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STM32L4S9VIT6

STMicroelectronics

STM32L4S9VIT6 by STMicroelectronics

STM32L4S9VIT6 microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6 V, and supports up to 77 I/O lines. Ideal for low-power applications, it includes ADC and PWM channels for versatile control. Its compact FLATPACK design ensures efficient integration in various devices.

Median Price

$8.178

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.178

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540

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-

$8.178

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Distributors (In-Stock)

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Digiode

USA . 4,286 parts In-Stock

1+ parts

$9.402

100+ parts

-

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4,286

$9.402

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Vyrian

USA . 6,838 parts In-Stock

1+ parts

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6,838

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Anansix

USA . 2,836 parts In-Stock

1+ parts

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2,836

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 75 parts In-Stock

1+ parts

$7.280

100+ parts

$6.700

1k+ parts

-

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75

$7.280

$6.700

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-

Corphita

USA . 4,718 parts In-Stock

1+ parts

$8.907

100+ parts

-

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4,718

$8.907

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Vigor

Singapore . 8,029 parts In-Stock

1+ parts

$11.580

100+ parts

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8,029

$11.580

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AZTECH Wire

Italy . 451 parts In-Stock

1+ parts

$11.900

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451

$11.900

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IDEA Electronic Components Group

UK . 282 parts In-Stock

1+ parts

$14.197

100+ parts

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1k+ parts

$12.778

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282

$14.197

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$12.778

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MKK Technologies

India . 836 parts In-Stock

1+ parts

$26.697

100+ parts

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836

$26.697

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DigiPath Technology Company

USA . 836 parts In-Stock

1+ parts

$26.697

100+ parts

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836

$26.697

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 2,027 parts In-Stock

1+ parts

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$16.975

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2,027

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$16.975

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Overview

Unlock your project's potential with the STM32L4S9VIT6 microcontroller from STMicroelectronics, a leading name in innovation and quality. This versatile device is designed for efficiency, empowering applications from IoT to wearables with its low power consumption and robust performance. Experience seamless integration, unmatched reliability, and advanced features that accelerate your development process, ensuring you stay ahead in a competitive market. Elevate your designs with ST's commitment to excellence!

Feature Benefit Bullets

Surface Mount: YES

This microcontroller's surface mount capability allows for easier integration into compact designs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, it ensures compatibility with a wide range of power sources and enables energy-efficient designs.

Address Bus Width: 5

A 5-bit address bus width allows for efficient memory addressing, making it suitable for applications requiring moderate memory access.

Package Shape: SQUARE

The square package shape not only provides a compact form factor but also facilitates effective thermal management.

Bit Size: 32

The 32-bit architecture allows for processing of larger data types and improved performance for complex calculations.

No. of Terminals: 100

Having 100 terminals enhances connectivity options, allowing for more peripherals and functionalities to be integrated.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack and low-profile design minimizes height, making it ideal for applications with limited vertical space.

Minimum Supply Voltage: 1.71 V

A minimum supply voltage of 1.71 V enables it to operate effectively in low-power environments, prolonging battery life in portable applications.

ADC Channels: YES

The inclusion of Analog-to-Digital Converter channels allows for versatile signal processing, making it suitable for sensor interfacing.

DMA Channels: YES

Direct Memory Access channels improve data handling efficiency, reducing CPU load and increasing overall system performance.

Terminal Position: QUAD

Quad terminal positioning enhances soldering reliability and reduces the risk of damage during assembly.

Width: 14 mm

A compact width of 14 mm makes this microcontroller an excellent choice for space-efficient designs.

External Data Bus Width: 16

With a 16-bit external data bus width, it supports efficient data transfers, improving throughput in applications.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides the processing power needed for responsive applications, enhancing user experience.

Length: 14 mm

The length of 14 mm contributes to a compact footprint, making it easy to fit into various design layouts.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers high performance per watt, ideal for power-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals provide a stable solder connection, enhancing the reliability of the device in operational environments.

Nominal Supply Voltage: 3 V

Operating effectively at a nominal supply voltage of 3 V allows for versatility in different electronic systems and applications.

PWM Channels: YES

Support for Pulse Width Modulation channels facilitates efficient motor control and signal adjustment, making it suitable for automation.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for more compact designs, permitting tighter arrangements of components.

Speed: 120 rpm

With the capability to handle speeds of 120 rpm, it can effectively manage various motion control applications.

No. of I/O Lines: 77

77 I/O lines allow for extensive interfacing options, making it suitable for complex projects requiring numerous connections.

Technical Specifications

Microcontrollers STM32L4S9VIT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

5

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

14 mm

No. of I/O Lines:

77

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

120 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32L4S9VIT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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