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STM32L552QCI6Q

STMicroelectronics

STM32L552QCI6Q by STMicroelectronics

STM32L552QCI6Q microcontroller from STMicroelectronics features a 32-bit Cortex-M33 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. Ideal for low-power applications, it supports various connectivity options like CAN and USB. With integrated cache and multiple timers, it's perfect for advanced embedded systems.

Median Price

$5.771

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 54 parts In-Stock

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$5.771

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54

$5.771

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Vyrian

USA . 4,770 parts In-Stock

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4,770

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Digiode

USA . 3,631 parts In-Stock

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3,631

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Anansix

USA . 1,319 parts In-Stock

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1,319

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Distributors (Availability)

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Vigor

Singapore . 1,176 parts In-Stock

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$5.540

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1,176

$5.540

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AZTECH Wire

Italy . 147 parts In-Stock

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$20.140

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147

$20.140

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IDEA Electronic Components Group

UK . 1,537 parts In-Stock

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$69.017

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-

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$62.116

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1,537

$69.017

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$62.116

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MKK Technologies

India . 293 parts In-Stock

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$129.783

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293

$129.783

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DigiPath Technology Company

USA . 293 parts In-Stock

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$129.783

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293

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 2,254 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,101 parts In-Stock

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2,101

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Parana Technologies

USA . 731 parts In-Stock

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$82.521

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731

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$82.521

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Glotronic Ltd.

UK . 611 parts In-Stock

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611

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Overview

Unlock the potential of your next project with the STM32L552QCI6Q microcontroller from STMicroelectronics—a leader in innovative semiconductor solutions. Renowned for their reliability and cutting-edge technology, STMicroelectronics ensures that this versatile microcontroller excels in low-power applications, making it ideal for IoT devices, wearable tech, and smart home systems. Experience unparalleled performance, energy efficiency, and robust connectivity options that empower you to create smarter, more efficient solutions while reducing time-to-market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures longevity and reliability in various environments.

Integrated Cache: YES

Integrated cache improves processing speed and overall efficiency, making it ideal for performance-critical applications.

Surface Mount: YES

Surface mount design facilitates easier assembly and reduces overall footprint on the PCB.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage levels, accommodating various power supply configurations.

On Chip Data RAM Width: 8

8-bit RAM width allows efficient data processing suitable for embedded applications.

Package Shape: SQUARE

Square package shape optimizes space utilization on PCB, allowing for compact device design.

Bit Size: 32

32-bit architecture provides a good balance of performance and memory addressing capabilities.

DAC Channels: YES

Presence of DAC channels allows for high-quality analog output, making it suitable for audio and signal processing applications.

Number of Terminals: 132

A large number of terminals provides flexibility for interfacing with various peripherals and components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Thin profile and fine pitch design allow for high-density mounting on the PCB, which is beneficial for space-constrained applications.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage enhances battery life and enables operation in low-power applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range enhances reliability in high-thermal environments.

CPU Family: CORTEX-M33

Cortex-M33 core provides high performance with low power consumption, ideal for embedded applications.

Number of External Interrupts: 43

A large number of external interrupts enables responsive and reactive designs for real-time applications.

Minimum Operating Temperature: -40 °C

Operation in extreme low temperatures makes the product suitable for harsh environment applications.

ADC Channels: YES

Inclusion of ADC channels provides digital conversion for various sensor inputs, enhancing functionality.

DMA Channels: YES

DMA capability offloads data transfer tasks, freeing up CPU resources for other operations and improving performance.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier board layouts and efficient thermal dissipation.

ROM Words: 262144

Ample ROM for program storage allows for complex applications and multiple features.

Maximum Seated Height: 0.6 mm

Very low height allows for slim designs, beneficial in portable and compact devices.

Digital To Analog Converters: 2-Ch 12-Bit

High-quality DACs enable precise analog outputs for better control in various applications.

Width: 7 mm

Compact width enhances integration into space-sensitive applications.

Boundary Scan: YES

Support for boundary scan facilitates testing and debugging in PCB production and field applications.

Peripherals: BOR, COMPARATOR(2), RTC, TIMER(15), WDT(2)

Multipurpose peripherals enable diverse application scenarios and system functionalities.

Maximum Clock Frequency: 48 MHz

A sufficient clock speed that meets performance needs of a wide array of applications.

Length: 7 mm

Compact length allows for reduced footprint in applications with limited space.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances efficiency in processing, making it suitable for high-performance applications.

Number of Timers: 15

Multiple timers assist in scheduling and handling timing events, crucial for real-time applications.

RAM Bytes: 393216

Large RAM size supports complex operations and multiple concurrent tasks.

Technology: CMOS

CMOS technology allows for low power consumption, increasing efficiency and battery life.

Terminal Form: BALL

Ball terminal design supports high-density interconnections, suitable for complex circuit designs.

Analog To Digital Converters: 16-Ch 12-Bit

High count of ADC channels allows for versatile input options from various sensors.

Maximum Supply Current: 31.38 mA

Max supply current rating indicates efficient power usage while delivering adequate performance.

Nominal Supply Voltage: 3 V

Standard nominal voltage makes it compatible with many existing systems and power sources.

Number of DMA Channels: 14

Multiple DMA channels enhance data throughput capabilities, facilitating faster data handling.

Number of Serial I/Os: 9

Adequate serial I/O lines provide flexibility for communication interfaces with other devices.

PWM Channels: YES

Support for PWM channels is essential for motor control and other precision timing applications.

Connectivity: CAN, I2C(4), LPUART, SAI(2), SPI(3), UART(4), USART(3), USB

Extensive connectivity options ensure compatibility with a wide range of devices and communication standards.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, ensuring longevity and adaptability.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports high-density designs, allowing more functionality in a smaller area.

Format: FLOATING POINT

Floating point support enables more complex calculations and data processing capabilities.

Speed: 110 rpm

Indicates operational speed metrics that may be relevant for low-speed applications.

Low Power Mode: YES

Low power mode feature is critical for battery-operated devices, extending operational life.

On Chip Program ROM Width: 8

8-bit program ROM width allows compatibility with various programming requirements of embedded systems.

Number of I/O Lines: 105

A high number of I/O lines provides ample interface options for connecting to sensors and actuators.

Technical Specifications

Microcontrollers STM32L552QCI6Q attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B132

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

43

No. of I/O Lines:

105

No. of Serial I/Os:

9

No. of Terminals:

132

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA132,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

110 rpm

Maximum Supply Current:

31.38 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), LPUART, SAI(2), SPI(3), UART(4), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), RTC, TIMER(15), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L552QCI6Q Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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