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STM32L562CEU6TR

STMicroelectronics

STM32L562CEU6TR by STMicroelectronics

STM32L562CEU6TR by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max clock frequency of 48 MHz. It is suitable for industrial applications, offering low power mode, multiple ADC and DAC channels, and various connectivity options such as I2C, SPI, UART, and more.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NexGen Digital

USA . 62,500 parts In-Stock

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62,500

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Vyrian

USA . 8,694 parts In-Stock

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8,694

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Digiode

USA . 2,439 parts In-Stock

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2,439

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Anansix

USA . 1,351 parts In-Stock

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1,351

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Ampacity Inc.

Singapore . 725 parts In-Stock

1+ parts

$10.000

100+ parts

-

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725

$10.000

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AZTECH Wire

Italy . 381 parts In-Stock

1+ parts

$18.595

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-

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381

$18.595

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Aztec Data Supply Inc.

USA . 3,335 parts In-Stock

1+ parts

$19.320

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3,335

$19.320

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Semicontronic

India . 163 parts In-Stock

1+ parts

$24.000

100+ parts

$23.400

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$23.280

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163

$24.000

$23.400

$23.280

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Corohmni

South Africa . 220 parts In-Stock

1+ parts

$66.803

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220

$66.803

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IDEA Electronic Components Group

UK . 717 parts In-Stock

1+ parts

$74.436

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$66.993

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717

$74.436

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$66.993

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MKK Technologies

India . 1,207 parts In-Stock

1+ parts

$139.973

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1,207

$139.973

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DigiPath Technology Company

USA . 1,207 parts In-Stock

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$139.973

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$139.973

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Continental Prestige Electronics

USA . 5,500 parts In-Stock

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Corphita

USA . 2,864 parts In-Stock

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Parana Technologies

USA . 1,943 parts In-Stock

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$89.000

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1,943

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$89.000

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Argo Parts USA

USA . 113 parts In-Stock

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113

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Discover the STM32L562CEU6TR microcontroller by STMicroelectronics, designed to deliver exceptional quality and performance. As a leading manufacturer in the industry, STMicroelectronics brings its expertise and innovation to this product. With its extensive range of applications, this microcontroller offers customers unparalleled value, benefits, and advantages. Whether you're working on smart home devices, industrial automation, or wearable technology, the STM32L562CEU6TR is the perfect choice with its integrated cache, low power mode, and advanced connectivity options. Experience the difference that this microcontroller can make in your project - unlock new possibilities and achieve superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy makes the product lightweight and durable.

Integrated Cache: YES

Having an integrated cache improves the performance of the microcontroller by reducing memory access times.

Maximum Supply Voltage: 3.6 V

This high maximum supply voltage allows for versatility in powering the microcontroller.

Bit Size: 32

The 32-bit architecture provides enhanced processing capabilities and efficiency.

DAC Channels: YES

Having DAC channels allows for analog output functionality, which is useful in various applications.

No. of Terminals: 48

With a high number of terminals, this microcontroller can support a wide range of input and output configurations.

No. of Timers: 14

Having 14 timers enables precise timekeeping and scheduling in applications that require timing functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is common and easily accessible, simplifying the power supply design.

Connectivity: I2C(4), LPUART, SAI(2), SPI(3), UART(2), USART(3)

The multiple connectivity options provide flexibility in communication interfaces for the microcontroller.

Technical Specifications

Microcontrollers STM32L562CEU6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of I/O Lines:

38

No. of Serial I/Os:

15

No. of Terminals:

48

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

262144

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

110 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(4), LPUART, SAI(2), SPI(3), UART(2), USART(3)

Peripherals:

BOR, COMPARATOR(2), RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

9-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L562CEU6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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