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STM6777TZWB6F

STMicroelectronics

STM6777TZWB6F by STMicroelectronics

STM6777TZWB6F by STMicroelectronics is a compact power management IC with a nominal voltage of 3.3V, operating b/w -40 °C to 85°C. It features adjustable thresholds and supports voltages from 0.8V to 5.5V, ideal for industrial applications. Its small outline design ensures efficient space utilization in electronic devices.

Median Price

$2.230

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 99 parts In-Stock

1+ parts

$2.230

100+ parts

$1.050

1k+ parts

$0.725

10k+ parts

$0.605

99

$2.230

$1.050

$0.725

$0.605

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 410 parts In-Stock

1+ parts

$1.672

100+ parts

-

1k+ parts

-

10k+ parts

-

410

$1.672

-

-

-

Vyrian

USA . 2,432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,432

-

-

-

-

Anansix

USA . 1,109 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,109

-

-

-

-

Bristol Electronics

USA . 35 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 8,675 parts In-Stock

1+ parts

$0.540

100+ parts

-

1k+ parts

-

10k+ parts

-

8,675

$0.540

-

-

-

Corphita

USA . 396 parts In-Stock

1+ parts

$1.584

100+ parts

-

1k+ parts

-

10k+ parts

-

396

$1.584

-

-

-

Microchip USA

USA . 5,883 parts In-Stock

1+ parts

$5.349

100+ parts

-

1k+ parts

-

10k+ parts

-

5,883

$5.349

-

-

-

IDEA Electronic Components Group

UK . 240 parts In-Stock

1+ parts

$10.639

100+ parts

-

1k+ parts

$9.575

10k+ parts

-

240

$10.639

-

$9.575

-

MKK Technologies

India . 2,019 parts In-Stock

1+ parts

$20.006

100+ parts

-

1k+ parts

-

10k+ parts

-

2,019

$20.006

-

-

-

DigiPath Technology Company

USA . 2,019 parts In-Stock

1+ parts

$20.006

100+ parts

-

1k+ parts

-

10k+ parts

-

2,019

$20.006

-

-

-

Advanced Electronics

New Zealand . 74 parts In-Stock

1+ parts

$29.412

100+ parts

$26.765

1k+ parts

$24.118

10k+ parts

-

74

$29.412

$26.765

$24.118

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

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A-Z Elektronik GmbH

Germany . 5,523 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,523

-

-

-

-

RC Electronics

USA . 5,240 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,240

-

-

-

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Perfect Parts

USA . 3,360 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,360

-

-

-

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Parana Technologies

USA . 1,521 parts In-Stock

1+ parts

-

100+ parts

$12.720

1k+ parts

-

10k+ parts

-

1,521

-

$12.720

-

-

Overview

Elevate your design with the STM6777TZWB6F from STMicroelectronics, a trusted leader in power management solutions. This compact IC delivers exceptional performance across diverse applications—from industrial automation to consumer electronics—ensuring reliability even in extreme temperatures. With its low-profile package and adjustable thresholds, it's engineered for efficiency and versatility, providing significant benefits that empower your innovation while optimizing energy consumption. Choose STM6777TZWB6F for unmatched quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Robust and reliable, ensuring durability and protection for the internal components.

Surface Mount: YES

Facilitates easy and efficient installation on PCBs, saving space and time during assembly.

Package Shape: RECTANGULAR

Optimizes space on the PCB, allowing for greater component density and design flexibility.

Nominal Supply Voltage (Vsup): 3.3 V

Commonly used voltage level, compatible with a wide range of digital electronics and microcontrollers.

Power Supplies (V): 0.8/5.5

Versatile supply voltage range supports various applications, improving design versatility.

No. of Terminals: 6

Provides sufficient connectivity for essential functions, compact design while maintaining functionality.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Ideal for space-constrained applications; ensures a low profile on PCBs for enhanced design options.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperature resilience is required.

Minimum Operating Temperature: -40 °C

Enables operation in extreme environments, making it suitable for automotive and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and improves the reliability of electrical connections.

Terminal Position: DUAL

Facilitates optimal layout and routing on the PCB, enhancing overall design efficiency.

Maximum Seated Height: 1.45 mm

Low profile design ideal for compact applications, reducing overall device height.

Width: 1.6 mm

Compact width allows for space optimization on PCBs, enhancing placement options.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specialized for power management tasks, ensuring reliable operation of connected components.

Minimum Supply Voltage (Vsup): 0.8 V

Low voltage operation enables compatibility with energy-efficient designs and low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for proper soldering without thermal damage, ensuring high quality in production.

Peak Reflow Temperature °C: 260

High reflow temperature capability to withstand lead-free soldering processes.

Length: 2.9 mm

Compact length facilitates placement in smaller designs, maximizing PCB real estate.

Nominal Threshold Voltage (V): +3.075, 2.313V

Adjustable thresholds provide flexibility in application design, catering to specific needs.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, ensuring reliability and performance in challenging conditions.

Maximum Supply Current (Isup): 0.035 mA

Low current consumption enhances energy efficiency, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Facilitates efficient soldering and ensures optimal connection integrity on the PCB.

Terminal Pitch: 0.95 mm

Standard pitch allows for compatibility with various PCB designs, simplifying manufacturing.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a wide range of applications, allowing for greater design flexibility.

Adjustable Threshold: YES

Provides design engineers with the ability to customize performance for specific applications.

Technical Specifications

Power Management ICs STM6777TZWB6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGES ARE 3.075V AND 2.313V; MANUAL RESET INPUT

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.035 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.075,2.313V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

STM6777TZWB6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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