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STM6719SFWB6R

STMicroelectronics

STM6719SFWB6R by STMicroelectronics

STM6719SFWB6R by STMicroelectronics is a Power Management IC with 3.3V nominal voltage, 6 terminals, and adjustable threshold. It is a small outline, low profile IC for power supply support circuits in industrial applications. Package material is plastic/epoxy with gull wing terminals and shrink pitch package style.

Median Price

$0.777

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,840 parts In-Stock

1+ parts

$0.777

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1,840

$0.777

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Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

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$0.895

3,000

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$0.895

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.090

10k+ parts

$1.020

3,000

-

$1.220

$1.090

$1.020

Verical

USA . 1,840 parts In-Stock

1+ parts

-

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$0.777

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1,840

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$0.777

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Chip1Stop

Japan . 1,840 parts In-Stock

1+ parts

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$0.330

1,840

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$0.330

Distributors (In-Stock)

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Digiode

USA . 3,414 parts In-Stock

1+ parts

$0.314

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3,414

$0.314

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Vyrian

USA . 7,628 parts In-Stock

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Anansix

USA . 1,357 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,046 parts In-Stock

1+ parts

$0.297

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3,046

$0.297

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Microchip USA

USA . 5,090 parts In-Stock

1+ parts

$5.699

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5,090

$5.699

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AZTECH Wire

Italy . 808 parts In-Stock

1+ parts

$17.280

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808

$17.280

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IDEA Electronic Components Group

UK . 1,701 parts In-Stock

1+ parts

$17.701

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$15.931

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1,701

$17.701

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$15.931

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$19.771

100+ parts

$17.992

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$16.212

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2,000

$19.771

$17.992

$16.212

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MKK Technologies

India . 1,703 parts In-Stock

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$33.285

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1,703

$33.285

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DigiPath Technology Company

USA . 1,703 parts In-Stock

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$33.285

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$33.285

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Perfect Parts

USA . 6,005 parts In-Stock

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Vigor

Singapore . 3,567 parts In-Stock

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Parana Technologies

USA . 1,365 parts In-Stock

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$21.164

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1,365

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$21.164

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Experience the superior quality and reliability of STMicroelectronics with the STM6719SFWB6R Power Management IC. Designed for industrial applications, this small outline, low profile IC offers a wide operating temperature range and adjustable threshold voltage, providing customers with precise power supply support. Benefit from the trusted reputation of STMicroelectronics and ensure optimal performance in your next project with the STM6719SFWB6R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and heat resistance, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage (Vsup): 3.3 V

Suitable nominal supply voltage for many applications requiring stable power management.

No. of Terminals: 6

A sufficient number of terminals for connecting to other components in the circuit.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function in cold environments as well.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact and low-profile package style saves space and allows for efficient layout on circuit boards.

Adjustable Threshold: YES

Adjustable threshold voltage provides flexibility in adjusting the device's output based on specific requirements.

Technical Specifications

Power Management ICs STM6719SFWB6R attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE ARE 2.925 AND 1.05 VOLTS

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.925,1.05V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

STM6719SFWB6R Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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