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STM32L562QEI6TR

STMicroelectronics

STM32L562QEI6TR by STMicroelectronics

STM32L562QEI6TR from STMicroelectronics is a low-power 32-bit microcontroller featuring a Cortex-M33 CPU, with a max clock of 48 MHz. It supports 16 ADC channels and 2 DACs, making it ideal for industrial applications requiring precision. Its compact design (7x7 mm) ensures efficient integration in space-constrained environments.

Median Price

$6.630

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,000 parts In-Stock

1+ parts

-

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$6.630

5,000

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$6.630

Verical

USA . 5,000 parts In-Stock

1+ parts

-

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$6.630

5,000

-

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$6.630

Chip1Stop

Japan . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$6.561

5,000

-

-

-

$6.561

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,122 parts In-Stock

1+ parts

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Digiode

USA . 3,515 parts In-Stock

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3,515

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Anansix

USA . 2,110 parts In-Stock

1+ parts

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2,110

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,980 parts In-Stock

1+ parts

$6.530

100+ parts

-

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-

2,980

$6.530

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AZTECH Wire

Italy . 320 parts In-Stock

1+ parts

$12.130

100+ parts

-

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-

320

$12.130

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IDEA Electronic Components Group

UK . 580 parts In-Stock

1+ parts

$62.641

100+ parts

-

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$56.377

10k+ parts

-

580

$62.641

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$56.377

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Component Stockers USA

USA . 1,311 parts In-Stock

1+ parts

$93.650

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1,311

$93.650

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MKK Technologies

India . 185 parts In-Stock

1+ parts

$117.792

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185

$117.792

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DigiPath Technology Company

USA . 185 parts In-Stock

1+ parts

$117.792

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185

$117.792

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,038 parts In-Stock

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$74.897

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1,038

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$74.897

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Corphita

USA . 387 parts In-Stock

1+ parts

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387

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Overview

Elevate your projects with the STM32L562QEI6TR from STMicroelectronics, a top-tier microcontroller designed for excellence. With its robust performance and low power consumption, this device is ideal for IoT applications, wearable tech, and smart home devices. Rely on STMicroelectronics' commitment to quality and innovation, ensuring you benefit from cutting-edge technology that enhances efficiency and durability in your designs. Experience unmatched value and versatility today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliability in various applications.

Integrated Cache: YES

Integrated cache improves data access speed, enhancing overall performance.

Surface Mount: YES

Allows for compact designs and efficient manufacturing processes.

Maximum Supply Voltage: 3.6 V

Suitable for low-power applications, ensuring energy efficiency.

On Chip Data RAM Width: 8

Provides sufficient data handling capabilities for various applications.

Package Shape: SQUARE

Standard shape facilitates easy integration into different designs.

Bit Size: 32

A 32-bit architecture allows for powerful processing capabilities.

DAC Channels: YES

Integrated DAC channels enable high-quality analog signal output.

No. of Terminals: 132

A higher number of terminals provides flexibility for numerous connections.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Ideal for space-constrained applications, ensuring a neat layout.

Minimum Supply Voltage: 1.71 V

Allows operation in low-voltage applications, enhancing versatility.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where temperature fluctuations are common.

CPU Family: CORTEX-M33

Part of a robust family known for energy efficiency and high performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments, suitable for diverse applications.

ADC Channels: YES

Providing ADC channels for effective digital-to-analog conversion in real-time.

DMA Channels: YES

Presence of DMA channels allows for efficient data transfers without CPU intervention.

Terminal Position: BOTTOM

Allows for easy soldering and connection to circuit boards.

ROM Words: 524288

Ample ROM storage enables complex programs and applications.

Maximum Seated Height: 0.6 mm

Very low profile aids in compact electronic designs.

Digital To Analog Converters: 2-Ch 12-Bit

Dual high-resolution DACs for accurate signal generation.

RAM Words: 262144

Generous RAM capacity supports multi-functional applications.

Width: 7 mm

Compact dimensions fit well into smaller device configurations.

Boundary Scan: YES

Facilitates testing and debugging of electronic circuits.

Peripherals: BOR, COMPARATOR(2), RTC, TIMER(14), WDT(2)

A rich set of peripherals enhances functionality and application integration.

Maximum Clock Frequency: 48 MHz

A high clock speed helps execute more instructions in a given time.

Length: 7 mm

Minimal length makes it suitable for tight spaces and compact designs.

Temperature Grade: INDUSTRIAL

Designed for robust industrial applications facing harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance efficiency through simpler instruction sets.

No. of Timers: 14

Multiple timers provide flexibility for time-critical applications.

Technology: CMOS

CMOS technology ensures lower power consumption and higher speed.

Terminal Form: BALL

Ball terminal configuration ensures stable connections and easy mounting.

Analog To Digital Converters: 16-Ch 12-Bit

16-channel ADCs allow for versatile input options for complex signals.

Nominal Supply Voltage: 3 V

Standard voltage requirement fits well with commonly used power supplies.

No. of DMA Channels: 14

Multiple DMA channels enable smooth data movement, enhancing speed and efficiency.

No. of Serial I/Os: 15

15 serial I/Os provide ample connectivity options for diverse needs.

PWM Channels: YES

Support for PWM channels enables effective control of motors and other devices.

Connectivity: I2C(4), LPUART, SAI(2), SPI(3), UART(2), USART(3)

Diverse connectivity options allow for integration in a wide range of applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware.

Terminal Pitch: 0.5 mm

Fine pitch aids in high-density configurations for advanced designs.

Format: FLOATING POINT

Floating point format facilitates complex mathematical operations with ease.

Speed: 110 rpm

Usable in applications requiring precise speed control and monitoring.

Low Power Mode: YES

Low power mode helps conserve energy, extending battery life in portable devices.

On Chip Program ROM Width: 8

8-bit width provides compatibility with various data types and operations.

No. of I/O Lines: 110

A high number of I/O lines allows for greater flexibility and interconnectivity.

Technical Specifications

Microcontrollers STM32L562QEI6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B132

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of I/O Lines:

110

No. of Serial I/Os:

15

No. of Terminals:

132

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA132,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

262144

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

110 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(4), LPUART, SAI(2), SPI(3), UART(2), USART(3)

Peripherals:

BOR, COMPARATOR(2), RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L562QEI6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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