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STM32W108C8U64TR

STMicroelectronics

STM32W108C8U64TR by STMicroelectronics

STM32W108C8U64TR by STMicroelectronics is a 32-bit microcontroller with 65536 ROM words and 8192 RAM bytes. Operating at -40 to 85 °C, it suits industrial applications requiring a CPU family of CORTEX-M3. With a package style of CHIP CARRIER, it's ideal for surface mount designs needing a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,120 parts In-Stock

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9,120

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Digiode

USA . 3,311 parts In-Stock

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3,311

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Anansix

USA . 2,568 parts In-Stock

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2,568

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 111 parts In-Stock

1+ parts

$7.315

100+ parts

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111

$7.315

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AZTECH Wire

Italy . 134 parts In-Stock

1+ parts

$13.480

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134

$13.480

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IDEA Electronic Components Group

UK . 516 parts In-Stock

1+ parts

$70.795

100+ parts

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$63.715

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516

$70.795

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$63.715

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MKK Technologies

India . 1,351 parts In-Stock

1+ parts

$133.125

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1,351

$133.125

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DigiPath Technology Company

USA . 1,351 parts In-Stock

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$133.125

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1,351

$133.125

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Corphita

USA . 4,690 parts In-Stock

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4,690

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Parana Technologies

USA . 1,903 parts In-Stock

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$84.646

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1,903

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$84.646

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Perfect Parts

USA . 1,877 parts In-Stock

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1,877

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Overview

Unlock endless possibilities with the STM32W108C8U64TR microcontroller by STMicroelectronics. Known for their top-notch quality and reliability, STMicroelectronics delivers cutting-edge technology that exceeds industry standards. This versatile microcontroller is perfect for a wide range of applications, from IoT devices to consumer electronics. With its advanced features, low power consumption, and high performance, the STM32W108C8U64TR offers unparalleled value and benefits to customers looking to take their projects to the next level. Experience innovation at its finest with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Bit Size: 32

With a 32-bit size, this microcontroller offers high processing power and capability to handle complex tasks effectively.

Power Supplies (V): 2.5/3.3

Supporting multiple power supply options (2.5V and 3.3V) makes the microcontroller versatile and compatible with different systems.

No. of Terminals: 48

Having 48 terminals provides flexibility in connecting the microcontroller to other components or peripherals, expanding its functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact and efficient design for space-saving integration into electronic devices.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature of 85 °C ensures the microcontroller can perform reliably in demanding industrial environments.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family guarantees high performance and compatibility with a wide range of software and development tools.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the microcontroller to function effectively in cold conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and good conductivity, ensuring a reliable connection for long-term usage.

ROM Words: 65536

With 65536 ROM words, the microcontroller offers ample storage for program data, allowing for complex algorithm implementation.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering during manufacturing, reducing the risk of component damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C enables reliable soldering of the microcontroller onto PCBs for robust electrical connections.

Temperature Grade: INDUSTRIAL

Having an industrial temperature grade means the microcontroller is designed to withstand harsh industrial environments, making it suitable for rugged applications.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller offers sufficient memory for data storage and processing, enhancing overall system performance.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering and assembly processes, making it easier to integrate the microcontroller into electronic products.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible reprogramming of the microcontroller, enabling quick software updates and modifications.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the microcontroller offers precise and compact connections for efficient circuit board layout.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand moderate exposure to moisture during storage or assembly processes.

Speed: 24 rpm

Operating at a speed of 24 rpm, the microcontroller delivers fast and efficient performance for real-time processing and control applications.

Technical Specifications

Microcontrollers STM32W108C8U64TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

24 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

STM32W108C8U64TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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