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STM32W108CBU63TR

STMicroelectronics

STM32W108CBU63TR by STMicroelectronics

STM32W108CBU63TR by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words and 8192 RAM bytes. Operating b/w -40 to 85 °C, it's ideal for industrial applications requiring a peak reflow temperature of 260°C. With a power supply range of 1.25-3.3V, this Cortex-M3 CPU family chip carrier supports various surface-mount applications at a max current of 150mA.

Median Price

$4.290

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 11 parts In-Stock

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$4.290

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$3.522

11

$4.290

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$3.522

Distributors (In-Stock)

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Digiode

USA . 4,974 parts In-Stock

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$4.076

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Vyrian

USA . 4,968 parts In-Stock

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Anansix

USA . 1,487 parts In-Stock

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A&K Electronics

USA . 108 parts In-Stock

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108

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Rotakorn

Sweden . 108 parts In-Stock

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108

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Bristol Electronics

USA . 108 parts In-Stock

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Goldney Electronics S.L.

Spain . 36 parts In-Stock

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Zilex Electronics Inc.

Canada . 1 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,464 parts In-Stock

1+ parts

$3.861

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$3.861

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Microchip USA

USA . 193 parts In-Stock

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$6.008

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193

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IDEA Electronic Components Group

UK . 43 parts In-Stock

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$79.482

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$71.533

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$71.533

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MKK Technologies

India . 1,282 parts In-Stock

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$149.460

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DigiPath Technology Company

USA . 1,282 parts In-Stock

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$149.460

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 2,352 parts In-Stock

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Parana Technologies

USA . 1,723 parts In-Stock

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$95.032

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$95.032

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Overview

Unlock endless possibilities with the STM32W108CBU63TR microcontroller from STMicroelectronics. With cutting-edge technology and unmatched reliability, this product is ideal for a wide range of applications. Whether you're looking to power your IoT devices, smart home appliances, or industrial automation systems, this microcontroller offers superior performance and efficiency. Trust in STMicroelectronics to deliver top-quality products that exceed expectations and bring value to your projects. Elevate your designs with the STM32W108CBU63TR and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Bit Size: 32

32-bit architecture allows for high-speed processing and efficient execution of complex tasks.

Power Supplies (V): 1.25, 1.8, 2.5/3.3

Multiple power supply options provide flexibility for various application requirements and voltage compatibility.

No. of Terminals: 48

Ample number of terminals allow for easy connection to external devices and peripherals.

Package Style (Meter): CHIP CARRIER

CHIP CARRIER package style provides a compact form factor for space-constrained designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

CPU Family: CORTEX-M3

CORTEX-M3 CPU family offers high performance and efficiency for a wide range of applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments without compromising performance.

Terminal Finish: MATTE TIN

MATTE TIN finish provides corrosion resistance and ensures reliable electrical connections.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

ROM Programmability: FLASH

FLASH programmable ROM allows for easy firmware updates and customization of the microcontroller's functionality.

Technical Specifications

Microcontrollers STM32W108CBU63TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.25,1.8,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

STM32W108CBU63TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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