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STM32L496ZET6TR

STMicroelectronics

STM32L496ZET6TR by STMicroelectronics

STM32L496ZET6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 1.32V, and includes 24 ADC channels. Ideal for low-power applications, it supports various connectivity options like CAN and I2C. Its compact design and industrial temperature range make it suitable for diverse embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,480 parts In-Stock

1+ parts

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8,480

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Digiode

USA . 720 parts In-Stock

1+ parts

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720

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Anansix

USA . 299 parts In-Stock

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299

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 990 parts In-Stock

1+ parts

$12.680

100+ parts

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990

$12.680

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IDEA Electronic Components Group

UK . 1,478 parts In-Stock

1+ parts

$16.565

100+ parts

-

1k+ parts

$14.908

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1,478

$16.565

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$14.908

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MKK Technologies

India . 1,071 parts In-Stock

1+ parts

$31.149

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1,071

$31.149

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DigiPath Technology Company

USA . 1,071 parts In-Stock

1+ parts

$31.149

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1,071

$31.149

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Corphita

USA . 880 parts In-Stock

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880

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Parana Technologies

USA . 582 parts In-Stock

1+ parts

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$19.806

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582

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$19.806

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Overview

Elevate your next project with the STM32L496ZET6TR microcontroller from STMicroelectronics, where innovation meets reliability. Designed for low-power yet high-performance applications, this versatile chip excels in diverse fields such as IoT, medical devices, and automation. Enjoy enhanced connectivity and seamless integration, backed by ST’s renowned quality and support, empowering you to create smarter solutions with ease and efficiency. Unlock your product's potential today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction offers durability and protection, making it suitable for varied environments.

Integrated Cache: YES

The integration of cache improves processing speed and efficiency, enhancing overall performance.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronic assemblies.

Maximum Supply Voltage: 1.32 V

A low maximum supply voltage ensures compatibility with energy-efficient power sources.

On Chip Data RAM Width: 8

An 8-bit data RAM width helps in efficient data processing for specific applications.

Address Bus Width: 25

The wide address bus supports a larger memory space, accommodating complex applications.

Package Shape: SQUARE

The square shape allows for efficient use of PCB space, fitting well in compact designs.

Bit Size: 32

A 32-bit architecture provides powerful computation capabilities suitable for advanced applications.

DAC Channels: YES

The presence of DAC channels enables precise digital-to-analog conversions, vital for audio and control applications.

No. of Terminals: 144

A higher number of terminals allows for extensive interfacing options, enhancing flexibility in design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style enables tighter layouts and improved thermal performance in confined spaces.

Minimum Supply Voltage: 1.08 V

Operating at a low minimum supply voltage increases the versatility for battery-powered applications.

Maximum Operating Temperature: 85 °C

Operating at high temperatures suits industries like automotive and industrial automation.

CPU Family: CORTEX-M4

Cortex-M4 supports advanced DSP applications, making it ideal for audio and signal processing.

No. of External Interrupts: 16

Multiple external interrupts provide the flexibility to respond to various asynchronous events swiftly.

Minimum Operating Temperature: -40 °C

The wide temperature range allows reliability in harsh environments, particularly in industrial applications.

ADC Channels: YES

The inclusion of ADC channels supports direct analog signal processing, essential for a variety of sensors.

DMA Channels: YES

DMA support enhances data transfer efficiency, improving throughput by offloading CPU tasks.

Terminal Position: QUAD

Quad terminal positioning optimizes PCB space and enhances soldering efficiency during production.

ROM Words: 524288

A large ROM capacity supports extensive firmware and applications, ensuring functionality and future upgrades.

Maximum Seated Height: 1.6 mm

The low profile design improves space efficiency on PCBs, allowing for sleeker overall device designs.

Digital To Analog Convertors: 2-Ch 12-Bit

12-bit resolution in DACs provides high-quality analog output, suitable for audio and communication applications.

RAM Words: 81920

A substantial amount of RAM enables handling of complex computations and applications smoothly.

Width: 20 mm

The compact width supports versatile applications, fitting well into space-sensitive designs.

Boundary Scan: YES

Boundary scan capability allows for simplified debugging and testing of complex boards.

External Data Bus Width: 16

A 16-bit data bus width allows for efficient communication with other peripherals and memory.

Peripherals: BOR, COMPARATOR(2), DMA(14), LCD, PWM(2), RTC, TIMER(14), WDT(2)

A rich set of peripherals provides diverse functionalities, making this microcontroller versatile for various applications.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz ensures capable performance for real-time applications.

Length: 20 mm

The compact length allows for integration into small form factor devices or systems.

Temperature Grade: INDUSTRIAL

Industrial-grade components assure reliability and durability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from efficient instruction execution, resulting in higher performance.

No. of Timers: 14

Multiple timers allow managing different time-sensitive tasks efficiently and accurately.

RAM Bytes: 327680

A generous amount of RAM in bytes supports multiple concurrent tasks and complex application data.

Technology: CMOS

CMOS technology provides lower power consumption and higher density, enhancing battery life in portable devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, improving manufacturing efficiency.

Analog To Digital Convertors: 24-Ch 12-Bit

The high number of ADC channels and 12-bit resolution allow for multiple sensor integrations with considerable accuracy.

Nominal Supply Voltage: 1.1 V

A low nominal supply voltage is beneficial for battery-operated devices, ensuring longer battery life.

No. of DMA Channels: 14

With 14 DMA channels, data transfer can occur independently of the CPU, optimizing resource management.

No. of Serial I/Os: 8

Eight serial I/O options provide ample interfacing capabilities for various communication needs.

PWM Channels: YES

PWM channels enable precise control in applications like motor control or LED dimming, enhancing versatility.

Connectivity: CAN(2), I2C(4), LPUART, MMC, SAI(2), SD, SPI(3), UART(2), USART(3), USB

Diverse connectivity options ensure compatibility with numerous peripherals and systems, enhancing adaptability.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, ensuring long-term usability of the microcontroller.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables compact layouts and minimizes the PCB footprint.

Format: FLOATING POINT

Floating point format supports complex calculations and numerical processing, suitable for advanced computational tasks.

Speed: 80 rpm

An operational speed of 80 rpm indicates potential suitability for motion control applications.

Low Power Mode: YES

Low power mode preserves battery life in portable applications, making it an efficient choice for energy-sensitive designs.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for effective execution of control programs in resource-constrained environments.

No. of I/O Lines: 115

115 I/O lines provide extensive interfacing options, enabling complex designs and greater connectivity.

Technical Specifications

Microcontrollers STM32L496ZET6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

25

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

115

No. of Serial I/Os:

8

No. of Terminals:

144

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

327680

RAM Words:

81920

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), LPUART, MMC, SAI(2), SD, SPI(3), UART(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), LCD, PWM(2), RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L496ZET6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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