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STM32L4R5AII6P

STMicroelectronics

STM32L4R5AII6P by STMicroelectronics

STM32L4R5AII6P by STMicroelectronics is a 32-bit microcontroller with 26-bit address bus, 169 terminals, and 48 MHz clock frequency. It features 16-Ch 12-Bit ADCs, CAN connectivity, and operates in industrial temperature range. Ideal for applications requiring high-speed processing and multiple analog-to-digital conversions.

Median Price

$9.592

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7,488 parts In-Stock

1+ parts

$9.592

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7,488

$9.592

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Verical

USA . 7,488 parts In-Stock

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$9.592

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7,488

$9.592

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Chip1Stop

Japan . 4,992 parts In-Stock

1+ parts

$11.115

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-

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$8.628

4,992

$11.115

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$8.628

Avnet

USA . 416 parts In-Stock

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416

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Digiode

USA . 4,190 parts In-Stock

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$10.525

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4,190

$10.525

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Vyrian

USA . 4,183 parts In-Stock

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4,183

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Anansix

USA . 548 parts In-Stock

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548

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Nova Conductors

Japan . 66 parts In-Stock

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66

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Distributors (Availability)

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Semicontronic

India . 4,832 parts In-Stock

1+ parts

$7.950

100+ parts

$7.751

1k+ parts

$7.712

10k+ parts

-

4,832

$7.950

$7.751

$7.712

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Ampacity Inc.

Singapore . 4,931 parts In-Stock

1+ parts

$7.970

100+ parts

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4,931

$7.970

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Corphita

USA . 4,640 parts In-Stock

1+ parts

$9.971

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4,640

$9.971

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Vigor

Singapore . 1,671 parts In-Stock

1+ parts

$11.070

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1,671

$11.070

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AZTECH Wire

Italy . 43 parts In-Stock

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$11.450

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43

$11.450

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Corohmni

South Africa . 173 parts In-Stock

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$15.390

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173

$15.390

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IDEA Electronic Components Group

UK . 1,584 parts In-Stock

1+ parts

$16.336

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$14.702

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1,584

$16.336

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$14.702

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MKK Technologies

India . 2,096 parts In-Stock

1+ parts

$30.718

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2,096

$30.718

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DigiPath Technology Company

USA . 2,096 parts In-Stock

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$30.718

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2,096

$30.718

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Microchip USA

USA . 4,479 parts In-Stock

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$37.138

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4,479

$37.138

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QUARKTWIN TECHNOLOGY LTD

USA . 10,749 parts In-Stock

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10,749

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 2,300 parts In-Stock

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$19.532

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2,300

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$19.532

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Unlock endless possibilities with the STM32L4R5AII6P from STMicroelectronics - a leading manufacturer in the microcontroller industry. This powerful device offers unparalleled quality and reliability, making it perfect for a wide range of applications. With advanced features like high-speed connectivity options and efficient power management, this microcontroller provides exceptional value and performance to customers. Whether you're designing IoT devices or industrial automation systems, the STM32L4R5AII6P delivers the advantages you need to stay ahead in today's fast-paced market. Elevate your projects with this innovative solution and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.4 V

Operates efficiently within a safe voltage range, ensuring stable performance.

Address Bus Width: 26

Allows for a large address space, accommodating complex memory requirements.

Package Shape: SQUARE

Facilitates uniform placement on the PCB, optimizing layout design.

Bit Size: 32

Provides ample processing power for handling tasks efficiently.

DAC Channels: YES

Enables the microcontroller to output analog signals, expanding its functionality.

No. of Terminals: 169

Provides ample connectivity options for peripherals and external components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Offers a compact and high-density packaging solution, saving board space.

Minimum Supply Voltage: 1.14 V

Supports low-power operation, ideal for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, ensuring reliable operation.

Minimum Operating Temperature: -40 °C

Operates in extreme cold environments without performance degradation.

ADC Channels: YES

Allows the microcontroller to convert analog signals to digital data for processing.

DMA Channels: YES

Facilitates efficient data transfer without CPU intervention, improving system performance.

Terminal Position: BOTTOM

Simplifies PCB layout and assembly process by providing a defined terminal orientation.

ROM Words: 2097152

Offers a large amount of memory for storing program instructions and data.

Maximum Seated Height: 0.6 mm

Allows for slim and compact device designs, suitable for space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Enables accurate conversion of digital data to analog signals for precise control.

Width: 7 mm

Compact form factor for easy integration into various electronic devices.

External Data Bus Width: 16

High-speed data transfer capability between the microcontroller and external devices.

Peripherals: BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

Comprehensive set of peripherals for versatile system control and monitoring.

Maximum Clock Frequency: 48 MHz

High clock speed for rapid processing and real-time operation.

Length: 7 mm

Compact dimensions for space-efficient designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient and streamlined processing.

RAM Bytes: 655360

Generous amount of memory for data storage and manipulation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Facilitates easy soldering onto the PCB, ensuring reliable electrical connections.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple ADC channels for precise analog signal sampling and conversion.

Nominal Supply Voltage: 1.2 V

Optimal voltage level for efficient operation and power consumption.

PWM Channels: YES

Supports pulse-width modulation for precise control of analog outputs.

Connectivity: CAN, I2C(4), SAI(2), SPI(5), UART(3), USART(3), USB

Offers a wide range of communication interfaces for device connectivity and interoperability.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller with updated firmware.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density PCB designs and space optimization.

Speed: 120 rpm

Operates at a fast speed for efficient data processing and system responsiveness.

On Chip Program ROM Width: 8

Includes on-chip program memory for storing essential firmware and program code.

No. of I/O Lines: 140

Provides a large number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32L4R5AII6P attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES IN THE RANGE OF 1.71V TO 3.6V

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B169

Length:

7 mm

No. of I/O Lines:

140

No. of Terminals:

169

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

655360

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.4 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), SAI(2), SPI(5), UART(3), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L4R5AII6P Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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