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STM32L4R5AGI6

STMicroelectronics

STM32L4R5AGI6 by STMicroelectronics

STM32L4R5AGI6 microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 1.4V, and includes 16 ADC channels. With industrial-grade temperature tolerance (-40 °C to 85 °C), it's ideal for low-power applications in IoT and automation. Its compact design (7mm x 7mm) supports various connectivity options like CAN and USB.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Avnet

USA . 832 parts In-Stock

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Vyrian

USA . 5,815 parts In-Stock

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5,815

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Digiode

USA . 3,964 parts In-Stock

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3,964

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Anansix

USA . 966 parts In-Stock

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966

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Distributors (Availability)

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Vigor

Singapore . 133 parts In-Stock

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$13.990

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133

$13.990

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AZTECH Wire

Italy . 73 parts In-Stock

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$17.040

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73

$17.040

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Ampacity Inc.

Singapore . 147 parts In-Stock

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$30.000

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147

$30.000

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IDEA Electronic Components Group

UK . 1,745 parts In-Stock

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$48.740

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$43.866

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$48.740

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$43.866

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Microchip USA

USA . 1,948 parts In-Stock

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$50.176

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$50.176

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MKK Technologies

India . 1,610 parts In-Stock

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$91.652

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DigiPath Technology Company

USA . 1,610 parts In-Stock

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$91.652

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$91.652

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Component Stockers USA

USA . 364 parts In-Stock

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$190.000

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QUARKTWIN TECHNOLOGY LTD

USA . 24,663 parts In-Stock

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Corphita

USA . 4,946 parts In-Stock

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iodParts Technologies Inc.

India . 2,500 parts In-Stock

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2,500

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Eastek

USA . 1,664 parts In-Stock

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$13.500

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1,664

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$13.500

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Parana Technologies

USA . 1,184 parts In-Stock

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$58.276

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$58.276

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Metaverse IC Inc.

Canada . 1,080 parts In-Stock

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1,080

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Overview

Unleash the power of innovation with the STM32L4R5AGI6 from STMicroelectronics, a microcontroller designed for excellence. With its ultra-low power consumption and robust performance, it’s perfect for smart devices, industrial automation, and IoT applications. Trust in STMicroelectronics' legacy of quality and innovation to provide reliable solutions that enhance your projects, streamline processes, and drive efficiency. Elevate your designs with unparalleled flexibility and connectivity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures robustness and reliability, making the microcontroller suitable for diverse applications.

Surface Mount: YES

Surface mount technology allows for a compact design and ease of integration into modern electronics.

Maximum Supply Voltage: 1.4 V

A low maximum supply voltage makes this microcontroller ideal for low-power applications, extending battery life.

Address Bus Width: 26

A wide address bus width enables efficient memory addressing, supporting large amounts of RAM and ROM.

Package Shape: SQUARE

Square packaging enhances layout flexibility on circuit boards, optimizing space usage.

Bit Size: 32

A 32-bit architecture allows for advanced processing capabilities and better performance in complex applications.

DAC Channels: YES

Integrated DAC channels facilitate digital-to-analog conversion, valuable for audio and signal applications.

No. of Terminals: 169

A high terminal count provides ample connection options for peripherals, enhancing functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Thin profile and fine pitch design contribute to a compact footprint, suitable for space-constrained designs.

Minimum Supply Voltage: 1.14 V

A lower minimum supply voltage supports a wider range of power-efficient designs.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range makes this microcontroller suitable for use in extreme conditions.

ADC Channels: YES

Integrated ADC channels enable real-time data acquisition from analog sensors, aiding in monitoring applications.

DMA Channels: YES

DMA channels enhance data handling capabilities, allowing efficient data transfer without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates better thermal management and easy layout for circuit designs.

ROM Words: 1048576

A large ROM capacity allows for extensive program storage, crucial for complex applications.

Maximum Seated Height: 0.6 mm

A low seated height is beneficial for ultra-thin devices, aligning with current trends in miniaturization.

Digital To Analog Converters: 2-Ch 12-Bit

High-resolution DACs allow for precise signal generation, enhancing audio or control applications.

Width: 7 mm

Compact width supports space-efficient designs, fitting well in dense electronics.

External Data Bus Width: 16

A 16-bit external data bus allows for efficient data transfer, improving overall system performance.

Peripherals: BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

A rich set of peripherals increases versatility, allowing integration into a variety of applications.

Maximum Clock Frequency: 48 MHz

A high clock frequency ensures fast processing speed, beneficial for performance-critical applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller ensures durability and reliability under harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and efficiency, making the microcontroller suitable for a range of tasks.

RAM Bytes: 655360

Ample RAM supports running complex applications and multitasking efficiently.

Technology: CMOS

CMOS technology ensures low power consumption and high integration density, vital for modern electronics.

Terminal Form: BALL

Ball terminal form allows for effective heat dissipation and better connection reliability.

Analog To Digital Converters: 16-Ch 12-Bit

High-channel count ADCs meet the demands of sophisticated sensor applications, including data acquisition.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V enhances energy efficiency, ideal for battery-operated devices.

PWM Channels: YES

Integrated PWM channels allow for precise control of motors and other analog devices.

Connectivity: CAN, I2C(4), SAI(2), SPI(5), UART(3), USART(3), USB

Versatile connectivity options ensure compatibility with a wide range of devices and communication standards.

ROM Programmability: FLASH

Flash programmability allows for easy updates and firmware changes, enhancing product longevity.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables denser PCB designs, accommodating more features in compact spaces.

Speed: 120 rpm

Ideal for applications that require rotary speed control, making this microcontroller suitable for robotics and automation.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports compatibility with various applications while facilitating ample programs.

No. of I/O Lines: 140

A high number of I/O lines enhances versatility, allowing for multiple sensor and actuator connections.

Technical Specifications

Microcontrollers STM32L4R5AGI6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES IN THE RANGE OF 1.71V TO 3.6V

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B169

Length:

7 mm

No. of I/O Lines:

140

No. of Terminals:

169

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

655360

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.4 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), SAI(2), SPI(5), UART(3), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L4R5AGI6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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