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STM32W108CCU74TR

STMicroelectronics

STM32W108CCU74TR by STMicroelectronics

STM32W108CCU74TR by STMicroelectronics is a 32-bit microcontroller with 65536 ROM words and 16384 RAM bytes. Operating at speeds up to 24 rpm, it is ideal for industrial applications requiring a temperature range of -40 to 105 °C. The chip carrier package with 48 terminals makes it suitable for surface mount designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,489 parts In-Stock

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11,489

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Digiode

USA . 3,227 parts In-Stock

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3,227

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Anansix

USA . 1,427 parts In-Stock

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1,427

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Distributors (Availability)

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AZTECH Wire

Italy . 1,090 parts In-Stock

1+ parts

$9.880

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1,090

$9.880

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IDEA Electronic Components Group

UK . 2,067 parts In-Stock

1+ parts

$68.754

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-

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$61.879

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2,067

$68.754

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$61.879

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MKK Technologies

India . 1,485 parts In-Stock

1+ parts

$129.288

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1,485

$129.288

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DigiPath Technology Company

USA . 1,485 parts In-Stock

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$129.288

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1,485

$129.288

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Microchip USA

USA . 5,216 parts In-Stock

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5,216

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Corphita

USA . 3,633 parts In-Stock

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3,633

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Vigor

Singapore . 2,300 parts In-Stock

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2,300

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Parana Technologies

USA . 1,510 parts In-Stock

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$82.206

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1,510

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$82.206

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Overview

Revolutionize your next project with the STM32W108CCU74TR from STMicroelectronics. This cutting-edge microcontroller offers unparalleled quality and reliability, backed by a trusted manufacturer. Ideal for a wide range of applications, this versatile chip delivers exceptional value and performance. Whether you're designing IoT devices or industrial automation systems, the STM32W108CCU74TR provides the power and flexibility you need to bring your vision to life. Experience the advantages of STMicroelectronics technology and take your projects to the next level with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Bit Size: 32

The 32-bit architecture provides high processing power and efficiency for complex tasks and calculations.

Power Supplies (V): 1.25, 1.8, 2.5/3.3

Multiple voltage options allow for flexibility in power supply requirements, catering to different system needs.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with other devices and peripherals.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compact size and efficient heat dissipation, ideal for space-constrained applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and extended use.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family is known for its performance and energy efficiency, making it a reliable choice for embedded applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microcontroller to function in cold environments without performance degradation.

ROM Words: 65536

The large ROM capacity supports storing a significant amount of program data, enabling complex algorithms and functions to be executed.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specifications ensure reliable operation in harsh industrial environments without the risk of overheating.

RAM Bytes: 16384

The ample RAM capacity allows for efficient data storage and processing, facilitating smooth operation of applications and multitasking.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered and noise-sensitive applications.

Terminal Form: NO LEAD

The no-lead terminal form provides improved solder joint reliability and overall mechanical durability for robust performance.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible updating of firmware, enabling quick customization and adaptation to changing requirements.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and precise connections, enhancing the overall efficiency and reliability of the system.

Speed: 24 rpm

The high speed of 24 rpm ensures responsive and smooth operation, suitable for real-time control and processing applications.

Technical Specifications

Microcontrollers STM32W108CCU74TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N48

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.25,1.8,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

24 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STM32W108CCU74TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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