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STM32L4Q5VGY6TR

STMicroelectronics

STM32L4Q5VGY6TR by STMicroelectronics

STM32L4Q5VGY6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. Ideal for low-power applications, it supports various connectivity options like CAN and I2C. Its compact design makes it suitable for space-constrained devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,348 parts In-Stock

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Digiode

USA . 2,726 parts In-Stock

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2,726

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Anansix

USA . 1,332 parts In-Stock

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1,332

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Distributors (Availability)

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AZTECH Wire

Italy . 729 parts In-Stock

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$14.000

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729

$14.000

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Microchip USA

USA . 9,175 parts In-Stock

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$26.062

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$26.062

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IDEA Electronic Components Group

UK . 1,048 parts In-Stock

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$34.821

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$31.339

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1,048

$34.821

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$31.339

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MKK Technologies

India . 2,352 parts In-Stock

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$65.479

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2,352

$65.479

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DigiPath Technology Company

USA . 2,352 parts In-Stock

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$65.479

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2,352

$65.479

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Component Stockers USA

USA . 736 parts In-Stock

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$130.390

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736

$130.390

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Vigor

Singapore . 3,873 parts In-Stock

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Corphita

USA . 583 parts In-Stock

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583

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Parana Technologies

USA . 199 parts In-Stock

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$41.634

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Overview

Unlock the potential of your next project with the STM32L4Q5VGY6TR microcontroller from STMicroelectronics. Renowned for its superior quality and innovative design, this powerhouse combines low power consumption with exceptional performance, making it ideal for IoT devices, wearables, and smart home applications. With seamless connectivity options and robust functionalities, you gain a competitive edge, ensuring reliability and efficiency in every application. Elevate your designs—experience the value STMicroelectronics delivers!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and resistance to environmental factors, making it suitable for various applications.

Integrated Cache: YES

The presence of integrated cache enhances the processing speed and efficiency, leading to better performance in data handling.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, ideal for modern electronic products.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is compatible with low-power applications, optimizing energy consumption.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for efficient handling of data and simple integration into various systems.

Address Bus Width: 5

The 5-bit address bus width enables flexible memory mapping, supporting a variety of memory configurations.

Package Shape: RECTANGULAR

The rectangular package shape is advantageous for efficient PCB layout and space optimization.

Bit Size: 32

A 32-bit architecture allows for greater data processing capabilities and access to a larger range of values.

DAC Channels: YES

Having DAC channels means this microcontroller can directly produce analog signals, beneficial for control systems.

No. of Terminals: 100

With 100 terminals, this microcontroller supports extensive connectivity options and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This fine pitch package style is ideal for high-density applications where space is a concern.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage enhances the microcontroller's ability to operate in battery-powered or low-energy systems.

Maximum Operating Temperature: 85 °C

Operational stability at high temperatures makes this microcontroller suitable for industrial and automotive applications.

CPU Family: CORTEX-M4

The powerful Cortex-M4 core provides advanced performance with low power consumption, ideal for complex applications.

No. of External Interrupts: 16

Supports a high number of external interrupts, allowing for efficient event-driven programming.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme low temperatures makes it reliable for outdoor and harsh environmental conditions.

ADC Channels: YES

The built-in ADC channels enable precise digital representations of analog signals, essential for sensor interfaces.

DMA Channels: YES

Direct Memory Access support improves data transfer speeds and system efficiency, reducing CPU load.

Terminal Position: BOTTOM

Bottom terminal position can enhance solderability and thermal management in PCB designs.

ROM Words: 1048576

A significant volume of ROM words allows for storing complex programs and ensuring extensive functionality.

Maximum Seated Height: 0.58 mm

A low seated height is advantageous for compact designs, helping maintain a slim profile in devices.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual DAC channels with high resolution provide flexibility in generating analog output signals for various applications.

Width: 4.437 mm

A narrow width supports denser layouts on PCB, facilitating more compact device designs.

Boundary Scan: YES

Boundary Scan capability allows for easier testing and debugging of the circuit board, enhancing reliability.

External Data Bus Width: 16

A 16-bit external data bus width provides good performance while interfacing with other components.

Peripherals: BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

A comprehensive set of peripherals enhances the versatility and functionality of the microcontroller for various applications.

Maximum Clock Frequency: 48 MHz

The operational clock frequency enables efficient processing of tasks, maintaining a balance between performance and power consumption.

Length: 4.456 mm

A compact length helps in designing small and efficient electronics, meeting the demands for miniaturization.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it provides performance efficiency and lower power consumption, which is advantageous for embedded systems.

No. of Timers: 14

Having multiple timers allows for advanced time-based operations, enhancing functionality in various applications.

RAM Bytes: 327808

Ample RAM storage supports complex data handling and processing needs in sophisticated applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, beneficial for battery-operated devices.

Terminal Form: BALL

Ball terminal form allows for efficient layout design and better soldering characteristics in surface mount technology.

Analog To Digital Convertors: 16-Ch 12-Bit

High channel count ADCs enable integration with multiple sensors, facilitating diverse application in data acquisition.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA supports power-hungry applications without compromising performance.

Nominal Supply Voltage: 2 V

The nominal supply voltage makes it suitable for low power systems while ensuring consistent operation.

No. of DMA Channels: 14

With 14 DMA channels, this microcontroller supports efficient and fast data transfer, enhancing system performance.

No. of Serial I/Os: 7

Multiple serial I/O options facilitate connections to various peripherals, enhancing communication capabilities.

PWM Channels: YES

PWM channels enable easy control of motors and actuators, making it suitable for robotics and automation applications.

Connectivity: CAN, I2C(4), LPUART, SAI(2), SDMMC, SPI(3), UART(2), USART(3), USB

Diverse connectivity options provide flexibility and ease of integration in different communication protocols for comprehensive applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of programs post-manufacturing, enhancing usability.

Terminal Pitch: 0.4 mm

A tight terminal pitch supports compact designs and allows for higher density layouts in modern electronics.

Format: FLOATING-POINT

Floating-point format enhances computation capabilities, allowing for efficient calculations in complex applications.

Speed: 120 rpm

Operating at 120 rpm signifies efficient operation under specific conditions, ensuring effective performance in controlled applications.

Low Power Mode: YES

Low power mode contributes to energy conservation, extending battery life in portable or embedded applications.

On Chip Program ROM Width: 8

The 8-bit program ROM width allows for diverse programming capabilities within the controller, enhancing functionality.

No. of I/O Lines: 81

A high number of I/O lines supports flexible interfacing, catering to complex circuit requirements and multiple peripheral connections.

Technical Specifications

Microcontrollers STM32L4Q5VGY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

5

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B100

Length:

4.456 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

81

No. of Serial I/Os:

7

No. of Terminals:

100

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

327808

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.58 mm

Speed:

120 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

4.437 mm

Peripheral IC Type:

Connectivity:

CAN, I2C(4), LPUART, SAI(2), SDMMC, SPI(3), UART(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L4Q5VGY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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