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STM32L496RGT3TR

STMicroelectronics

STM32L496RGT3TR by STMicroelectronics

STM32L496RGT3TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 48 MHz clock frequency, and 16 external interrupts. It features 2 DAC channels, 14 DMA channels, and 16 ADC channels. Ideal for industrial applications requiring low power consumption and high-performance computing capabilities.

Median Price

$10.467

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$10.467

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50

$10.467

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Vyrian

USA . 5,484 parts In-Stock

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5,484

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Digiode

USA . 4,847 parts In-Stock

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Anansix

USA . 603 parts In-Stock

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Semicontronic

India . 947 parts In-Stock

1+ parts

$1.000

100+ parts

$0.975

1k+ parts

$0.970

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947

$1.000

$0.975

$0.970

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AZTECH Wire

Italy . 602 parts In-Stock

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$8.440

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602

$8.440

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Aranea Global

USA . 1,000 parts In-Stock

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$10.258

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$9.848

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1,000

$10.258

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$9.848

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Continental Prestige Electronics

USA . 3,286 parts In-Stock

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$10.467

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$10.258

3,286

$10.467

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$10.258

Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$19.348

100+ parts

$18.380

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$18.380

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650

$19.348

$18.380

$18.380

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Ampacity Inc.

Singapore . 681 parts In-Stock

1+ parts

$29.000

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681

$29.000

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Microchip USA

USA . 3,565 parts In-Stock

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$29.167

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3,565

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Corohmni

South Africa . 44 parts In-Stock

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$40.953

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Aztec Data Supply Inc.

USA . 4,108 parts In-Stock

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$56.170

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$56.170

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IDEA Electronic Components Group

UK . 183 parts In-Stock

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$72.870

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$65.583

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183

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MKK Technologies

India . 2,208 parts In-Stock

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$137.028

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$137.028

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DigiPath Technology Company

USA . 2,208 parts In-Stock

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$137.028

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$137.028

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Perfect Parts

USA . 7,795 parts In-Stock

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7,795

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Argo Parts USA

USA . 4,887 parts In-Stock

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Corphita

USA . 3,195 parts In-Stock

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Parana Technologies

USA . 1,072 parts In-Stock

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$87.128

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1,072

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$87.128

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Overview

Discover the STM32L496RGT3TR microcontroller by STMicroelectronics, a high-quality product that offers exceptional value and benefits to customers. With advanced features like integrated cache, low power mode, and a wide range of connectivity options, this microcontroller is perfect for a variety of applications in industrial settings. Trust in the reliability and reputation of STMicroelectronics as a leading manufacturer in the industry. Upgrade your projects with the STM32L496RGT3TR and experience enhanced performance and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Integrated Cache: YES

Having integrated cache helps in improving the performance by reducing memory access time.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options.

On Chip Data RAM Width: 8

The wider data RAM width allows for faster data processing and storage.

Package Shape: SQUARE

Square packages are space-efficient and easy to mount on PCBs.

Bit Size: 32

A 32-bit architecture provides better performance and handling of large data sets.

DAC Channels: YES

Digital-to-analog converters enable the device to interface with analog components.

No. of Terminals: 64

Having a sufficient number of terminals allows for versatile connectivity options.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in various environments.

CPU Family: CORTEX-M4

Being a member of the Cortex-M4 family means that the product offers high performance and efficiency.

No. of External Interrupts: 16

Having multiple external interrupts allows for efficient handling of external events.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes the product suitable for use in extreme cold conditions.

ADC Channels: YES

Analog-to-digital converters enable the device to convert analog signals to digital data for processing.

DMA Channels: YES

Direct Memory Access channels improve data transfer speeds and reduce CPU workload.

Terminal Position: QUAD

Quad terminal position provides stability and ease of connection.

ROM Words: 1048576

Having a large ROM capacity allows for storing a significant amount of program data.

Maximum Seated Height: 1.6 mm

The low seated height makes the product suitable for compact designs where space is limited.

Digital To Analog Convertors: 2-Ch 12-Bit

Having 2-channel 12-bit DACs allows for accurate analog signal generation.

RAM Words: 163840

Having a high RAM word count enables efficient data processing and storage.

Width: 10 mm

The compact width of 10mm allows for space-efficient design and integration in smaller devices.

Boundary Scan: YES

Boundary scan capability helps in testing and diagnosing PCB assemblies for faults.

Peripherals: BOR, COMPARATOR(2), DMA(14), LCD, PWM(2), RTC, TIMER(14), WDT(2)

The wide range of peripherals provides flexibility and functionality for various applications.

Maximum Clock Frequency: 48 MHz

The high clock frequency allows for fast processing and response times.

Length: 10 mm

The compact length of 10mm allows for space-efficient design and integration in smaller devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades means the product can withstand harsh operating environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Having a RISC architecture enhances the product's performance and efficiency.

No. of Timers: 14

Multiple timers allow for precise timing control in various applications.

RAM Bytes: 327680

Having a high RAM byte count allows for efficient data processing and storage.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and heat dissipation.

Analog To Digital Convertors: 16-Ch 12-Bit

Having 16-channel 12-bit ADCs enables the device to process multiple analog signals simultaneously.

Nominal Supply Voltage: 1.1 V

The stable nominal supply voltage ensures consistent performance and power efficiency.

No. of DMA Channels: 14

Having 14 DMA channels allows for efficient data transfer and processing.

No. of Serial I/Os: 8

Having 8 serial I/Os enables communication with multiple external devices.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of analog signals.

Connectivity: CAN(2), I2C(4), LPUART, MMC, SAI(2), SD, SPI(3), UART(2), USART(3), USB

The wide range of connectivity options makes the product versatile for various communication protocols.

ROM Programmability: FLASH

Flash ROM programmability enables easy reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Having a small terminal pitch allows for high-density PCB design and compact product size.

Format: FLOATING POINT

Support for floating-point format allows for precise mathematical calculations.

Speed: 80 rpm

The high speed of 80 rpm enables fast data processing and response times.

Low Power Mode: YES

Low power mode helps in reducing power consumption during idle or low activity periods.

On Chip Program ROM Width: 8

The wider on-chip program ROM width allows for storing larger program codes.

No. of I/O Lines: 52

Having 52 I/O lines provides flexibility for interfacing with external components and peripherals.

Technical Specifications

Microcontrollers STM32L496RGT3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Serial I/Os:

8

No. of Terminals:

64

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

327680

RAM Words:

163840

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), LPUART, MMC, SAI(2), SD, SPI(3), UART(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), LCD, PWM(2), RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L496RGT3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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