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STM32W108CZU74TR

STMicroelectronics

STM32W108CZU74TR by STMicroelectronics

STM32W108CZU74TR by STMicroelectronics is a 32-bit microcontroller with 49152 ROM words and 12288 RAM bytes. It operates at speeds up to 24 rpm, suitable for industrial applications requiring a temperature range of -40 to 105 °C. This chip carrier package with quad terminal position is ideal for surface mount designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 13,381 parts In-Stock

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13,381

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Digiode

USA . 3,638 parts In-Stock

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3,638

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Anansix

USA . 824 parts In-Stock

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824

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 850 parts In-Stock

1+ parts

$63.985

100+ parts

-

1k+ parts

$57.587

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850

$63.985

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$57.587

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Component Stockers USA

USA . 260 parts In-Stock

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$99.990

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260

$99.990

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MKK Technologies

India . 5 parts In-Stock

1+ parts

$120.320

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5

$120.320

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DigiPath Technology Company

USA . 5 parts In-Stock

1+ parts

$120.320

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5

$120.320

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QUARKTWIN TECHNOLOGY LTD

USA . 13,733 parts In-Stock

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13,733

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Perfect Parts

USA . 2,793 parts In-Stock

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2,793

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Parana Technologies

USA . 1,839 parts In-Stock

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$76.504

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1,839

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$76.504

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Corphita

USA . 318 parts In-Stock

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318

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Overview

Discover the STM32W108CZU74TR by STMicroelectronics, a cutting-edge microcontroller with unmatched quality and reliability. With industry-leading technology and a wide range of applications in mind, this product offers unparalleled performance and efficiency. From industrial automation to consumer electronics, this microcontroller is designed to meet your specific needs, providing you with the value and advantages you deserve. Experience the difference with the STM32W108CZU74TR and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting of the microcontroller onto circuit boards, enhancing its reliability.

Bit Size: 32

A 32-bit size allows for faster processing and more complex operations, making the microcontroller suitable for high-performance applications.

Power Supplies (V): 1.25, 1.8, 2.5/3.3

The availability of multiple power supply options provides flexibility in powering the microcontroller, allowing it to adapt to different system requirements.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compactness and good thermal performance, making it suitable for space-constrained applications.

CPU Family: CORTEX-M3

The CORTEX-M3 CPU family offers high performance and energy efficiency, making the microcontroller ideal for power-sensitive applications.

RAM Bytes: 12288

With 12288 bytes of RAM, the microcontroller can efficiently handle data storage and processing, making it suitable for multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

ROM Programmability: FLASH

The FLASH ROM programmability allows for easy and quick updates to the microcontroller's firmware, enhancing its flexibility and adaptability.

Speed: 24 rpm

With a speed of 24 rpm, the microcontroller can efficiently process instructions and data, making it suitable for real-time applications that require fast response times.

Technical Specifications

Microcontrollers STM32W108CZU74TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N48

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.25,1.8,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

49152

ROM Programmability:

FLASH

Speed:

24 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STM32W108CZU74TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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