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STM32L476ZGT6TR

STMicroelectronics

STM32L476ZGT6TR by STMicroelectronics

STM32L476ZGT6TR by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at a max frequency of 48 MHz. It features 24-Ch 12-Bit ADC channels and offers connectivity options like CAN, I2C(3), SPI(4), UART(3), USB. Ideal for industrial applications requiring low power consumption and high-performance computing capabilities.

Median Price

$4.527

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.527

10k+ parts

-

500

-

-

$4.527

-

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.527

10k+ parts

-

500

-

-

$4.527

-

Chip1Stop

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.521

10k+ parts

-

500

-

-

$4.521

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,058 parts In-Stock

1+ parts

$10.811

100+ parts

-

1k+ parts

-

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2,058

$10.811

-

-

-

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$11.430

100+ parts

-

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-

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600

$11.430

-

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J2 Sourcing AB

Sweden . 67,988 parts In-Stock

1+ parts

-

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67,988

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Vyrian

USA . 13,331 parts In-Stock

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13,331

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Chip Stock

USA . 7,090 parts In-Stock

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7,090

-

-

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IBS Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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$7.812

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2,500

-

-

$7.812

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Anansix

USA . 2,482 parts In-Stock

1+ parts

-

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2,482

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 591 parts In-Stock

1+ parts

$3.840

100+ parts

-

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-

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-

591

$3.840

-

-

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Semicontronic

India . 480 parts In-Stock

1+ parts

$3.840

100+ parts

$3.744

1k+ parts

$3.725

10k+ parts

-

480

$3.840

$3.744

$3.725

-

Continental Prestige Electronics

USA . 240 parts In-Stock

1+ parts

$10.174

100+ parts

-

1k+ parts

-

10k+ parts

$9.971

240

$10.174

-

-

$9.971

Corphita

USA . 4,823 parts In-Stock

1+ parts

$10.242

100+ parts

-

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10k+ parts

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4,823

$10.242

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Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

$11.430

100+ parts

$10.858

1k+ parts

-

10k+ parts

$10.173

120

$11.430

$10.858

-

$10.173

Vigor

Singapore . 1,679 parts In-Stock

1+ parts

$13.700

100+ parts

-

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1,679

$13.700

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Corohmni

South Africa . 87 parts In-Stock

1+ parts

$45.169

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87

$45.169

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IDEA Electronic Components Group

UK . 2,135 parts In-Stock

1+ parts

$45.766

100+ parts

-

1k+ parts

$41.190

10k+ parts

-

2,135

$45.766

-

$41.190

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$53.259

100+ parts

$50.596

1k+ parts

$50.596

10k+ parts

-

500

$53.259

$50.596

$50.596

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Aztec Data Supply Inc.

USA . 109 parts In-Stock

1+ parts

$62.250

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109

$62.250

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MKK Technologies

India . 2,209 parts In-Stock

1+ parts

$86.061

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2,209

$86.061

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DigiPath Technology Company

USA . 2,209 parts In-Stock

1+ parts

$86.061

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2,209

$86.061

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QUARKTWIN TECHNOLOGY LTD

USA . 15,100 parts In-Stock

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15,100

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Lixinc

USA . 7,781 parts In-Stock

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7,781

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Perfect Parts

USA . 6,160 parts In-Stock

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Eastek

USA . 1,000 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 500 parts In-Stock

1+ parts

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500

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Argo Parts USA

USA . 352 parts In-Stock

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352

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Parana Technologies

USA . 177 parts In-Stock

1+ parts

-

100+ parts

$54.721

1k+ parts

-

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177

-

$54.721

-

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Overview

Unleash the power of cutting-edge technology with the high-quality STM32L476ZGT6TR microcontroller by STMicroelectronics. Designed with precision and expertise, this product offers unmatched value and benefits to customers seeking top-notch performance in a compact package. With a range of applications in various industries, this microcontroller stands out for its versatility, efficiency, and reliability. Elevate your projects to new heights with the STM32L476ZGT6TR and experience the advantage of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Surface Mount: YES

Easy to integrate into printed circuit boards for streamlined manufacturing processes.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power input while ensuring safe operation.

On Chip Data RAM Width: 8

Ample on-chip data RAM for efficient data processing.

Address Bus Width: 26

Wide address bus width allows for accessing a large memory space.

Package Shape: SQUARE

Space-efficient package shape for compact designs.

Bit Size: 32

32-bit architecture for high-performance computing capabilities.

DAC Channels: YES

Integrated DAC channels for precise analog output control.

No. of Terminals: 144

Sufficient number of terminals for connecting peripherals and external components.

Minimum Supply Voltage: 1.71 V

Supports low power operation with a minimum supply voltage requirement.

CPU Family: CORTEX-M4

Utilizes the efficient Cortex-M4 architecture for high performance and low power consumption.

No. of External Interrupts: 16

Multiple external interrupts for handling time-sensitive events efficiently.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme low-temperature environments.

ADC Channels: YES

Built-in ADC channels for accurate analog signal conversion.

DMA Channels: YES

Supports DMA channels for efficient data transfer without CPU intervention.

Terminal Position: QUAD

Quad terminal position for easy handling and connection.

ROM Words: 1048576

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low-profile design for space-constrained applications.

Digital To Analog Convertors: 2 Ch 12-Bit

Dual 12-bit DACs for precision analog output generation.

RAM Words: 65536

Sufficient RAM capacity for data storage and manipulation.

Width: 20 mm

Compact width for fitting into small electronic devices.

Boundary Scan: YES

Boundary scan support for efficient debugging and testing.

External Data Bus Width: 16

Wide external data bus width for fast data transfer.

Peripherals: BOR, COMPARATOR(2), LCD, RTC, TIMER(14), WDT(2)

Variety of peripherals including comparators, LCD interface, real-time clock, timers, and watchdog timer for enhanced functionality.

Maximum Clock Frequency: 48 MHz

High clock frequency for fast processing and response times.

Length: 20 mm

Optimal length for a balanced form factor.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller design for efficient processing and power consumption.

No. of Timers: 17

Multiple timers for time-sensitive operations and scheduling.

RAM Bytes: 131072

Large RAM capacity in bytes for data storage and manipulation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and connection.

Analog To Digital Convertors: 24-Ch 12-Bit

24-channel 12-bit ADCs for accurate analog signal conversion.

Nominal Supply Voltage: 1.8 V

Nominal supply voltage for stable and efficient operation.

No. of DMA Channels: 14

Multiple DMA channels for parallel data transfers and efficient memory access.

PWM Channels: YES

Supports PWM channels for precise control of motor speed and brightness.

Connectivity: CAN, I2C(3), SAI(2), SPI(4), UART(3), USART(3), USB

Multiple connectivity options including CAN, I2C, SPI, UART, and USB for versatile communication interfaces.

ROM Programmability: FLASH

Programmable flash ROM for flexible and easy firmware updates.

Terminal Pitch: 0.5 mm

Fine pitch terminal spacing for compact PCB layout and design.

Format: FLOATING POINT

Supports floating-point calculations for precision in mathematical operations.

Speed: 80 rpm

Operates at a speed of 80 rpm for efficient processing of tasks.

Low Power Mode: YES

Includes low power mode for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 8

Program ROM width of 8 for storing instructions and code efficiently on the chip.

No. of I/O Lines: 114

Abundant I/O lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers STM32L476ZGT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

114

No. of Terminals:

144

No. of Timers:

17

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.86SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

RAM Words:

65536

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), SAI(2), SPI(4), UART(3), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), LCD, RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32L476ZGT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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