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STM6777SVWB6F

STMicroelectronics

STM6777SVWB6F by STMicroelectronics

STM6777SVWB6F by STMicroelectronics is a compact power management IC with a nominal voltage of 3.3V and operates b/w -40 °C to 85°C. It features adjustable thresholds, supports voltages from 0.8V to 5.5V, and comes in a low-profile package ideal for industrial applications. With its small footprint and efficient design, it's perfect for space-constrained environments.

Median Price

$0.974

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,555 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,555

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

3,000

-

-

-

-

Bristol Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.974

1k+ parts

$0.545

10k+ parts

$0.514

3,000

-

$0.974

$0.545

$0.514

Dan-Mar Components

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

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3,000

-

-

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Anansix

USA . 2,794 parts In-Stock

1+ parts

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2,794

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Digiode

USA . 363 parts In-Stock

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363

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Distributors (Availability)

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$0.470

100+ parts

-

1k+ parts

-

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-

2,500

$0.470

-

-

-

Ampacity Inc.

Singapore . 1,047 parts In-Stock

1+ parts

$3.500

100+ parts

-

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-

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-

1,047

$3.500

-

-

-

Microchip USA

USA . 4,922 parts In-Stock

1+ parts

$5.349

100+ parts

-

1k+ parts

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4,922

$5.349

-

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AZTECH Wire

Italy . 1,060 parts In-Stock

1+ parts

$10.220

100+ parts

-

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1,060

$10.220

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IDEA Electronic Components Group

UK . 55 parts In-Stock

1+ parts

$16.109

100+ parts

-

1k+ parts

$14.498

10k+ parts

-

55

$16.109

-

$14.498

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MKK Technologies

India . 2,338 parts In-Stock

1+ parts

$30.292

100+ parts

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2,338

$30.292

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DigiPath Technology Company

USA . 2,338 parts In-Stock

1+ parts

$30.292

100+ parts

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2,338

$30.292

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Corphita

USA . 4,214 parts In-Stock

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4,214

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Kepictronics

USA . 185 parts In-Stock

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185

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Parana Technologies

USA . 75 parts In-Stock

1+ parts

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100+ parts

$19.261

1k+ parts

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75

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$19.261

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Overview

Elevate your designs with the STM6777SVWB6F from STMicroelectronics, a leader in power management solutions. This compact, low-profile IC ensures reliable performance across diverse applications—from industrial automation to consumer electronics—providing unmatched efficiency and robustness. With a wide supply voltage range and exceptional thermal stability, it delivers consistent power management to optimize your systems. Choose quality and innovation; choose STMicroelectronics for superior reliability and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact circuit designs, making it easier to integrate into modern electronics.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, facilitating efficient layout and spacing.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3V makes it compatible with a wide range of modern digital circuits.

Power Supplies (V): 0.8/5.5

The broad supply voltage range from 0.8 to 5.5V offers flexibility for various applications.

No. of Terminals: 6

Six terminals are sufficient for versatile connections while maintaining a compact design.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile package style is excellent for space-constrained applications, allowing for efficient stacking of components.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C ensures reliability in moderate thermal conditions found in many applications.

Minimum Operating Temperature: -40 °C

The -40 °C minimum operating temperature makes this product suitable for harsh environments and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The gold plating ensures excellent conductivity and corrosion resistance, contributing to long-term reliability.

Terminal Position: DUAL

Dual terminal positions improve layout flexibility and ease of soldering for PCB assembly.

Maximum Seated Height: 1.45 mm

A low seated height helps in reducing the overall profile of the device, beneficial for ultra-thin designs.

Width: 1.6 mm

A narrow width aids in saving board space, accommodating densely populated PCB designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is essential for ensuring stable voltage regulation in various applications.

Minimum Supply Voltage (Vsup): 0.8 V

The ability to operate at a minimum supply voltage of 0.8V allows integration in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes while maintaining component integrity.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C is suitable for modern soldering techniques, ensuring proper assembly.

Length: 2.9 mm

The compact length is ideal for high-density applications, providing more layout options on the PCB.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature, this IC can perform reliably in challenging environments, widening its application.

Maximum Supply Current (Isup): 0.035 mA

Low maximum supply current helps in minimizing power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals are widely used for their ease of soldering and excellent mechanical support.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm allows for denser packing of components while ensuring reliable electrical connections.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting up to 5.5V provides versatility across various electronic circuits and applications.

Adjustable Threshold: YES

The adjustable threshold feature enhances flexibility, allowing for tailored functionality in specific applications.

Technical Specifications

Power Management ICs STM6777SVWB6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGES ARE 2.925V AND 1.575V; MANUAL RESET INPUT

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.035 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

STM6777SVWB6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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