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STM32W108C8U63TR

STMicroelectronics

STM32W108C8U63TR by STMicroelectronics

STM32W108C8U63TR by STMicroelectronics is a 32-bit microcontroller with 65536 ROM words and 8192 RAM bytes. Operating at -40 to 85 °C, it's ideal for industrial applications requiring a CPU family of CORTEX-M3. With a package style of CHIP CARRIER, it offers power supplies of 2.5/3.3V for surface mount usage in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,402 parts In-Stock

1+ parts

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9,402

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Digiode

USA . 2,114 parts In-Stock

1+ parts

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2,114

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Anansix

USA . 1,511 parts In-Stock

1+ parts

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1,511

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 391 parts In-Stock

1+ parts

$7.957

100+ parts

-

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391

$7.957

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AZTECH Wire

Italy . 1,141 parts In-Stock

1+ parts

$12.290

100+ parts

-

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1,141

$12.290

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IDEA Electronic Components Group

UK . 2,300 parts In-Stock

1+ parts

$21.453

100+ parts

-

1k+ parts

$19.307

10k+ parts

-

2,300

$21.453

-

$19.307

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MKK Technologies

India . 325 parts In-Stock

1+ parts

$40.340

100+ parts

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325

$40.340

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DigiPath Technology Company

USA . 325 parts In-Stock

1+ parts

$40.340

100+ parts

-

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325

$40.340

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Perfect Parts

USA . 5,537 parts In-Stock

1+ parts

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5,537

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Corphita

USA . 4,462 parts In-Stock

1+ parts

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4,462

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Parana Technologies

USA . 524 parts In-Stock

1+ parts

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100+ parts

$25.650

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524

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$25.650

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Overview

Discover the cutting-edge STM32W108C8U63TR microcontroller by STMicroelectronics, a leading manufacturer known for its top-notch quality. This powerful device offers endless possibilities for applications in various industries. With its advanced features and reliable performance, the STM32W108C8U63TR provides unmatched value, benefits, and advantages to customers. Experience innovation at its finest with this high-quality microcontroller and unleash the full potential of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material that provides good protection for the components inside the microcontroller.

Surface Mount: YES

Enables easy and efficient soldering onto PCBs, saving time during production and allowing for compact designs.

Bit Size: 32

Offers high processing capability and supports a wide range of applications and functionalities.

Power Supplies (V): 2.5/3.3

Compatible with common voltage levels, making it versatile and easy to integrate into existing systems.

No. of Terminals: 48

Provides ample connectivity options for interfacing with external devices, expanding the capabilities of the microcontroller.

Package Style (Meter): CHIP CARRIER

Compact and efficient design that minimizes space requirements on the PCB, ideal for applications with limited space.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where high temperatures may be present, ensuring reliable operation under various conditions.

CPU Family: CORTEX-M3

Well-established and widely used CPU family known for its performance and efficiency, ensuring reliable and high-performance operation.

Terminal Finish: MATTE TIN

Provides good solderability and conductivity, ensuring secure and reliable connections with other components.

ROM Words: 65536

Offers ample storage capacity for program and data storage, accommodating complex algorithms and applications.

RAM Bytes: 8192

Sufficient memory capacity for temporary data storage and efficient operation of programs, enhancing overall performance.

ROM Programmability: FLASH

Allows for easy reprogramming of the ROM, enabling flexibility and adaptability for future updates or modifications.

Moisture Sensitivity Level (MSL): 3

Suitable for environments with moderate humidity levels, ensuring stable and reliable performance in various conditions.

Speed: 24 rpm

Provides fast processing speeds, enabling quick execution of tasks and real-time responsiveness in applications.

Technical Specifications

Microcontrollers STM32W108C8U63TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

24 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

STM32W108C8U63TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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