

100+ parts

-

1k+ parts

-

10k+ parts

-

379

$40.421

-

-

-

Microchip USA

USA . 6,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,038

-

-

-

-

Perfect Parts

USA . 5,224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,224

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Parana Technologies

USA . 613 parts In-Stock

1+ parts

-

100+ parts

$25.702

1k+ parts

-

10k+ parts

-

613

-

$25.702

-

-

Overview

Unlock unparalleled efficiency with the STM6779VWB6F from STMicroelectronics, a leader in power management solutions. This compact and robust IC is designed to optimize performance across various applications, from industrial controls to consumer electronics. With its low-profile design and superior temperature resilience, it ensures reliable operation in demanding environments. Choose STM6779VWB6F for enhanced reliability and innovation, empowering your projects to reach new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and longevity in various environments, making this IC suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration into modern PCB layouts, saving space and enhancing performance.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient use of PCB space and aligns well with standard component designs, simplifying assembly.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3 V is commonly used in many applications, making this IC compatible with a wide range of systems.

Power Supplies (V): 0.8/5.5 V

Supporting a wide voltage range allows versatility in design, accommodating different operational requirements and enhancing application flexibility.

No. of Terminals: 6

With 6 terminals, this IC provides sufficient connectivity for various functionalities while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile and shrink pitch design optimizes layout density, enabling high-performance applications in space-constrained environments.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in high-heat applications, making it suitable for industrial and automotive environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC can perform reliably in extreme cold conditions, expanding its application range.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers excellent solderability and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning enables flexible routing on printed circuit boards, enhancing layout design options.

Maximum Seated Height: 1.45 mm

A low seated height contributes to a compact design profile, facilitating integration into slim devices.

Width: 1.6 mm

The narrow width allows for high-density applications, making it ideal for space-constrained PCB layouts.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC enhances power management, ensuring efficient energy use and improved overall system performance.

Minimum Supply Voltage (Vsup): 0.8 V

With a minimum supply voltage as low as 0.8 V, this IC is designed to operate effectively in low-power applications, promoting energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow temperature tolerance of 30 seconds indicates robust thermal resistance during manufacturing processes, ensuring product integrity.

Peak Reflow Temperature °C: 260 °C

A high peak reflow temperature capability ensures compatibility with modern soldering processes, which is crucial for reliable assembly.

Length: 2.9 mm

A compact length allows for greater placement versatility on PCBs, optimizing designs in diverse applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures this IC can withstand harsh conditions, making it ideal for use in demanding environments.

Maximum Supply Current (Isup): 0.035 mA

With a maximum supply current of only 0.035 mA, this IC promotes low-power designs, which is ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical support and enable strong solder joints, ensuring reliable electrical connections.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm balances between space-saving and ease of soldering, facilitating the assembly process without sacrificing performance.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V allows for flexibility in various designs, accommodating different input power conditions.

Adjustable Threshold: YES

The adjustable threshold feature provides design flexibility, allowing customization of performance parameters to meet specific application requirements.

Technical Specifications

Power Management ICs STM6779VWB6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 1.575V; MANUAL RESET INPUT

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.035 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

STM6779VWB6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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